CA2089645A1 - Method of enhancing the performance of a magnetron sputtering target - Google Patents
Method of enhancing the performance of a magnetron sputtering targetInfo
- Publication number
- CA2089645A1 CA2089645A1 CA 2089645 CA2089645A CA2089645A1 CA 2089645 A1 CA2089645 A1 CA 2089645A1 CA 2089645 CA2089645 CA 2089645 CA 2089645 A CA2089645 A CA 2089645A CA 2089645 A1 CA2089645 A1 CA 2089645A1
- Authority
- CA
- Canada
- Prior art keywords
- target
- field
- progressively
- sputtering
- life
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Abstract
A plasma confining magnetic field (202,302) is generated over the sputtering region (105,106) of a sputtering target (40) with a critical field line (202b,302b) which determines the shape of the plasma (204,304).
The critical field line is progressively flattened over the course of the life of the target as the target erodes.
Preferably, the magnet (51,52) is configured with poles (57,61,65) spaced around the portion of the target below the sputtering region to provide a magnetic field that flattens as its strength decreases. A regulated power supply (122), maintains a regulated power level that is increased as the target erodes to maintain a constant deposition rate. The voltage delivered by the power supply is maintained at or above a constant level by progressively decreasing the current to an electromagnet (52,54) to progressively reduce the field strength and flatten the field. As a result of the invention, the erosion groove of the target is broadened and the number of wafers coated by the target during its life is increased.
The critical field line is progressively flattened over the course of the life of the target as the target erodes.
Preferably, the magnet (51,52) is configured with poles (57,61,65) spaced around the portion of the target below the sputtering region to provide a magnetic field that flattens as its strength decreases. A regulated power supply (122), maintains a regulated power level that is increased as the target erodes to maintain a constant deposition rate. The voltage delivered by the power supply is maintained at or above a constant level by progressively decreasing the current to an electromagnet (52,54) to progressively reduce the field strength and flatten the field. As a result of the invention, the erosion groove of the target is broadened and the number of wafers coated by the target during its life is increased.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57556190A | 1990-08-29 | 1990-08-29 | |
US575,561 | 1990-08-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2089645A1 true CA2089645A1 (en) | 1992-03-01 |
CA2089645C CA2089645C (en) | 1998-05-05 |
Family
ID=24300807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 2089645 Expired - Fee Related CA2089645C (en) | 1990-08-29 | 1991-08-22 | Method of enhancing the performance of a magnetron sputtering target |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0546052A1 (en) |
JP (1) | JP3315113B2 (en) |
AU (1) | AU8509491A (en) |
CA (1) | CA2089645C (en) |
SG (1) | SG50485A1 (en) |
WO (1) | WO1992004483A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9310565U1 (en) * | 1993-07-15 | 1993-10-14 | Balzers Hochvakuum | Target for cathode sputtering systems |
DE59400046D1 (en) * | 1994-04-07 | 1995-12-21 | Balzers Hochvakuum | Magnetron sputtering source and its use. |
WO2008107705A1 (en) * | 2007-03-02 | 2008-09-12 | Nordiko Technical Services Limited | Apparatus |
GB201713385D0 (en) * | 2017-08-21 | 2017-10-04 | Gencoa Ltd | Ion-enhanced deposition |
CN112912535B (en) * | 2018-10-24 | 2023-12-05 | 瑞士艾发科技 | Liquid sputtering target |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4500409A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Magnetron sputter coating source for both magnetic and non magnetic target materials |
DE3569434D1 (en) * | 1984-05-17 | 1989-05-18 | Varian Associates | Sputter coating source having plural target rings |
US4842703A (en) * | 1988-02-23 | 1989-06-27 | Eaton Corporation | Magnetron cathode and method for sputter coating |
-
1991
- 1991-08-22 EP EP19910916025 patent/EP0546052A1/en not_active Withdrawn
- 1991-08-22 SG SG1996002612A patent/SG50485A1/en unknown
- 1991-08-22 WO PCT/US1991/006000 patent/WO1992004483A1/en not_active Application Discontinuation
- 1991-08-22 JP JP51512291A patent/JP3315113B2/en not_active Expired - Lifetime
- 1991-08-22 AU AU85094/91A patent/AU8509491A/en not_active Abandoned
- 1991-08-22 CA CA 2089645 patent/CA2089645C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2089645C (en) | 1998-05-05 |
SG50485A1 (en) | 1998-07-20 |
JPH06502890A (en) | 1994-03-31 |
EP0546052A1 (en) | 1993-06-16 |
AU8509491A (en) | 1992-03-30 |
JP3315113B2 (en) | 2002-08-19 |
WO1992004483A1 (en) | 1992-03-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |