AU3119395A - Electronic circuit package - Google Patents

Electronic circuit package

Info

Publication number
AU3119395A
AU3119395A AU31193/95A AU3119395A AU3119395A AU 3119395 A AU3119395 A AU 3119395A AU 31193/95 A AU31193/95 A AU 31193/95A AU 3119395 A AU3119395 A AU 3119395A AU 3119395 A AU3119395 A AU 3119395A
Authority
AU
Australia
Prior art keywords
electronic circuit
circuit package
package
electronic
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU31193/95A
Inventor
Anthony Richard Cowburn
Katherine Margaret Medlock
William Morris Morgan
Clive Peter Savage
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seagate Systems UK Ltd
Original Assignee
Havant International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Havant International Ltd filed Critical Havant International Ltd
Publication of AU3119395A publication Critical patent/AU3119395A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
AU31193/95A 1994-07-29 1995-07-27 Electronic circuit package Abandoned AU3119395A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9415297 1994-07-29
GB9415297A GB2292004A (en) 1994-07-29 1994-07-29 Electronic circuit package
PCT/GB1995/001785 WO1996004682A1 (en) 1994-07-29 1995-07-27 Electronic circuit package

Publications (1)

Publication Number Publication Date
AU3119395A true AU3119395A (en) 1996-03-04

Family

ID=10759059

Family Applications (1)

Application Number Title Priority Date Filing Date
AU31193/95A Abandoned AU3119395A (en) 1994-07-29 1995-07-27 Electronic circuit package

Country Status (3)

Country Link
AU (1) AU3119395A (en)
GB (1) GB2292004A (en)
WO (1) WO1996004682A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5905639A (en) * 1997-09-29 1999-05-18 Raytheon Company Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
DE10214847A1 (en) * 2002-04-04 2003-10-23 Diehl Munitionssysteme Gmbh Flexible thin circuit construction
US8716932B2 (en) 2011-02-28 2014-05-06 Apple Inc. Displays with minimized borders
US8804347B2 (en) 2011-09-09 2014-08-12 Apple Inc. Reducing the border area of a device
US9110320B2 (en) 2012-08-14 2015-08-18 Apple Inc. Display with bent inactive edge regions
US9195108B2 (en) 2012-08-21 2015-11-24 Apple Inc. Displays with bent signal lines
US9601557B2 (en) 2012-11-16 2017-03-21 Apple Inc. Flexible display
US9209207B2 (en) 2013-04-09 2015-12-08 Apple Inc. Flexible display with bent edge regions
US9600112B2 (en) 2014-10-10 2017-03-21 Apple Inc. Signal trace patterns for flexible substrates
KR20180075733A (en) 2016-12-26 2018-07-05 엘지디스플레이 주식회사 Flexible display device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636147A (en) * 1979-08-31 1981-04-09 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacture
GB2218847B (en) * 1988-05-16 1991-04-24 Gen Electric Co Plc Carrier for semiconductor devices
US5016082A (en) * 1988-09-16 1991-05-14 Delco Electronics Corporation Integrated circuit interconnect design
FR2638895A1 (en) * 1988-11-08 1990-05-11 Bull Sa INTEGRATED CIRCUIT SUPPORT AND MANUFACTURING METHOD THEREOF, INTEGRATED CIRCUIT SUITABLE FOR THE SUPPORT AND RESULTING HOUSING
US5055907A (en) * 1989-01-25 1991-10-08 Mosaic, Inc. Extended integration semiconductor structure with wiring layers
US5231305A (en) * 1990-03-19 1993-07-27 Texas Instruments Incorporated Ceramic bonding bridge
US5060052A (en) * 1990-09-04 1991-10-22 Motorola, Inc. TAB bonded semiconductor device having off-chip power and ground distribution

Also Published As

Publication number Publication date
WO1996004682A1 (en) 1996-02-15
GB2292004A (en) 1996-02-07
GB9415297D0 (en) 1994-09-21

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