AU8147101A - Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens - Google Patents

Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens

Info

Publication number
AU8147101A
AU8147101A AU81471/01A AU8147101A AU8147101A AU 8147101 A AU8147101 A AU 8147101A AU 81471/01 A AU81471/01 A AU 81471/01A AU 8147101 A AU8147101 A AU 8147101A AU 8147101 A AU8147101 A AU 8147101A
Authority
AU
Australia
Prior art keywords
electrodes
glass
plate made
channel plate
metallic strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU81471/01A
Other languages
English (en)
Inventor
Burkhard Danielzik
Tobias Kalber
Dirk Schlatterbeck
Marten Walther
Andreas Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott Glaswerke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott Glaswerke AG filed Critical Schott Glaswerke AG
Publication of AU8147101A publication Critical patent/AU8147101A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Surface Treatment Of Glass (AREA)
AU81471/01A 2000-03-10 2001-02-10 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens Abandoned AU8147101A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10011455 2000-03-10
DE10011455A DE10011455B4 (de) 2000-03-10 2000-03-10 Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte aus Glas für großflächige Flachbildschirme
PCT/EP2001/001474 WO2001069640A2 (de) 2000-03-10 2001-02-10 Verfahren zum aufbringen von metallischen leiterbahnen als elektroden auf eine kanalplatte aus glas für grossflächige flachbildschirme

Publications (1)

Publication Number Publication Date
AU8147101A true AU8147101A (en) 2001-09-24

Family

ID=7634074

Family Applications (1)

Application Number Title Priority Date Filing Date
AU81471/01A Abandoned AU8147101A (en) 2000-03-10 2001-02-10 Method for applying metallic strip conductors acting as electrodes on a channel plate made of glass for large-surface flat screens

Country Status (3)

Country Link
AU (1) AU8147101A (de)
DE (1) DE10011455B4 (de)
WO (1) WO2001069640A2 (de)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112056A (en) * 1977-03-11 1978-09-30 Fujitsu Ltd Gas discharging panel of self shift type
NL8105922A (nl) * 1981-12-31 1983-07-18 Philips Nv Werkwijze voor het partieel metalliseren van elektrisch geleidende niet-metallische patronen.
DE4125863A1 (de) * 1991-08-03 1993-02-04 Lpkf Cad Cam Systeme Gmbh Verfahren zum aufbringen von strukturierten metallschichten auf glassubstraten
DE4330961C1 (de) * 1993-09-09 1994-07-28 Krone Ag Verfahren zur Herstellung von strukturierten Metallisierungen auf Oberflächen
EP0757885B1 (de) * 1994-04-25 1998-08-12 Siemens S.A. Verfahren zur bildung metallischer leitermuster auf elektrisch isolierenden unterlagen
DE4438799A1 (de) * 1994-10-18 1996-04-25 Atotech Deutschland Gmbh Verfahren zum Beschichten elektrisch nichtleitender Oberflächen mit Metallstrukturen
JP2716013B2 (ja) * 1995-08-11 1998-02-18 日本電気株式会社 カラープラズマディスプレイパネルおよびその製造方法
JP2000505151A (ja) * 1996-11-21 2000-04-25 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ガラス基板に銀層を設ける方法
US6555956B1 (en) * 1998-03-04 2003-04-29 Lg Electronics Inc. Method for forming electrode in plasma display panel and structure thereof
JPH11339672A (ja) * 1998-05-29 1999-12-10 Sony Corp 画像表示装置の製造方法
DE19841900A1 (de) * 1998-09-11 2000-03-30 Schott Glas Verfahren zum Aufbringen von metallischen Leiterbahnen als Elektroden auf eine Kanalplatte für großflächige Flachbildschirme

Also Published As

Publication number Publication date
DE10011455B4 (de) 2005-12-08
DE10011455A1 (de) 2001-09-20
WO2001069640A3 (de) 2002-03-28
WO2001069640A2 (de) 2001-09-20

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase