BE1019812A3 - GLAZING PANEL COMPRISING A FIRST GLASS SHEET, AT LEAST ONE INTERNAL ELECTRIC CIRCUIT AND A CONNECTOR. - Google Patents

Abstract

The invention relates to a glazing panel comprising: a first glass sheet (2) coated with an internal conductive circuit; a connector (6) for electrically connecting at least one electronic component (64) to the internal conducting circuit. According to the invention, such a connector comprises a first electrical insulating substrate (61) coated, at least partially, on its lower face (62), with at least one first lower conductive track (621) intended to be electrically connected to the internal conducting circuit and, at its upper face (63), at least a first upper conducting track (631) intended to be electrically connected to the electronic component, at least a first lower conducting track being electrically connected to at least one first conducting track upper via at least a first conductive element (65).

Description

Glazing panel comprising a first glass sheet, at least one internal electrical circuit and a connector.

1. Field of the invention

The field of the invention is that of glass panels comprising at least one internal conductive circuit making it possible to increase the functionalities of the glass panel.

More precisely, the invention relates to the electrical connection of at least one electronic component to an internal conducting circuit of such a glass panel.

More specifically, the invention relates to a connector for making such a connection.

2. Solutions of the prior art

Among the glass panels having internal conductive circuits (for example made from transparent conductive layers), there are single glazing panels, double glazing panels, laminated glazing panels and any other type of glazing panel.

For example, a laminated glazing panel conventionally comprises first and second sheets of glass between which is disposed one or more thermoplastic interleaves (such as Polyvinyl Butyral or PVB), the assembly being laminated.

Laminated glazing having conductive heating layers (forming internal conductive circuits) has long existed, particularly for use as automobile windshields. And there are also laminated glazings comprising an internal conductive circuit formed by thin heating filaments extending between current collecting strips (for example as shown in document FR 2709911).

Also known are laminated glass panels incorporating electronic components, such as light emitting diodes (or LEDs for "Light Emitting Diode"), for example to display information or for applications in lighting. In the context of these applications, the manufacture of a laminated glazing panel incorporating electronic components typically comprises a step of depositing a transparent conductive layer on the first glass sheet, a step of producing the conductive tracks of the internal conductive circuit. from the transparent conductive layer and a step of depositing and securing (for example by means of a conductive glue) electronic components on the conductive tracks of the internal conductive circuit. A thermoplastic interlayer is then deposited on the first sheet of glass. The laminated glazing is obtained by applying the second glass sheet to the interlayer, the assembly being laminated.

In any case, to connect the internal conductor circuit to an external electrical circuit (by external means to the glass panel) such as an external power supply, it is necessary to insert, before the lamination of the panel, a connector electrical, for example a bus bar or bus bar in English, one end extends beyond the edges of the laminated glazing.

EP 1 840 449 discloses such a laminated glass panel comprising two bus bars, each bus bar being adapted to supply power to a plurality of internal conductive tracks forming an inner conductive circuit in the conductive layer. The bus bars are deposited on the conductive layer and each bus bar comprises a plurality of electrical insulating elements arranged at regular intervals along its length so as to alternately provide the electrical connection and the electrical insulation, respectively, between a conductive strip. the bus bar and the conductive layer in selected positions.

Thus, it is possible to supply the power supply independently to several internal conductive tracks of the conductive layer.

WO2009109542 also describes such a panel in which the bus bar comprises conductive strips sandwiched between insulating strips in which windows are made in order to be able to make the electrical connection between the conductive strips and the conductive layer. Here again, it is possible to supply the power supply independently to a plurality of internal conductive tracks made from the conductive layer.

Thus, in the context of the manufacture of a glass panel of the aforementioned type incorporating electronic components, a step is implemented to produce the conductive tracks of the internal conductive circuit from the transparent conductive layer, these tracks being intended for be electrically connected to the terminals of the electronic components.

The conductive tracks are generally made in the conductive layer by etching (or ablation) by means of a laser whose beam, focused on the conductive layer, locally burns this layer and thus forms insulating lines (where the conductive layer has been burned ) whose thickness depends on the diameter of the focused laser beam at the conductive layer. Isolating line thicknesses of the order of 100 μm are typically obtained. Thus, a conductive track is constituted by a conductive layer strip delimited by two such insulating lines. The resistance of the conductive track is directly proportional to its width, which imposes, for the generally used conductive layers (eg ITO, Sn02: F, ...), conductive track widths of the order of a few mm to obtain a resistance value compatible with the targeted applications.

The electronic components generally used to be integrated in such a glass panel are in the form of SMD components (for "Surface Mounted Component" or SMD for "Surface Mount

Device "). Each connection terminal of one of these SMD electronic components must be mechanically and electrically connected to a conductive track separate from the internal conductive circuit of the panel, for example, by means of conductive glue or by tin solder.

The dimensions of the CMS components are becoming smaller. We can already find SMD electronic components whose dimensions are of the order of a few hundred pm. It is also conceivable to integrate semiconductor electronic components in the form of chips (or "die" or "chip" in English) whose dimensions are even smaller, e.g. of the order of a few tens of μτη. Thus, the terminals of such electronic components are spaced a few tens or even hundreds of microns apart.

In the case of electronic components comprising a large number of terminals (for example an RGB LED which comprises 6 connection terminals), since the width of the conducting tracks of the order of a few mm is much greater than the space between two terminals, it is not possible to connect all the terminals of these electronic components to the conductive tracks of the inner conductive circuit of the panel.

3. OBJECTIVES OF THE INVENTION The object of the invention is notably to overcome these disadvantages of the prior art.

More specifically, an object of the invention, in at least one of its embodiments, is to provide a technique for connecting electronic components to an internal conductive circuit of a glazing panel comprising a first coated glass sheet at least partially internal conductive circuit which allows to connect electronic components of smaller dimensions and in particular those comprising a large number of terminals.

Another object of the invention, in at least one of its embodiments, is to implement such a technique which makes it possible to increase the density of electrically connected electronic components in such a panel.

Another object of the invention, in at least one of its embodiments, is to obtain a connection diagram to the single internal circuit regardless of the electronic component to be connected to the internal circuit. This diagram can therefore be optimized according to the production parameters such as, for example, the tolerance of Pick and Place machines, the laser used for patteming, etc.

Another objective of the invention, in at least one of its embodiments, is to provide such a technique that makes it possible to improve the heat dissipation of the heat emitted by the electronic component.

The invention, in at least one of its embodiments, still aims to provide such a technique that is simple to implement and for a low cost.

4. Presentation of the invention

According to a particular embodiment, the invention relates to a glazing panel comprising: a first glass sheet coated with an internal conductive circuit; a connector for electrically connecting at least one electronic component to the internal conductive circuit.

According to the invention, in such a panel, the connector comprises a first electrical insulating substrate coated, at least partially, on its lower face, with at least a first lower conductive track intended to be electrically connected to the internal conductive circuit and, in its upper face, at least a first upper conductive track intended to be electrically connected with the electronic component, at least a first lower conductive track being electrically connected to at least a first upper conductive track via at least one first conductive element.

Thus, the invention is based on the use of a "printed circuit" type connector, ie which comprises an electrical insulating substrate coated on its lower and upper faces with conductive tracks that can be obtained using techniques specific to printed circuits. .

Thus, the invention, in at least one of its embodiments, makes it possible to connect electronic components to the connector in a very close manner to each other in order to increase the performances related to their density.

The printed circuit technology allows the realization of conductive circuits having conductive strips whose width may be very small, eg a few tens of microns (resolution of the chemical etching implemented), compared to those (a few mm) of the conductive strips achievable on glass sheet.

Thus, the present invention allows the connection of electronic components of smaller dimensions, and particularly those comprising a large number of terminals, to the inner conductive circuit of the first glass sheet.

Indeed, according to a preferred embodiment of the invention, the dimensions of the first lower conductive tracks of the connector are chosen to allow connection to the conductive tracks of the inner conductive circuit of the first sheet of glass, while the dimensions of the first upper conductive tracks of the connector are selected so as to allow the connection to the terminals of the electronic component.

Then, such a connector is simple and inexpensive to manufacture and implement.

Advantageously, the connector further comprises a second electrical insulating substrate coated, at least partially, in its lower face with at least one second lower conductive track intended to be electrically connected with said first track (s). (s) upper conductor (s) and in its upper face at least a second upper conductive track to be electrically connected with said electronic component, at least a second lower conductive track being electrically connected with at least a second conductive track via at least one second conductive element.

Thus, the implementation of the second insulating substrate, which can be designed removable, provides greater flexibility and flexibility in the connection between the electronic component and the internal conductive circuit. Indeed, in case of failure of an electronic component secured to the second substrate, it is sufficient to replace the second insulating substrate without having to remake the bonding of the first insulating substrate on the glass. In addition, placing electronic components that are more sensitive to ESD shocks or stresses generated by the method of producing the glazing panel (for example, rolling, lapping, and washing the glass) on the second insulating substrate makes it possible to protect these components in the extent that the second substrate is connected to the first substrate at the end of the manufacturing process. In addition, a greater flexibility is obtained because it is thus possible to use the same second insulating substrate for several types of first insulating substrates.

According to an advantageous embodiment of the invention, the insulating substrate (s) comprises (s) at least one through hole extending between its upper face and its lower face, the (s) said conductor element (s) occupying at least partially the through hole (s).

According to an implementation according to the invention, the (s) insulating substrate (s) is (are) portion (s) of printed circuit board.

Thus, the connector benefits from the advantages of printed circuit technology: low cost, high reliability, ease of production in large volumes, ...

Advantageously, the internal conducting circuit comprises at least one internal conductive track and the connector is positioned on the first sheet of glass so that the conductive (s) track (s) are connected to each other (s). ) electrically to said first (s) track (s) conductor (s) lower (s) of the connector.

Advantageously, the panel further comprises a second glass sheet disposed above the inner conductive circuit of the first glass sheet.

According to an advantageous characteristic of the invention, the glazing panel further comprises one or more thermoplastic interlayer sheets whose dimensions are substantially equal to those of the second glass sheet arranged between the first sheet of glass and the second sheet of glass. and whose position is aligned with the second glass sheet and in that the first and second glass sheets and the thermoplastic interlayer (s) form a laminated panel.

Of course, according to a variant according to the present invention, the second glass sheet of the glazing panel does not have the same dimensions as the first glass sheet and is offset with respect to the first glass sheet. Advantageously, there may be provided one or more thermoplastic interlayer sheets placed between the first glass sheet and the second glass sheet and whose dimensions make it possible to provide a space between the first sheet of glass and the second sheet of glass. glass at the peripheral portion to house the insulating substrate (s) in the glazing panel.

Furthermore, according to another variant of the invention, the (s) interlayer (s) thermoplastic (s) can be advantageously replaced by a UV adhesive that polymerizes under the action of ultraviolet.

Advantageously, the electronic component is an electroluminescent diode.

According to an advantageous characteristic of the invention, the internal conducting circuit is obtained from a visible transparent conductive layer deposited on the first glass sheet.

Of course, the internal conductive circuit can be obtained from any other technique, for example by masking deposition (for example screen printing).

According to an advantageous characteristic of the invention, the connector is at least partially coated with a thermal conductive material.

For example, the connector may be partially covered with a layer of metal (or any other thermal conductive material) to further confer heat dissipation properties of the heat emitted by the electronic component. Thus, the connector makes it possible to improve the heat dissipation of the heat emitted by the electronic component with respect to a more conventional solution for bonding the electronic component to the first glass sheet (the glass is a poor thermal conductor).

5. List of Figures Other features and advantages of the invention will appear more clearly on reading the following description of a preferred embodiment, given as a simple illustrative and nonlimiting example, and the accompanying drawings, among which: Figure 1 shows a diagram of a laminated glazing panel before cutting according to the first embodiment of the invention; FIG. 2 is a diagram of an internal conductive circuit made by removing the conductive layer on the first glass sheet according to an exemplary embodiment of the invention; o Figure 3 shows a diagram of a connector according to an embodiment of the invention.

6. Description of an embodiment of the invention

The following is a part of a first example embodiment of a glazing panel according to the present invention illustrated by FIGS. 1 and 2 and in which the glazing panel is a laminated glazing panel comprising: first glass sheet 2 completely coated with a conductive layer 1, which is for example a conductive layer transparent in the visible, ie whose light transmission in the visible (light band extending between 400nm and 800nm) is greater than 70% ; at least one internal conducting circuit, for example an internal conducting circuit made from the conducting layer 1 and making it possible to supply electronic components, for example light emitting diodes (or "light emitting diodes" in English hereinafter referred to as "light emitting diodes"); by LEDs) in the form of CMS components; a thermoplastic interlayer sheet 3; a second glass sheet 4; o a connector, for example two busbar 5 (or "busbar" in English), sandwiched between the two sheets of glass and for electrically connecting the internal conductor circuit to an external electrical circuit, for example an external power supply device (not shown) LEDs. The busbars 5 are for example busbars as described in WO2009109542 or busbars as described in EPI840449.

