Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49147—Assembling terminal to base
  • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• Power Engineering (AREA)
• Forging (AREA)
• Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
• Apparatuses And Processes For Manufacturing Resistors (AREA)
• Ceramic Products (AREA)
• Mounting, Exchange, And Manufacturing Of Dies (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=3844324

Family Applications (1)

Country Status (6)

Families Citing this family (5)

Family Cites Families (7)

• 0
  • BE BE559757D patent/BE559757A/xx unknown
  • NL NL229943D patent/NL229943A/xx unknown
  • NL NL110438D patent/NL110438C/xx active
• 1958
  • 1958-07-24 US US750776A patent/US3032862A/en not_active Expired - Lifetime
  • 1958-07-29 GB GB24401/58A patent/GB883207A/en not_active Expired
  • 1958-07-29 DE DEN15429A patent/DE1106873B/de active Pending
  • 1958-07-30 FR FR1207109D patent/FR1207109A/fr not_active Expired

Also Published As

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