AU776374B2 - Improved light emitting diode - Google Patents

Improved light emitting diode Download PDF

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Publication number
AU776374B2
AU776374B2 AU31387/01A AU3138701A AU776374B2 AU 776374 B2 AU776374 B2 AU 776374B2 AU 31387/01 A AU31387/01 A AU 31387/01A AU 3138701 A AU3138701 A AU 3138701A AU 776374 B2 AU776374 B2 AU 776374B2
Authority
AU
Australia
Prior art keywords
light emitting
emitting diode
support
blank
connecting pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU31387/01A
Other versions
AU3138701A (en
Inventor
Mu-Chin Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUN RICH OPTO TECHNOLOGY Co Ltd
Original Assignee
SUN RICH OPTO TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUN RICH OPTO TECHNOLOGY Co Ltd filed Critical SUN RICH OPTO TECHNOLOGY Co Ltd
Publication of AU3138701A publication Critical patent/AU3138701A/en
Application granted granted Critical
Publication of AU776374B2 publication Critical patent/AU776374B2/en
Assigned to SUN RICH OPTO TECHNOLOGY CO., LTD. reassignment SUN RICH OPTO TECHNOLOGY CO., LTD. Alteration of Name(s) in Register under S187 Assignors: YU, MU-CHIN
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Description