Of course, according to the invention, the first glass sheet 2 could only be partially coated with the transparent conductive layer and a plurality of thermoplastic interlayer sheets can be used in the laminated glazing unit. According to the invention, the glazing panel may comprise a plurality of internal conductive circuits or, if it comprises a single internal conductive circuit, this internal conductive circuit may consist of several internal conductive sub-circuits.

In addition, the internal conductive circuit may be intended to supply any type of electronic components, for example sensors, resistors, capacitors, ... or optoelectronics, for example LEDs, OLEDs (for "Organic Light Emitting Diodes"). ) photodetectors, ... or electromechanical: piezoelectric modules, MEMs (for "Micro Electro Mechanical Structure"), ... or even any other type of component requiring a power supply. These components can be in any type of form, for example such as CMS components or under any other type of package or even in the form of chips ("die" or "chip" in English). The internal conductive circuits may also consist of portions of conductive heating layers for example to produce heated windows.

a) Float glass sheets are produced in large dimensions, traditionally 6 m by 3.21 m, and are then called trays or pif. A transparent conductive layer 1 is deposited on a first glass sheet 2 of this size.

Known conducting layers are for example doped oxide-based layers whose thickness is generally between 0.02 and 0.5 μm, preferably between 0.2 and 0.4 μm, and whose surface resistance can vary between 10 and 80 Ω / square, preferably between 12 and 20 Ω / square. Such layers comprise, for example, indium doped zinc oxide or aluminum oxide, fluorine or antimony doped tin oxide, or tin doped indium oxide. (usually known as the ITO abbreviation).

Other typical conductive layers are silver-based layers. These conductive layers may be composed of one, two or even three layers of silver (or any other conductive material), separated by layers of dielectric. For layers comprising a total thickness of conductive material between 10 and 30 nm, the surface resistance can reach very low values of between 2 and 3 Ω / square.

However, any other layer even more weakly conductive could be suitable. Preferably, the conductive layer 1 is transparent.

These layers can be deposited by magnetron assisted vacuum spraying or by pyrolytic deposition which has the advantage of being able to be carried out on the float glass production line.

b) As shown in FIG. 2, the internal conductive circuit is made for example by elimination (for example by etching or ablation) of the conductive layer 1 on thin strips 11, for example using a laser (whose beam, focused on the conductive layer, locally burns this layer and thus forms insulating lines (where the conductive layer has been burned) whose thickness depends on the diameter of the focused laser beam at the conductive layer) or by chemical etching ("chemical etching"). Other methods are possible for forming the internal conductive circuit, for example masking deposition (for example screen printing). In FIG. 2, two peripheral zones are provided to each receive a busbar 5.

c) Connectors 6 according to the invention, for example, each carrying a SMD LED are then disposed on the surface of the internal conductive circuit and electrically connected to this circuit by means of a conductive adhesive or by any other means available ( eg by welding). The number of connectors 6 and their arrangement are chosen for example according to the desired light intensity and the desired light pattern.

d) A laminated glazing is then produced according to the traditional methods by superimposing the thermoplastic interlayer sheet 3, for example PVB (for polyvinyl butyral) and the second glass sheet 4 of the same size as the first glass sheet 2. parts of the sheet of the thermoplastic interlayer 3 which protrude from the first 2 and second 4 sheets of glass are cut and removed. Thus, the dimensions of the sheet of the thermoplastic interlayer 3 are substantially equal to those of the first 2 and second 4 sheets of glass.

The assembly is then subjected to the temperature and pressure conditions usually used for the traditional manufacture of laminated glazing as shown in FIG.

