AU6727490A - Multi-layer lead frames for integrated circuit packages - Google Patents

Multi-layer lead frames for integrated circuit packages

Info

Publication number
AU6727490A
AU6727490A AU67274/90A AU6727490A AU6727490A AU 6727490 A AU6727490 A AU 6727490A AU 67274/90 A AU67274/90 A AU 67274/90A AU 6727490 A AU6727490 A AU 6727490A AU 6727490 A AU6727490 A AU 6727490A
Authority
AU
Australia
Prior art keywords
integrated circuit
lead frames
circuit packages
layer lead
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU67274/90A
Inventor
Jeffrey S Braden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of AU6727490A publication Critical patent/AU6727490A/en
Abandoned legal-status Critical Current

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Classifications

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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
AU67274/90A 1989-10-30 1990-10-09 Multi-layer lead frames for integrated circuit packages Abandoned AU6727490A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/429,120 US5025114A (en) 1989-10-30 1989-10-30 Multi-layer lead frames for integrated circuit packages
US429120 1989-10-30

Publications (1)

Publication Number Publication Date
AU6727490A true AU6727490A (en) 1991-05-31

Family

ID=23701895

Family Applications (1)

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AU67274/90A Abandoned AU6727490A (en) 1989-10-30 1990-10-09 Multi-layer lead frames for integrated circuit packages

Country Status (10)

Country Link
US (1) US5025114A (en)
EP (1) EP0500690B1 (en)
JP (1) JPH05501939A (en)
KR (1) KR0184588B1 (en)
AU (1) AU6727490A (en)
CA (1) CA2065295A1 (en)
DE (1) DE69028311T2 (en)
HK (1) HK1008115A1 (en)
PH (1) PH27421A (en)
WO (1) WO1991006978A2 (en)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5206536A (en) * 1991-01-23 1993-04-27 Texas Instruments, Incorporated Comb insert for semiconductor packaged devices
KR940001148B1 (en) * 1991-04-16 1994-02-14 삼성전자 주식회사 Semiconductor package
US5234536A (en) * 1991-04-26 1993-08-10 Olin Corporation Process for the manufacture of an interconnect circuit
US5156716A (en) * 1991-04-26 1992-10-20 Olin Corporation Process for the manufacture of a three layer tape for tape automated bonding
US5218168A (en) * 1991-09-26 1993-06-08 Micron Technology, Inc. Leads over tab
US5434357A (en) * 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
JPH05190721A (en) * 1992-01-08 1993-07-30 Fujitsu Ltd Semiconductor device and manufacture thereof
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5262927A (en) * 1992-02-07 1993-11-16 Lsi Logic Corporation Partially-molded, PCB chip carrier package
US5243133A (en) * 1992-02-18 1993-09-07 International Business Machines, Inc. Ceramic chip carrier with lead frame or edge clip
CA2108542A1 (en) * 1992-02-18 1993-08-19 Bidyut K. Bhattacharyya Advance multilayer molded plastic package using mesic technology
JP3051569B2 (en) * 1992-05-29 2000-06-12 新光電気工業株式会社 Multilayer lead frame
JPH0653277A (en) * 1992-06-04 1994-02-25 Lsi Logic Corp Semiconductor device assembly and its assembly method
US5239131A (en) * 1992-07-13 1993-08-24 Olin Corporation Electronic package having controlled epoxy flow
TW238419B (en) * 1992-08-21 1995-01-11 Olin Corp
GB2274351A (en) * 1993-01-19 1994-07-20 Digital Equipment Int I.C.Chip carriers
US5420757A (en) * 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
US5393931A (en) * 1993-03-04 1995-02-28 Photmetrics, Ltd. Electrical access to a hermetically sealed chamber using a printed circuit board
WO1994025979A1 (en) * 1993-04-30 1994-11-10 Lsi Logic Corporation Integrated circuit with lead frame package having internal power and ground busses
JPH0714976A (en) * 1993-06-24 1995-01-17 Shinko Electric Ind Co Ltd Lead frame and semiconductor device
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5448020A (en) * 1993-12-17 1995-09-05 Pendse; Rajendra D. System and method for forming a controlled impedance flex circuit
US5437096A (en) * 1994-02-28 1995-08-01 Technical Materials, Inc. Method for making a multilayer metal leadframe
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
AU2231795A (en) * 1994-04-14 1995-11-10 Olin Corporation Electronic package having improved wire bonding capability
US5969414A (en) * 1994-05-25 1999-10-19 Advanced Technology Interconnect Incorporated Semiconductor package with molded plastic body
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
EP0698922B1 (en) * 1994-08-12 2001-06-06 STMicroelectronics S.r.l. Leadframe for supporting integrated semiconductor devices
US5498901A (en) * 1994-08-23 1996-03-12 National Semiconductor Corporation Lead frame having layered conductive planes
US5573845A (en) * 1994-12-09 1996-11-12 Olin Corporation Superficial coating layer having acicular structures for electrical conductors
US5545850A (en) * 1995-01-13 1996-08-13 Olin Corporation Guard ring for integrated circuit package
EP0764345A1 (en) * 1995-04-05 1997-03-26 National Semiconductor Corporation Multi-layer lead frame
KR0148203B1 (en) * 1995-06-05 1998-08-01 이대원 Inner lead method of lead frame
US5650663A (en) * 1995-07-03 1997-07-22 Olin Corporation Electronic package with improved thermal properties
US5818102A (en) * 1995-12-29 1998-10-06 Lsi Logic Corporation System having integrated circuit package with lead frame having internal power and ground busses
JP2904123B2 (en) * 1996-05-10 1999-06-14 日本電気株式会社 Method for producing multilayer film carrier
US5731244A (en) 1996-05-28 1998-03-24 Micron Technology, Inc. Laser wire bonding for wire embedded dielectrics to integrated circuits
US5735030A (en) * 1996-06-04 1998-04-07 Texas Instruments Incorporated Low loop wire bonding
US6232551B1 (en) * 1999-08-18 2001-05-15 Subtron Technology Co., Ltd. Substrate board for semiconductor package
US6956182B2 (en) * 2000-05-26 2005-10-18 Sts Atl Corporation Method of forming an opening or cavity in a substrate for receiving an electronic component
US20050146025A1 (en) * 2001-02-26 2005-07-07 John Gregory Method of forming an opening or cavity in a substrate for receiving an electronic component
US6563124B2 (en) 2001-03-21 2003-05-13 Applied Materials, Inc. Electron beam apparatus having traversing circuit boards
DE10157362B4 (en) * 2001-11-23 2006-11-16 Infineon Technologies Ag Power module and method for its production
JP3797992B2 (en) * 2003-09-05 2006-07-19 沖電気工業株式会社 Semiconductor device
US7529095B2 (en) * 2007-09-28 2009-05-05 Visteon Global Technologies, Inc. Integrated electrical shield in a heat sink
US8188592B2 (en) 2007-10-26 2012-05-29 Infineon Technologies Ag Apparatus and method configured to lower thermal stresses
US7888782B2 (en) * 2007-10-26 2011-02-15 Infineon Technologies Ag Apparatus and method configured to lower thermal stresses
KR101126767B1 (en) * 2007-10-26 2012-03-29 삼성테크윈 주식회사 Method for Manufacturing Printed Circuit Board And Printed Circuit Board Manufactured by the Method
US9253910B2 (en) 2013-01-30 2016-02-02 Texas Instruments Incorporated Circuit assembly
US10914018B2 (en) * 2019-03-12 2021-02-09 Infineon Technologies Ag Porous Cu on Cu surface for semiconductor packages

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3684818A (en) * 1970-10-20 1972-08-15 Sprague Electric Co Multi-layer beam-lead wiring for semiconductor packages
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
USRE31967E (en) * 1975-07-07 1985-08-13 National Semiconductor Corporation Gang bonding interconnect tape for semiconductive devices and method of making same
US4278784A (en) * 1980-02-06 1981-07-14 Western Electric Company, Inc. Encapsulated electronic devices and encapsulating compositions
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4461924A (en) * 1982-01-21 1984-07-24 Olin Corporation Semiconductor casing
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
US4513355A (en) * 1983-06-15 1985-04-23 Motorola, Inc. Metallization and bonding means and method for VLSI packages
US4680613A (en) * 1983-12-01 1987-07-14 Fairchild Semiconductor Corporation Low impedance package for integrated circuit die
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
US4619741A (en) * 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US4801765A (en) * 1986-01-06 1989-01-31 American Telephone And Telegraph Company, At&T Bell Laboratories Electronic component package using multi-level lead frames
US4721993A (en) * 1986-01-31 1988-01-26 Olin Corporation Interconnect tape for use in tape automated bonding
US4814855A (en) * 1986-04-29 1989-03-21 International Business Machines Corporation Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
US4814943A (en) * 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
JPH0815193B2 (en) * 1986-08-12 1996-02-14 新光電気工業株式会社 Semiconductor device and lead frame used for the same
US4891687A (en) * 1987-01-12 1990-01-02 Intel Corporation Multi-layer molded plastic IC package
US4761518A (en) * 1987-01-20 1988-08-02 Olin Corporation Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs
US4806409A (en) * 1987-05-20 1989-02-21 Olin Corporation Process for providing an improved electroplated tape automated bonding tape and the product produced thereby
US4849857A (en) * 1987-10-05 1989-07-18 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US4827376A (en) * 1987-10-05 1989-05-02 Olin Corporation Heat dissipating interconnect tape for use in tape automated bonding
US4888449A (en) * 1988-01-04 1989-12-19 Olin Corporation Semiconductor package

Also Published As

Publication number Publication date
PH27421A (en) 1993-06-21
KR0184588B1 (en) 1999-03-20
DE69028311D1 (en) 1996-10-02
CA2065295A1 (en) 1991-05-01
JPH05501939A (en) 1993-04-08
EP0500690B1 (en) 1996-08-28
HK1008115A1 (en) 1999-04-30
WO1991006978A3 (en) 1991-06-13
DE69028311T2 (en) 1997-04-03
WO1991006978A2 (en) 1991-05-16
US5025114A (en) 1991-06-18
EP0500690A4 (en) 1993-05-19
EP0500690A1 (en) 1992-09-02

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