BE550947A - - Google Patents

Info

Publication number
BE550947A
BE550947A BE550947DA BE550947A BE 550947 A BE550947 A BE 550947A BE 550947D A BE550947D A BE 550947DA BE 550947 A BE550947 A BE 550947A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE550947A publication Critical patent/BE550947A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
BE550947D 1955-09-12 BE550947A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB26027/55A GB824255A (en) 1955-09-12 1955-09-12 Improvements in or relating to transistors

Publications (1)

Publication Number Publication Date
BE550947A true BE550947A (xx)

Family

ID=10237196

Family Applications (1)

Application Number Title Priority Date Filing Date
BE550947D BE550947A (xx) 1955-09-12

Country Status (6)

Country Link
US (1) US2876401A (xx)
BE (1) BE550947A (xx)
DE (1) DE1068816B (xx)
FR (1) FR1156702A (xx)
GB (1) GB824255A (xx)
NL (2) NL101253C (xx)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3142791A (en) * 1955-12-07 1964-07-28 Motorola Inc Transistor and housing assembly
GB831295A (en) * 1957-08-08 1960-03-30 Pye Ltd Improvements in or relating to semiconductor devices
US3204327A (en) * 1957-10-28 1965-09-07 Motorola Inc Method for making semiconductor devices employing a hollow, slotted cylindrical jig and vertical mounting posts
DE1098618B (de) * 1958-07-25 1961-02-02 Telefunken Gmbh Gehaeuse fuer Halbleiteranordnungen kleinster Abmessungen
BE584431A (xx) * 1959-02-09
NL121714C (xx) * 1959-12-14
NL258551A (xx) * 1959-12-16
GB1001269A (xx) * 1960-09-30 1900-01-01
DE1246888C2 (de) * 1960-11-24 1975-10-23 Semikron, Gesellschaft für Gleichrichterbau und Elektronik m.b.H., 8500 Nürnberg Verfahren zum herstellen von gleichrichteranordnungen in brueckenschaltung fuer kleine stromstaerken
NL125803C (xx) * 1961-01-16
US3381080A (en) * 1962-07-02 1968-04-30 Westinghouse Electric Corp Hermetically sealed semiconductor device
US3334279A (en) * 1962-07-30 1967-08-01 Texas Instruments Inc Diode contact arrangement
DE1283397B (de) * 1963-05-27 1968-11-21 Siemens Ag Transistoranordnung
DE1271839B (de) * 1963-06-15 1968-07-04 Siemens Ag Gehaeuse fuer ein Halbleiter-Bauelement in Scheibenzellenbauweise
NL302170A (xx) * 1963-06-15
US3355635A (en) * 1964-05-28 1967-11-28 Rca Corp Semiconductor device assemblage having two convex tabs
US3325704A (en) * 1964-07-31 1967-06-13 Texas Instruments Inc High frequency coaxial transistor package
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices
DE19856332A1 (de) * 1998-12-07 2000-06-15 Bosch Gmbh Robert Gehäuse für eletronisches Bauelement
MA36816B1 (fr) 2014-03-11 2016-05-31 Univ Hassan 1Er Settat Traitement ecologique des eaux turbides par deux biofloculents extraitraits du cladode de cactus opuntia ficus indica
EP3449202B1 (en) 2016-04-25 2023-08-23 BAE Systems PLC Data processing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE490647A (xx) * 1948-08-14
NL94441C (xx) * 1951-09-15
NL182212B (nl) * 1952-10-22 Nemag Nv Grijper.
US2751528A (en) * 1954-12-01 1956-06-19 Gen Electric Rectifier cell mounting
BE543951A (xx) * 1954-12-27

Also Published As

Publication number Publication date
NL101253C (xx)
US2876401A (en) 1959-03-03
DE1068816B (xx) 1959-11-12
FR1156702A (fr) 1958-05-20
GB824255A (en) 1959-11-25
NL210518A (xx)

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