BE533745A - - Google Patents

Info

Publication number
BE533745A
BE533745A BE533745DA BE533745A BE 533745 A BE533745 A BE 533745A BE 533745D A BE533745D A BE 533745DA BE 533745 A BE533745 A BE 533745A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE533745A publication Critical patent/BE533745A/xx
Priority claimed from US463271A external-priority patent/US2825014A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4918Disposition being disposed on at least two different sides of the body, e.g. dual array

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
BE533745D 1953-11-30 BE533745A (it)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL329185X 1953-11-30
US463271A US2825014A (en) 1953-11-30 1954-10-19 Semi-conductor device
US715649A US2981876A (en) 1953-11-30 1958-02-17 Semiconductor device

Publications (1)

Publication Number Publication Date
BE533745A true BE533745A (it)

Family

ID=32397774

Family Applications (1)

Application Number Title Priority Date Filing Date
BE533745D BE533745A (it) 1953-11-30

Country Status (6)

Country Link
US (1) US2981876A (it)
BE (1) BE533745A (it)
CH (1) CH329185A (it)
DE (1) DE1010648B (it)
FR (1) FR1114171A (it)
NL (1) NL183243C (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1156173B (de) * 1956-07-11 1963-10-24 Bosch Gmbh Robert Leistungstransistor
DE1192326B (de) * 1955-11-08 1965-05-06 Westinghouse Electric Corp Leistungsgleichrichteranordnung mit mehreren elektrisch parallelgeschalteten Halbleiterelementen

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL251229A (it) * 1959-05-05
US3196326A (en) * 1961-07-14 1965-07-20 Gen Electric Co Ltd Transistor with mounting providing efficient heat dissipation through an envelope and method of making the same
US3258661A (en) * 1962-12-17 1966-06-28 Sealed semiconductor device
US3418587A (en) * 1965-06-04 1968-12-24 American Electronic Lab High sensitivity and power signal detecting device
CA1083263A (en) * 1977-06-29 1980-08-05 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
US4375578A (en) * 1981-02-06 1983-03-01 General Dynamics, Pomona Division Semiconductor device and method of making the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2665399A (en) * 1954-01-05 Rectifier assembly
FR961851A (it) * 1947-01-06 1950-05-24
BE494845A (it) * 1949-03-31
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
US2712620A (en) * 1954-08-10 1955-07-05 Int Standard Electric Corp Blocking layer rectifier and housing therefor
US2825014A (en) * 1953-11-30 1958-02-25 Philips Corp Semi-conductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1192326B (de) * 1955-11-08 1965-05-06 Westinghouse Electric Corp Leistungsgleichrichteranordnung mit mehreren elektrisch parallelgeschalteten Halbleiterelementen
DE1156173B (de) * 1956-07-11 1963-10-24 Bosch Gmbh Robert Leistungstransistor

Also Published As

Publication number Publication date
FR1114171A (fr) 1956-04-09
CH329185A (de) 1958-04-15
NL183243C (nl)
US2981876A (en) 1961-04-25
DE1010648B (de) 1957-06-19

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