Regulation 3.2
AUSTRALIA
Patents Act 1990 COMPLETE SPECIFICATION STANDARD PATENT APPLICANT: MU-CHIN YU Invention Title: IMPROVED LIGHT EMITTING DIODE The following statement is a full description of this invention, including the best method of performing it known to me: IMPROVED LIGHT EMITTING DIODE BACKGROUND OF THE INVENTION 1. Field of The Invention: The present invention relates to an improved light emitting diode, and particularly to a light emitting diode, which provides a base with a bottom part thereof free from sealing and exposing outside for a better heat dissipation.
2. Description of Related Art: A light emitting diode has been used as an effective light source for years.
*.The light emitting diode provides advantages such as a longer life span, a higher o lightness and lower power consumption such that it is widely applied in a signaling light, a brake light on a car, a Christmas decorative light, and etc.. In addition, the light emitting diode can provides an effect of instant flash by way of circuit design oool• as desired. Therefore, the light emitting diode is popularly used and there is a tendency for the light emitting diode to replace the conventional tungsten lamp.
As shown in Fig. 1, a typical light emitting diode provides at least two connecting pins as a positive pole and a negative pole respectively. A base is disposed above one of the poles at a lateral side thereof to receive a crystal chip and a brazed wire connects a nodal plate extended from the other pole to constitute a circuit. The above said pins base nodal plate are made of conductive sheet metal, and, in practice, are produced by way of integrally punch pressing a strip of conductive sheet metal.
As shown in Fig. 2, a blank sheet used for a prior art light emitting diode is illustrated. It can be seen that the blank sheet has been punch pressed to form a plurality of blank sections. Each blank section has connecting pins the base and the nodal plate and the base has a shape of concave inward cone.
The rest unnecessary parts are cut out as removals.
-2- As shown in Fig. 3, a bent blank is illustrated. Each connecting pin in the respective blank section is bent into an angle of 90 degrees with respect to the base and the nodal plate and then the nodal plate and the chip can be connected with each other via a brazed wire In order to assure a protection for all parts related to the circuit, each blank section are insulated by way of sealing compound. As shown in Fig. 4, a hold fixture is provided with recessions to fit with pattern frames Each blank section is received in each pattern frame and fits with the pattern frame such that the base and the nodal plate are disposed in the pattern frame. Then, the transparent sealing compound such as epoxy resin is poured into each pattern frame to be flush with the upper surface of the pattern frame When the poured sealing compound is solidified, the sealed blank sections are taken out and apart from the pattern frames respectively. Finally, the sealed blank sections are separate into individual light emitting diodes and each of the light emitting :i 15 diodes is like the one shown in Fig. 1. As shown in Fig. 1, the base is completely covered by the sealing compound and insulated from the outside and the parts above the base are in a state of being sealed to insulate from the outside either.
Once the light emitting diode is started in a state of on instantaneously, an instantaneous current consumption is great so as to generate a higher temperature in the light emitting diode. When the light emitting diode is kept "on" for a long period of time, the heat generated from both of the chip and the wire solder is unable to release outward and results in a phenomenon of minor flaming. In this way, the durability of the light emitting diode may be influenced substantially.
In order to disclose a way overcoming the preceding defects in the prior art, the inventor has filed at the Chinese Patent Office and has been assigned Application No. 00107611.6 entitled "Light Emitting Diode and Making Method with Blank Thereof. (The same invention also has been filed as a European Patent -3- Application No. 00111453 and a U.S. Patent Application No. 09/582,236 respectively) SUMMARY OF THE INVENTION An object of the present invention is to provide an improved light emitting diode, with which the heat generated therein may transmitted through exposed connecting pins to ease the heat dissipation.
BRIEF DESCRIPTION OF THE DRAWINGS The present invention can be more fully understood by referring to the following description and accompanying drawing, in which: 10 Fig. 1 is a perspective view of a conventional light emitting diode; 0 Fig. 2 is a fragmentary plan view of a blank of a conventional light emitting diode after being stamped; Fig. 3 is perspective view of a bent blank of a conventional light emitting diode; Fig. 4 is a perspective view of the bent blank shown in Fig. 3 in a process of sealing; Fig. 5 is a plan view of a blank sheet of a light emitting diode according to the present invention; Fig. 6 is a sectional view of the blank sheet shown in Fig. 5 after being bent; Fig. 7 is a fragmentary perspective view of the light emitting diode of the present invention in the process of sealing; Fig. 8 is a perspective view of the finished light emitting diode of the present invention; Fig. 9 is a plan view of a blank sheet in a second embodiment of the present invention; Fig. 10 is a sectional view of the blank sheet shown in Fig. 9 after being bent illustrating the bent blank disengaging with a support; Fig. 11 is a sectional view similar to Fig. 10 illustrating the bent blank engaging with the support; Fig. 12 is a fragmentary perspective view of the light emitting diode in the second embodiment of the present invention in the process of sealing; Fig. 13 is a perspective view of the finished light emitting diode of the l 10 second embodiment of present invention; Fig. 14 is a sectional view similar to Fig. 11 illustrating another support engaging with the bent blank; and Fig. 15 is a plan view of a blank sheet similar to that shown in Fig. 9 illustrating connecting pin set for crystal chips in different colors.
DETAILED DESCRIPTION OF THE PREFERRED
EMBODIMENTS
SReferring to Figs. 5 to 8, the first embodiment of a light emitting diode according to the present invention basically comprises a frame 1 of a blank sheet, a crystal chip (or a crystal grain) 2, a wire solder 3, and sealing compound 4.
The frame 1 as shown in Fig. 5 is made of an elongated conductive sheet metal being continuously formed integrally by way of punch. Four connecting pins 11 being constituted in the process of punching are divided into two sets and one set thereof have a middle connection 12. The middle connection 12 at the central section thereof may have a circular arc but not required. Another set of connecting pins 11 is provided with a wider plate connection 13 and the middle part of the plate connection 13 is punched a recess cup 14 for placing a chip 2. As shown in Fig. 6, connecting pins 11 are vertically bent downward at margins of the middle connection 12 and the plate connection 13 respectively.
The chip 2, which is the prior art, is placed in the recess cup 14.
The wire solder 3 is made of conductive metal wire and joined to the middle connection 12 and the chip 2 by way of soldering machine to constitute a closed circuit.
The sealing compound 4 is made of insulation material and tightly covers the chip 2, the wire solder 3, part of the plate connection and part of the middle i' connection 12 as shown in Fig. 7. Hence, the connecting pins are left uncovered io 10 and exposed outside. In addition, the sealing compound at the top thereof is formed a light head 41 and the light head 41 may be a shape of semi-ellipse as shown in Fig. 8. But it is not a restriction to have to be the shape of semi0ellipse.
Referring to Fig. 8 again, the finished light emitting diode of the present invention has the upper portions of the middle connection 12 and the plate connection 13 sealed by and the lower portions thereof expose outside for heat dissipation. It can be understood that the transmission speed of heat is proportional to the transmitted area on which the heat may dissipate, that is, the larger transmitted area the plate connection 13 has, the faster speed of heat dissipation can be reach. Because the plate connection 13 has a width greater than that of the prior art and the lower portion thereof is exposed outside, a superior effect of heat dissipation can be obtained substantially.
Referring to Figs. 9 to 13, a second embodiment of the present invention is illustrated. The light emitting diode in the second embodiment comprises a frame composed of the blank sheet, a support 6, a crystal chip 7 (or crystal grain), a wire solder 8, and sealing compound 9.
The frame 5 of the blank sheet as shown in Fig. 9 is made of elongated conductive metal being continuously punched integrally to form four connecting -6pins 51. These four connecting pins 51 are divided into two sets and one set of these connecting pins 51 has a wider middle plate 52. The middle plate 52 at the center thereof is provided with a fitting hole 53 and a recess ring 54 is provided to surround the fitting hole 53. As shown in Fig. 10, connecting pins 51 are bent vertically and the other set of connecting pins 51 is separate from the middle plate 52 by way of a cut.
The support 6 is made of conductive metal and can be hexagon, circle, octagon, and other shapes. The support 6 is composed of a support base 61 and a support tubing 62 and the support base 61 has a bigger size and the support tubing 62 is integrally located at the top of the support base 61. The support **tubing 62 has a central hole 621 and a support wall 622 and has an outer diameter corresponding to the fitting hole 53 so as to pass through the fitting hole 53. As shown in Fig. 11, the support engages with the frame 5 by way of riveting, that is, the support tubing 62 is forced to make the support wall 622 be deformed and 15 expand outward so as to attached to the recess ring 54 tightly. The support wall 622 opens upward to constitute a shape of trumpet and the lower part of the support tubing 62 constitute a support bottom 623 for receiving the chip 7.
The chip 7 is the prior art and placed in and located at the support bottom 623.
The wire solder 8 is made of conductive metal and connects with the central part of the one set of the connecting pins 51 and the chip 7 by way of the soldering machine to constitute a closed circuit.
The sealing compound 9 is made of insulation material and encloses tightly the chip 7, the wire solder 8, and part of connecting pins 51 to allow connecting pins to expose outside as shown in Fig. 12. As shown in Figs. 12 and 13, the sealing compound 9 at the top thereof has a light head 91 extending outward in addition to being an enclosure. The light head 91may be semi-ellipse but this is not a restriction. Furthermore, the support 6, part of the middle plate 52, and part of connecting pins are exposed outside.
Referring to Fig. 13, the finished light emitting diode in the second embodiment exposes the lower portion of connecting pins, part of the middle plate 52, the lower portion of support 6. The rest of the finished light emitting diode is enclosed tightly by the sealing compound 9. The bottom of support 6 and part of the middle plate expose outside for performing dissipation of heat. In addition, once the finished light emitting diode is inserted to the circuit board, the support 6 can contact with the circuit board to carry out the heat transfer for accelerating the io dissipation of heat.
Referring to Fig. 14, another embodiment of the support 6 is illustrated.
The support 6 has the support base 61 thereof provide an annular circumference with a hollow part and the annular circumference contacts with the circuit board for dissipating the heat.
Moreover, the engagement of the support 6 and the frame 5 can be by way of gluing, threaded fastening, and etc. in addition to riveting. Because these equivalent engaging ways are the prior art, no detail will be described further.
Referring to Fig. 15, the another set of connecting pins 51 next to the set of connecting pins having the chip 7 is provided with a cut at the middle thereof to connect with chips 7 in different colors. As shown in Fig. 15, while three crystal grains in three different colors such as red, green, and blue or red, yellow, and blue are arranged, the light emitting diode may display a complete combination of different colors. Because this is the prior art, no details will be explained further.
While the invention has been described with reference to preferred embodiments thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.

