AU7256496A - Method for radiation-induced thermal transfer of resist for flexible printed circuitry - Google Patents

Method for radiation-induced thermal transfer of resist for flexible printed circuitry

Info

Publication number
AU7256496A
AU7256496A AU72564/96A AU7256496A AU7256496A AU 7256496 A AU7256496 A AU 7256496A AU 72564/96 A AU72564/96 A AU 72564/96A AU 7256496 A AU7256496 A AU 7256496A AU 7256496 A AU7256496 A AU 7256496A
Authority
AU
Australia
Prior art keywords
resist
radiation
flexible printed
thermal transfer
induced thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU72564/96A
Inventor
Hsin-Hsin Chou
William V. Dower
Thomas A. Isberg
Martin B. Wolk
Robert L. D. Zenner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of AU7256496A publication Critical patent/AU7256496A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
AU72564/96A 1995-10-17 1996-10-04 Method for radiation-induced thermal transfer of resist for flexible printed circuitry Abandoned AU7256496A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US543943 1990-06-26
US54394395A 1995-10-17 1995-10-17
PCT/US1996/015944 WO1997015173A1 (en) 1995-10-17 1996-10-04 Method for radiation-induced thermal transfer of resist for flexible printed circuitry

Publications (1)

Publication Number Publication Date
AU7256496A true AU7256496A (en) 1997-05-07

Family

ID=24170155

Family Applications (1)

Application Number Title Priority Date Filing Date
AU72564/96A Abandoned AU7256496A (en) 1995-10-17 1996-10-04 Method for radiation-induced thermal transfer of resist for flexible printed circuitry

Country Status (2)

Country Link
AU (1) AU7256496A (en)
WO (1) WO1997015173A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4025016B2 (en) * 1997-09-02 2007-12-19 イメイション・コーポレイション Black thermal transfer donor for use in laser addressable thermal transfer systems
US6114088A (en) 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
DE60035078T2 (en) 1999-01-15 2008-01-31 3M Innovative Properties Co., St. Paul Manufacturing method of a heat transfer donor element
US6461775B1 (en) 1999-05-14 2002-10-08 3M Innovative Properties Company Thermal transfer of a black matrix containing carbon black
US6228543B1 (en) 1999-09-09 2001-05-08 3M Innovative Properties Company Thermal transfer with a plasticizer-containing transfer layer
DE19944908A1 (en) 1999-09-10 2001-04-12 Atotech Deutschland Gmbh Method of forming a conductor pattern on dielectric substrates
US6284425B1 (en) 1999-12-28 2001-09-04 3M Innovative Properties Thermal transfer donor element having a heat management underlayer
US6228555B1 (en) 1999-12-28 2001-05-08 3M Innovative Properties Company Thermal mass transfer donor element
US6358664B1 (en) 2000-09-15 2002-03-19 3M Innovative Properties Company Electronically active primer layers for thermal patterning of materials for electronic devices
US6855384B1 (en) 2000-09-15 2005-02-15 3M Innovative Properties Company Selective thermal transfer of light emitting polymer blends
US7279777B2 (en) 2003-05-08 2007-10-09 3M Innovative Properties Company Organic polymers, laminates, and capacitors
US7098525B2 (en) 2003-05-08 2006-08-29 3M Innovative Properties Company Organic polymers, electronic devices, and methods
US7198879B1 (en) * 2005-09-30 2007-04-03 Eastman Kodak Company Laser resist transfer for microfabrication of electronic devices
US20080027199A1 (en) 2006-07-28 2008-01-31 3M Innovative Properties Company Shape memory polymer articles with a microstructured surface
US7670450B2 (en) 2006-07-31 2010-03-02 3M Innovative Properties Company Patterning and treatment methods for organic light emitting diode devices
GB201108865D0 (en) 2011-05-26 2011-07-06 Ct For Process Innovation The Ltd Semiconductor compounds
GB201108864D0 (en) 2011-05-26 2011-07-06 Ct For Process Innovation The Ltd Transistors and methods of making them

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144092A (en) * 1984-12-18 1986-07-01 ダイセル化学工業株式会社 Circuit formation for printed wiring board by heat transfer
JPS61202890A (en) * 1985-03-06 1986-09-08 Daicel Chem Ind Ltd Laminate film for thermal transfer
JPH01303786A (en) * 1988-06-01 1989-12-07 Shikoku Chem Corp Manufacture of printed wiring board and thermal transfer ink therefor
JPH04292993A (en) * 1991-03-22 1992-10-16 Toppan Printing Co Ltd Transfer recording medium for forming resist pattern
US5278023A (en) * 1992-11-16 1994-01-11 Minnesota Mining And Manufacturing Company Propellant-containing thermal transfer donor elements

Also Published As

Publication number Publication date
WO1997015173A1 (en) 1997-04-24

Similar Documents

Publication Publication Date Title
AU7256496A (en) Method for radiation-induced thermal transfer of resist for flexible printed circuitry
AU9768498A (en) A system for transfer of data
AU6210196A (en) Processes and devices for the transfer of printing ink
HK1007539A1 (en) Embossed-pattern transfer sheet and method of pattern transfer
AU6425796A (en) Thermal transfer sheet
AU6196798A (en) Printing process and substrates printed thereby
AU2880292A (en) Transfer unit for printing systems
AU3340595A (en) Transfer film
AU6428896A (en) Thermal transfer sheet
GB2289441B (en) Method of printing
EP0764547A3 (en) Image-receiving sheet for melt thermal transfer recording
GB2321878B (en) Thermal transfer printer
AU2008595A (en) Method of printing
GB9319839D0 (en) An aid particularly for the transfer of patients
EP0764888A3 (en) Electrophotographic decalcomania transfer medium
AU5439396A (en) Apparatus and method for transferring sheets of printed media
GB9325611D0 (en) Thermal transfer printing
GB9603416D0 (en) Data transfer circuit
GB2281404B (en) Photosensitive transfer sheet
AU8776791A (en) Thermal printing apparatus
AU4726097A (en) Self-adhesive film for thermal printing
GB9218126D0 (en) Thermal transfer printing dye-sheet
GB9604726D0 (en) Method of thermal transfer printing
AU5194793A (en) Image transfer method
GB9218514D0 (en) Thermal transfer printing method