BE566141A - - Google Patents

Info

Publication number
BE566141A
BE566141A BE566141DA BE566141A BE 566141 A BE566141 A BE 566141A BE 566141D A BE566141D A BE 566141DA BE 566141 A BE566141 A BE 566141A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE566141A publication Critical patent/BE566141A/xx
Priority claimed from US642743A external-priority patent/US2953693A/en
Priority claimed from US649038A external-priority patent/US3141119A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
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    • H01L2224/29101Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L2224/291Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/29138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/8319Arrangement of the layer connectors prior to mounting
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    • H01L2924/01049Indium [In]
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
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    • H01L2924/1203Rectifying Diode
    • H01L2924/12036PN diode
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    • H01L2924/1901Structure
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    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
  • Thyristors (AREA)
BE566141D 1957-02-27 BE566141A (en:Method)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US642743A US2953693A (en) 1957-02-27 1957-02-27 Semiconductor diode
US649038A US3141119A (en) 1957-03-28 1957-03-28 Hyperconductive transistor switches

Publications (1)

Publication Number Publication Date
BE566141A true BE566141A (en:Method) 1900-01-01

Family

ID=27094103

Family Applications (2)

Application Number Title Priority Date Filing Date
BE566141D BE566141A (en:Method) 1957-02-27
BE565109D BE565109A (en:Method) 1957-02-27

Family Applications After (1)

Application Number Title Priority Date Filing Date
BE565109D BE565109A (en:Method) 1957-02-27

Country Status (5)

Country Link
BE (2) BE565109A (en:Method)
CH (2) CH369215A (en:Method)
DE (1) DE1210088B (en:Method)
FR (1) FR1205271A (en:Method)
GB (1) GB886725A (en:Method)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL131695C (en:Method) * 1960-07-19
DE1639311C2 (de) * 1968-03-08 1974-08-15 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Kontaktieren einer Halbleiteranordnung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL84061C (en:Method) * 1948-06-26

Also Published As

Publication number Publication date
CH369828A (de) 1963-06-15
FR1205271A (fr) 1960-02-02
BE565109A (en:Method) 1900-01-01
DE1210088B (de) 1966-02-03
CH369215A (de) 1963-05-15
GB886725A (en) 1962-01-10

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