Claims (6)

  1. 2. The light emitting diode of ciaim 1 wherein the U-shaped middle connector has two connectors extending therefrom.
  2. 3. The light emitting diode of claim 2 wherein the U-shaped middle plate has two connectors extending therefrom.
  3. 4. The light emitting diode of claim 1 wherein the U-shaped middle plate has two connectors extending therefrom. The light emitting diode of claim 1 wherein the second portion of the support has a generally cylindrical configuration.
  4. 6. The light emitting diode of claim 1 wherein the second portion of the support has an end and further comprising a recess extending into the second portion from the end.
  5. 7. The light emitting diode of claim 1 further comprising: a) at least one gap in the U-shaped middle connector separating the U- shaped middle connector into at least two sections; b) at least two chips in the cup recess; and, 0*o* 25 c) wires connecting each of the at least two chips to one of the at least two sections. oooo•
  6. 8. A light emitting diode substantially as herein described.
AU31387/01A 2000-10-26 2001-03-30 Improved light emitting diode Ceased AU776374B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW89218627U TW477466U (en) 2000-10-26 2000-10-26 Improved LED
TW89218627 2000-11-14

Publications (2)

Publication Number Publication Date
AU3138701A AU3138701A (en) 2002-05-02
AU776374B2 true AU776374B2 (en) 2004-09-09

Family

ID=21674298

Family Applications (1)

Application Number Title Priority Date Filing Date
AU31387/01A Ceased AU776374B2 (en) 2000-10-26 2001-03-30 Improved light emitting diode

Country Status (2)

Country Link
AU (1) AU776374B2 (en)
TW (1) TW477466U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5345106A (en) * 1990-06-01 1994-09-06 Robert Bosch Gmbh Electronic circuit component with heat sink mounted on a lead frame
US5825054A (en) * 1995-12-29 1998-10-20 Industrial Technology Research Institute Plastic-molded apparatus of a semiconductor laser

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5345106A (en) * 1990-06-01 1994-09-06 Robert Bosch Gmbh Electronic circuit component with heat sink mounted on a lead frame
US5825054A (en) * 1995-12-29 1998-10-20 Industrial Technology Research Institute Plastic-molded apparatus of a semiconductor laser

Also Published As

Publication number Publication date
AU3138701A (en) 2002-05-02
TW477466U (en) 2002-02-21

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