The glazing can then be stored or sold in this form of plateau "pif" of 6 m by 3.21 meters.

e) The glazing can then be cut to the desired measurements for the finished product, taking care to respect the conductive network and taking care not to pass a cutting line to the locations of the LEDs. In the simplest cases, the luminous vitreous element of the finished product will be square or rectangular.

f) For example, the internal conductive circuit comprises terminals (for example a positive terminal and a negative terminal by LED connector 6 or by LED connector group) in the form of internal conductive tracks which extend to peripheral portions of the glazing panel. These terminals are then exposed to remove busbars 5 intended to make the electrical connection with the external electrical circuit. Depending on the conductive network used in the laminated glazing panel, these terminals could be of variable size and be located in variable locations. In the case diagrammatically illustrated in FIGS. 1 and 2, each of the aforementioned terminals of the internal conductive circuits resulted in two same peripheral portions of the glazing panel.

Of course, according to non-illustrated variants of this embodiment of the invention, the terminals in the form of internal conductive tracks of the internal conductive circuit can lead to different peripheral portions of the glazing panel and in this case, it is possible for example provide the installation of busbars as described above for each of these peripheral portions.

Two modes of implementation of the aforementioned connectors 6 are described below.

In connection with FIG. 3, a connector 6 is provided for electrically connecting an LED to the internal electrical tracks of an internal conducting circuit according to one embodiment of the invention.

This connector 6 comprises an electrical insulating substrate 61. This substrate can for example be made using one or a mixture of the following dielectric materials: Teflon, epoxy, glass fibers, glass wool, polyester, cotton paper, etc.

The substrate 61 may also be made in particular of polytetrafluoroethylene (Teflon), FR-1, FR-2, FR-3, FR-4, FR-5, FR-6, CEM-1, CEM-2, CEM-3, EMC-4, CEM-5. This substrate can be rigid or even flexible.

For example, the substrate 61 may be partially covered with a layer of metal in order to further confer heat dissipation properties of the heat emitted by the electronic component. Thus, the substrate 61 makes it possible to improve the heat dissipation of the heat emitted by the LED with respect to a more conventional solution of bonding (by means of a conductive electrical glue) of the LED directly to the first glass sheet 1 ( glass is a poor thermal conductor).

The lower face 62 of this first substrate 61 is coated, at least partially, with first lower conductor tracks 621 intended to be electrically connected with the internal conducting circuit of the glazing panel of FIGS. 1 and 2. For example the first lower conductive tracks 621 are electrically connected to the aforementioned internal conductive tracks.

The upper face 63 of this first substrate 61 is coated, at least partially, with first upper conductive tracks 631 intended to be electrically connected with the terminals 641 of the electronic component 64.

The first lower conductor tracks 621 are electrically connected with the first upper conductive tracks 631 via first conductive elements 65.

For example, the first substrate 61 is a printed circuit piece and the first upper 631 and lower 621 conductor tracks are obtained by selective etching (according to methods well known in the field of printed circuits) of copper layers (or any other conductive material). initially deposited respectively on the upper 63 and lower 62 faces of the first substrate 61.

The first conductive elements 65 are for example obtained by digging, for each first lower conductor track 621 to electrically connect to a first upper conductive track 631, a through hole extending between the lower face 62 and the upper face 63 of the first substrate 61 connecting the first lower conductive track 621 and the first upper conductive track 631 and covering the walls of this hole with an electrically conductive material such as a solder which provides electrical contact. Of course, the first conductive element can also be made with any other technique for electrically connecting the first lower conductive track 621 and the first upper conductive track 631 (for example a wire at least partially occupying the hole or even a technique without hole which runs a driver from the lower face 62 to the upper face 63 of the first substrate 61).

According to a non-illustrated variant of the present invention, the connector 6 further comprises a second electrical insulating substrate coated, at least partially, on its lower face with at least one second lower conductive track intended to be electrically connected with the (s) said first (s) upper conductor track (s) and on its upper side at least one second upper conductive track to be electrically connected to said electronic component, at least a second lower conductive track being electrically connected with at least a second upper conductive track via at least one second conductive element.

Thus, the aforementioned connectors 6 are intended to be positioned on the first glass sheet 2 of FIGS. 1 and 2 so that the internal conductive tracks of the internal conductive circuit are brought into electrical contact with the first lower conductive tracks of these connectors, for example by welding, gluing with electrical conductive glue or by pressure (clipping, spring, ...).

According to one embodiment, the external electrical circuit is for example a multi-channel power supply device for delivering a separate electrical signal on each internal conductive track or on each group of internal conductive tracks and therefore on each LED or group of LEDs. .

