BE565274A - - Google Patents

Info

Publication number
BE565274A
BE565274A BE565274DA BE565274A BE 565274 A BE565274 A BE 565274A BE 565274D A BE565274D A BE 565274DA BE 565274 A BE565274 A BE 565274A
Authority
BE
Belgium
Prior art keywords
base
sealed manner
cover
welding
crystal
Prior art date
Application number
Other languages
English (en)
French (fr)
Publication of BE565274A publication Critical patent/BE565274A/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/06Containers; Seals characterised by the material of the container or its electrical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
BE565274D BE565274A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE565274T

Publications (1)

Publication Number Publication Date
BE565274A true BE565274A (enrdf_load_stackoverflow)

Family

ID=3872904

Family Applications (1)

Application Number Title Priority Date Filing Date
BE565274D BE565274A (enrdf_load_stackoverflow)

Country Status (1)

Country Link
BE (1) BE565274A (enrdf_load_stackoverflow)

Similar Documents

Publication Publication Date Title
FR2556714A1 (fr) Feuille de soudure pour la liaison sans tension de corps de matiere ceramique avec un metal
JP5421915B2 (ja) Au−Ga−In系ろう材
JP2022506217A (ja) 混合合金はんだペースト、その製造方法、およびはんだ付け方法
BE565274A (enrdf_load_stackoverflow)
FR2555084A1 (fr) Procede de soudure d'au moins un fil d'aluminium sur une piece en cuivre
US3036139A (en) Brazing alloy and brazing of thermoelectric elements therewith
EP2131636B1 (fr) Dispositif de brasage comportant un creuset avec surface réalisée en un matériau neutre par rapport à un métal d'apport pour le brasage
US2970248A (en) Pin material for glass seal semiconductor rectifier
EP2171802B1 (fr) Assemblage soude d'un cable et d'un support
FR2564827A1 (fr) Procede pour braser une electrode metallique sur un element en ceramique en carbure de silicium electriquement conducteur et element en ceramique en carbure de silicium realise selon le procede
FR2521770A1 (fr) Coupe-circuit thermique pour appareils a chauffage electrique
FR2512269A1 (fr) Fusible electrique et son element fusible incorpore
JP4600672B2 (ja) Au−Sn合金はんだペーストを用いた基板と素子の接合方法
BE511039A (enrdf_load_stackoverflow)
FR2946794A1 (fr) Liaison fusible
JP2000076971A (ja) 合金型温度ヒュ−ズ
FR2466860A1 (fr) Procede de soudure d'un cristal semi-conducteur sur un support metallique et dispositif semi-conducteur comportant un cristal de silicium et un support nickele reunis par ce procede
EP0493194B1 (fr) Electrode de soudage par points
CH138065A (fr) Métal d'apport pour la soudure de l'aluminium et procédé pour sa préparation.
JP4946419B2 (ja) 温度ヒューズおよびその製造方法
BE466422A (fr) Procédé de soudure en atmosphère protectrice
FR2589379A1 (fr) Composition de soudure ou de brasure, notamment pour l'assemblage d'elements de zinc
BE487253A (enrdf_load_stackoverflow)
JPS6032975B2 (ja) 半導体装置
BE567336A (enrdf_load_stackoverflow)