H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/02—Containers; Seals
H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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Engineering & Computer Science
(AREA)
Computer Hardware Design
(AREA)
Microelectronics & Electronic Packaging
(AREA)
Power Engineering
(AREA)
Physics & Mathematics
(AREA)
Condensed Matter Physics & Semiconductors
(AREA)
General Physics & Mathematics
(AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices
(AREA)
Procede d'assemblage de pieces d'un boitier metallique en materiau a teneur en cuivre, notamment pour l'encapsulation de circuits hybrides en boitier metallique.