Of course, each connector 6 according to the invention can carry and electrically connect any electronic component to the internal electrical tracks of an internal conductive circuit. It can carry and connect a component or several components (identical or distinct). Thus, it can carry and connect, for example, sensors, resistors, capacitors, ... or optoelectronic, for example LEDs, OLEDs (for "Organic Light Emitting Diodes") photodetectors, ... or electro -mechanical: piezoelectric modules, MEMs (for "Micro Electro Mechanical Structure"), ... or even any other type of component requiring a power supply. These components can be in any type of form, for example such as CMS components or under any other type of package or even in the form of chips ("die" or "chip" in English).

In the context of a second embodiment of a glazing panel according to the present invention, the glazing panel is a single glazing panel. In this non-illustrated example, the glazing panel is identical to that of FIGS. 1 to 2 except that it does not comprise thermoplastic interlayer 3 and second glass sheet 4.

In the context of a third embodiment of a glazing panel according to the present invention, the glazing panel is a double glazing panel. In this example not illustrated the glazing panel is identical to that of Figures 1 to 2 except that the thermoplastic interlayer is replaced by a cavity comprising an insulating gas, for example dry air, argon In this case, the thickness of the cavity is such that the insulating substrate (s) can be accommodated between the two sheets of glass.

The applications of a glazing panel according to the invention are multiple. For example, it is possible to produce interactive tables comprising sensors that react to movements (visible light sensor, infrared radiation sensor or touch sensor), information display means based on, for example, light-emitting diodes and possibly a plastic film on which information can be projected.

It is also possible to produce glazing panels incorporating electroluminescent diodes independently controlled and, for example, whose ignition depends on a light intensity received by a light sensor or whose ignition depends on the detection of a touch (by means of of a touch sensor) by a user.

Of course, the invention is not limited to the embodiments mentioned above.

In particular, the skilled person can make any variant in these examples and even combine them.

Claims (10)

A glazing panel comprising: a first glass sheet (2) coated with an inner conductive circuit (1); a connector (6) for electrically connecting at least one electronic component (64) to the internal conducting circuit, characterized in that the connector (6) comprises a first electrical insulating substrate (61) coated, at least partially, on its face lower (62), at least a first lower conductive track (621) to be electrically connected with the inner conductive circuit and, at its upper face (63), at least a first upper conductive track (631) intended to be electrically connected with the electronic component, at least a first lower conductive track being electrically connected to at least a first upper conductive track via at least a first conductive element (65). 2. Panel according to any one of the preceding claims, characterized in that the connector further comprises a second electrical insulating substrate coated, at least partially, on its underside with at least one second lower conductive track to be electrically connected. with said first first conductor track (s) and on its upper side at least one second upper conductive track to be electrically connected to said electronic component, at least one second lower conductive track being electrically connected with at least one second upper conductive track via at least one second conductive element. 3. Panel according to the preceding claim, characterized in that the (s) insulating substrate (s) (61) comprises (nent) at least one through hole extending between its upper face and its lower face, the ( s) said conductor element (s) (65) at least partially occupying the through hole (s). 4. Panel according to any one of the preceding claims, characterized in that the (s) insulating substrate (s) (61) is (are) portion (s) of printed circuit board. 5. Panel according to claim 1, characterized in that the internal conductive circuit comprises at least one internal conductive track and in that the connector is positioned on the first sheet of glass so that the (the) conductive track (s) ( s) internal (s) (is) are electrically connected to said first (s) track (s) conductor (s) lower (621) of the connector (6). 6. Panel according to any one of the preceding claims, characterized in that it further comprises a second glass sheet (4) disposed above the inner conductive circuit of the first glass sheet. 7. Panel according to the preceding claim, characterized in that the glazing panel further comprises one or more thermoplastic interlayer sheet (3) whose dimensions are substantially equal to those of the second sheet of glass arranged between the first sheet of glass. glass and the second glass sheet and whose position is aligned with the second glass sheet and in that the first and second glass sheets and the thermoplastic interlayer (s) form a laminated panel. 8. Panel according to any one of the preceding claims, characterized in that the electronic component is a light emitting diode. 9. Panel according to any one of the preceding claims, characterized in that the inner conductive circuit is obtained from a conductive layer (1) transparent in the visible deposited on the first sheet of glass. 10. Panel according to any one of the preceding claims, characterized in that the connector is at least partially coated with a thermal conductive material.