AU6203900A - Test probe head having encapsulated rigid pins - Google Patents
Test probe head having encapsulated rigid pinsInfo
- Publication number
- AU6203900A AU6203900A AU62039/00A AU6203900A AU6203900A AU 6203900 A AU6203900 A AU 6203900A AU 62039/00 A AU62039/00 A AU 62039/00A AU 6203900 A AU6203900 A AU 6203900A AU 6203900 A AU6203900 A AU 6203900A
- Authority
- AU
- Australia
- Prior art keywords
- probe head
- test probe
- rigid pins
- encapsulated rigid
- encapsulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (27)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35200099A | 1999-07-12 | 1999-07-12 | |
US35142799A | 1999-07-12 | 1999-07-12 | |
US35128099A | 1999-07-12 | 1999-07-12 | |
US35142299A | 1999-07-12 | 1999-07-12 | |
US35127799A | 1999-07-12 | 1999-07-12 | |
US35127899A | 1999-07-12 | 1999-07-12 | |
US35241399A | 1999-07-12 | 1999-07-12 | |
US35152099A | 1999-07-12 | 1999-07-12 | |
US35127999A | 1999-07-12 | 1999-07-12 | |
US35199999A | 1999-07-12 | 1999-07-12 | |
US09351423 | 1999-07-12 | ||
US09351278 | 1999-07-12 | ||
US09351999 | 1999-07-12 | ||
US09351280 | 1999-07-12 | ||
US09351422 | 1999-07-12 | ||
US09352000 | 1999-07-12 | ||
US09352413 | 1999-07-12 | ||
US09351277 | 1999-07-12 | ||
US09/351,423 US6330744B1 (en) | 1999-07-12 | 1999-07-12 | Customized electrical test probe head using uniform probe assemblies |
US09351520 | 1999-07-12 | ||
US09351427 | 1999-07-12 | ||
US09351279 | 1999-07-12 | ||
US45398999A | 1999-12-02 | 1999-12-02 | |
US45284199A | 1999-12-02 | 1999-12-02 | |
US09453989 | 1999-12-02 | ||
US09452841 | 1999-12-02 | ||
PCT/US2000/018196 WO2001004650A1 (en) | 1999-07-12 | 2000-06-30 | Test probe head having encapsulated rigid pins |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6203900A true AU6203900A (en) | 2001-01-30 |
Family
ID=27584597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU62039/00A Abandoned AU6203900A (en) | 1999-07-12 | 2000-06-30 | Test probe head having encapsulated rigid pins |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU6203900A (en) |
WO (1) | WO2001004650A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050253602A1 (en) | 2004-04-28 | 2005-11-17 | Cram Daniel P | Resilient contact probe apparatus, methods of using and making, and resilient contact probes |
CN113030700B (en) * | 2021-03-04 | 2022-03-08 | 强一半导体(苏州)有限公司 | Wafer-level test probe card and wafer-level test probe card assembling method |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4963821A (en) * | 1989-04-14 | 1990-10-16 | Tektronix, Inc. | Probe and method for testing a populated circuit board |
US5098864A (en) * | 1989-11-29 | 1992-03-24 | Olin Corporation | Process for manufacturing a metal pin grid array package |
US5102829A (en) * | 1991-07-22 | 1992-04-07 | At&T Bell Laboratories | Plastic pin grid array package |
KR100196195B1 (en) * | 1991-11-18 | 1999-06-15 | 이노우에 쥰이치 | Probe card |
US5400220A (en) * | 1994-05-18 | 1995-03-21 | Dell Usa, L.P. | Mechanical printed circuit board and ball grid array interconnect apparatus |
-
2000
- 2000-06-30 AU AU62039/00A patent/AU6203900A/en not_active Abandoned
- 2000-06-30 WO PCT/US2000/018196 patent/WO2001004650A1/en active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
WO2001004650A9 (en) | 2002-07-25 |
WO2001004650A1 (en) | 2001-01-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |