AU6422199A - Thermosetting adhesive composition, adhesive and production process for adhesive - Google Patents
Thermosetting adhesive composition, adhesive and production process for adhesiveInfo
- Publication number
- AU6422199A AU6422199A AU64221/99A AU6422199A AU6422199A AU 6422199 A AU6422199 A AU 6422199A AU 64221/99 A AU64221/99 A AU 64221/99A AU 6422199 A AU6422199 A AU 6422199A AU 6422199 A AU6422199 A AU 6422199A
- Authority
- AU
- Australia
- Prior art keywords
- adhesive
- production process
- thermosetting
- composition
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0869—Acids or derivatives thereof
- C09J123/0884—Epoxide containing esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
- C08L23/0884—Epoxide containing esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/26—Natural polymers, natural resins or derivatives thereof according to C08L1/00 - C08L5/00, C08L89/00, C08L93/00, C08L97/00 or C08L99/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10325369A JP2000144082A (en) | 1998-11-16 | 1998-11-16 | Thermosetting adhesive composition, adhesive and preparation of adhesive |
JP10/325369 | 1998-11-16 | ||
PCT/US1999/023499 WO2000029500A1 (en) | 1998-11-16 | 1999-10-07 | Thermosetting adhesive composition, adhesive and production process for adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6422199A true AU6422199A (en) | 2000-06-05 |
Family
ID=18176073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU64221/99A Abandoned AU6422199A (en) | 1998-11-16 | 1999-10-07 | Thermosetting adhesive composition, adhesive and production process for adhesive |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2000144082A (en) |
AU (1) | AU6422199A (en) |
WO (1) | WO2000029500A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5976716B2 (en) * | 2008-12-24 | 2016-08-24 | 日東電工株式会社 | Thermosetting die bond film |
JP6241415B2 (en) * | 2012-12-27 | 2017-12-06 | 東レ株式会社 | Adhesive, adhesive film, semiconductor device and manufacturing method thereof |
JP6582363B2 (en) * | 2013-12-03 | 2019-10-02 | オート化学工業株式会社 | Adhesive composition and method for producing the same |
JP2019127501A (en) * | 2018-01-22 | 2019-08-01 | 藤森工業株式会社 | Thermosetting adhesive composition, adhesive film, coverlay film, and flexible printed wiring board |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2030991B (en) * | 1977-02-09 | 1982-11-24 | Nitto Electric Ind Co | Heat activatable pressuresensitive adhesive tape of sheet |
JPS6025071B2 (en) * | 1982-07-22 | 1985-06-15 | 日立化成工業株式会社 | Radiation-curable pressure-sensitive adhesive composition |
JPS60124615A (en) * | 1983-12-12 | 1985-07-03 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
CN87107692A (en) * | 1986-11-13 | 1988-05-25 | Mt化学公司 | The manufacture method of semiconductor device |
JPH01150493A (en) * | 1987-12-08 | 1989-06-13 | Asahi Chem Res Lab Ltd | Temporary adhesive for soldering |
IE911007A1 (en) * | 1990-05-15 | 1991-11-20 | Himont Inc | Radiation-resistant propylene polymer composition and¹radiation sterilized articles therefrom |
AU2322292A (en) * | 1991-05-22 | 1992-12-30 | Ferro Corporation | Thermoplastic coating compositions and process using same |
JPH0633029A (en) * | 1992-07-16 | 1994-02-08 | Daicel Chem Ind Ltd | Epoxy resin-based adhesive |
WO1995012647A1 (en) * | 1993-11-05 | 1995-05-11 | Minnesota Mining And Manufacturing Company | Anticorrosion adhesive composition and method |
JPH08291278A (en) * | 1995-04-21 | 1996-11-05 | Minnesota Mining & Mfg Co <3M> | Hot melt adhesive composition and adhesive film |
JP3754475B2 (en) * | 1995-10-31 | 2006-03-15 | スリーエム カンパニー | Reactive hot melt composition, reactive hot melt composition preparation, film hot melt adhesive |
JPH09263746A (en) * | 1996-03-29 | 1997-10-07 | Sumitomo Kinzoku Electro Device:Kk | Adhesive epoxy resin composition for sealing |
CN1214071A (en) * | 1996-11-26 | 1999-04-14 | 埃勒夫阿托化学有限公司 | Hot-melt adhesives with copolymer base having epox functions |
JP4201858B2 (en) * | 1997-05-13 | 2008-12-24 | スリーエム カンパニー | Thermosetting adhesive composition, production method thereof, and adhesive structure |
JP2000053934A (en) * | 1998-07-28 | 2000-02-22 | Minnesota Mining & Mfg Co <3M> | Adhesive composition and its precursor |
JP4422232B2 (en) * | 1999-04-08 | 2010-02-24 | スリーエム カンパニー | Thermosetting adhesive composition, adhesive and method for producing adhesive |
JP2001107009A (en) * | 1999-09-30 | 2001-04-17 | Three M Innovative Properties Co | Thermosetting adhesive composition and bonded structure using same |
JP2002536460A (en) * | 1999-10-07 | 2002-10-29 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | Thermosetting adhesive composition, adhesive, and method for producing adhesive |
-
1998
- 1998-11-16 JP JP10325369A patent/JP2000144082A/en active Pending
-
1999
- 1999-10-07 AU AU64221/99A patent/AU6422199A/en not_active Abandoned
- 1999-10-07 WO PCT/US1999/023499 patent/WO2000029500A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2000144082A (en) | 2000-05-26 |
WO2000029500A1 (en) | 2000-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |