AU8509491A - Method of enhancing the performance of a magnetron sputtering target - Google Patents

Method of enhancing the performance of a magnetron sputtering target

Info

Publication number
AU8509491A
AU8509491A AU85094/91A AU8509491A AU8509491A AU 8509491 A AU8509491 A AU 8509491A AU 85094/91 A AU85094/91 A AU 85094/91A AU 8509491 A AU8509491 A AU 8509491A AU 8509491 A AU8509491 A AU 8509491A
Authority
AU
Australia
Prior art keywords
enhancing
performance
sputtering target
magnetron sputtering
magnetron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU85094/91A
Other languages
English (en)
Inventor
Arnold J Aronson
Steven D Hurwitt
Charles Van Nutt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Materials Research Corp
Original Assignee
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materials Research Corp filed Critical Materials Research Corp
Publication of AU8509491A publication Critical patent/AU8509491A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
AU85094/91A 1990-08-29 1991-08-22 Method of enhancing the performance of a magnetron sputtering target Abandoned AU8509491A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57556190A 1990-08-29 1990-08-29
US575561 1990-08-29

Publications (1)

Publication Number Publication Date
AU8509491A true AU8509491A (en) 1992-03-30

Family

ID=24300807

Family Applications (1)

Application Number Title Priority Date Filing Date
AU85094/91A Abandoned AU8509491A (en) 1990-08-29 1991-08-22 Method of enhancing the performance of a magnetron sputtering target

Country Status (6)

Country Link
EP (1) EP0546052A1 (ja)
JP (1) JP3315113B2 (ja)
AU (1) AU8509491A (ja)
CA (1) CA2089645C (ja)
SG (1) SG50485A1 (ja)
WO (1) WO1992004483A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9310565U1 (de) * 1993-07-15 1993-10-14 Balzers Hochvakuum GmbH, 65205 Wiesbaden Target für Kathodenzerstäubungsanlagen
ATE130465T1 (de) * 1994-04-07 1995-12-15 Balzers Hochvakuum Magnetronzerstäubungsquelle und deren verwendung.
JP5444006B2 (ja) * 2007-03-02 2014-03-19 ノルディコ テクニカル サーヴィシズ リミテッド 装置
GB201713385D0 (en) * 2017-08-21 2017-10-04 Gencoa Ltd Ion-enhanced deposition
US11952654B2 (en) * 2018-10-24 2024-04-09 Evatec Ag Liquid sputter target

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500409A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Magnetron sputter coating source for both magnetic and non magnetic target materials
DE3569434D1 (en) * 1984-05-17 1989-05-18 Varian Associates Sputter coating source having plural target rings
US4842703A (en) * 1988-02-23 1989-06-27 Eaton Corporation Magnetron cathode and method for sputter coating

Also Published As

Publication number Publication date
CA2089645C (en) 1998-05-05
JP3315113B2 (ja) 2002-08-19
CA2089645A1 (en) 1992-03-01
JPH06502890A (ja) 1994-03-31
SG50485A1 (en) 1998-07-20
WO1992004483A1 (en) 1992-03-19
EP0546052A1 (en) 1993-06-16

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