|
US2805193A
(en)
*
|
1955-07-18 |
1957-09-03 |
John F Beaver |
Bright copper plating
|
|
US2805194A
(en)
*
|
1955-07-18 |
1957-09-03 |
Dayton Bright Copper Company |
Bright copper plating
|
|
BE565994A
(US06368395-20020409-C00036.png)
*
|
1957-04-16 |
|
|
|
|
US3288690A
(en)
*
|
1962-04-16 |
1966-11-29 |
Udylite Corp |
Electrodeposition of copper from acidic baths
|
|
US3328273A
(en)
*
|
1966-08-15 |
1967-06-27 |
Udylite Corp |
Electro-deposition of copper from acidic baths
|
|
DE2039831C3
(de)
*
|
1970-06-06 |
1979-09-06 |
Schering Ag, 1000 Berlin Und 4619 Bergkamen |
Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
|
|
US4376685A
(en)
*
|
1981-06-24 |
1983-03-15 |
M&T Chemicals Inc. |
Acid copper electroplating baths containing brightening and leveling additives
|
|
AU554236B2
(en)
*
|
1983-06-10 |
1986-08-14 |
Omi International Corp. |
Electrolyte composition and process for electrodepositing copper
|
|
US6709568B2
(en)
|
2002-06-13 |
2004-03-23 |
Advanced Technology Materials, Inc. |
Method for determining concentrations of additives in acid copper electrochemical deposition baths
|
|
DE10261852B3
(de)
|
2002-12-20 |
2004-06-03 |
Atotech Deutschland Gmbh |
Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
|
|
US20050067304A1
(en)
*
|
2003-09-26 |
2005-03-31 |
King Mackenzie E. |
Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
|
|
US20050109624A1
(en)
*
|
2003-11-25 |
2005-05-26 |
Mackenzie King |
On-wafer electrochemical deposition plating metrology process and apparatus
|
|
US20050224370A1
(en)
*
|
2004-04-07 |
2005-10-13 |
Jun Liu |
Electrochemical deposition analysis system including high-stability electrode
|
|
US6984299B2
(en)
*
|
2004-04-27 |
2006-01-10 |
Advanced Technology Material, Inc. |
Methods for determining organic component concentrations in an electrolytic solution
|
|
US7435320B2
(en)
|
2004-04-30 |
2008-10-14 |
Advanced Technology Materials, Inc. |
Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
|
|
US7427346B2
(en)
*
|
2004-05-04 |
2008-09-23 |
Advanced Technology Materials, Inc. |
Electrochemical drive circuitry and method
|
|
US20070261963A1
(en)
*
|
2006-02-02 |
2007-11-15 |
Advanced Technology Materials, Inc. |
Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutions
|
|
US8691987B2
(en)
*
|
2010-09-24 |
2014-04-08 |
Andrew M. Krol |
Method of producing polymeric phenazonium compounds
|
|
CN111074306B
(zh)
*
|
2020-01-02 |
2020-10-27 |
江苏矽智半导体科技有限公司 |
用于适合超大电流密度的电镀铜柱溶液及电镀方法
|
