AU614930B2 - Method of flooring ground in a house - Google Patents

Description

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PCT

AU-AI -75822/87 4 4 1.9 qjj~gt li NZ Wfli 4'ZN ft~fiI E04F 15/12, 15/18 (1 ~i#IW 8 62 (43) M~eV61 1988Ef8)E25E (25.08.88) (21) ff*P PCT/JIP87/00424 (22) 99F 1987!46A2SE3(25. 06. 87) (31) (Ac NA:4 .4q862-35843 (32) 1 31cB 1987412,920B(2. 02. 87) (71) fff.

(DOW YAKOR KABUSHIKI KAISLA.)(JP/JP) (72) RM (EBARA, Yukihisa)(JP/JP) J. P. 13 OCT 1988 Tokyo, (JP) (74) ftlt)I

AUSTRALIAN

jT E9J (TOYODA, Yo sh io) 0 1 O4t 9 0A- 404M 14 SEP 1988 Tokyo. (JP) II PATENT OFFICE (54) Title: METHOD OF FLOORING GROUND IN A HOUSE (57) Abstract Method of flooring ground in house which includes laying plastic films and foamed synthetic resin plates on the ground, wherein the plastic films are bonded to the lower surface or the both surfaces of the synthetic resin plates in advance.

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SPECIFICATION

Title of the Invention A method for constructing a floor for earthen floor Technical Field This invention relates to a method for constructing a floor for earthen floor which excels in heat insulation, moisture proofing, soundproofing, etc. by forming a floor on the ground without leaving a space below the floor.

I>.l Heretofore, a floor for earthen floor was constructed :by putting fill as required to adjust the ground level, S.paving broken stones, laying a plastic film (hereinafter o o S called "film") and a heat insulating material successively but independently thereon, and applying concrete thereon.

As the heat insulating material, a hard synthetic resin foam board (hereinafter called "foam board"), and the film is one o which functions as a moistureproofing layer.

o Sand is lightly sprinkled over the broken stones to level the surface but, since the floor comes to be instable if the broken stone layer is thickly covered with sand, sand o is used to an extent to fill the gaps formed among the oooo• qS l0-

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1 1 broken stones, so that it is hard to prevent the broken stones from contacting with the film and heat insulating material thereon. Besides, the film and the heat insulating material are laid independently over a wide area, so that to lay the heat insulating material after laying the film, it is necessary to step on the film to lay the heat insulating material, then after laying the heat insulating material, it is still necessary to stand thereon to apply concrete on it.

As described above, since the film and heat insulating material are often stepped on, the film is pressed against and broken by the corners of the broken stones when the floor is under construction and the workers might kick to break the film, resulting in ruining the possibility of attaining a prescribed moistureproofness. When a foam board is used as the heat insulating material, it is readily broken by the workers stepping on it, and since it is light weighted, the broken sections are scattered by the wind and broken off, causing to 3rer the heat insulating properties.

The present invention aims to prevent the degradation of the moistureproofness due to the breakage of the film and the heat insulating properties due to the breaking off of the foam board broken during the construction of the floor for earthen floor.

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2 The above objects can be accomplished bypaving- stones on the ground, laying foam boards which have their one or both sides joined to a film, and applying concrete thereon.

According to this invention, since the film for giving moistureproofness to the floor for earthen floor to be constructed and the foam board as the heat insulating material are joined together in advance, they are laid simultaneously. Therefore, this is better in workability as compared with a conventional method which lays the film and the foam board independently. And, since the film and the foam board can be laid without requiring the workers to booodi stand on them directly and the film is integrally joined to the foam board in advance so as to be hardly broken when constructed, the moistureproofness is hardly lowered by the damage of the film under construction.

On the other hand, the foam board is reinforced by adhering the film to the lower side or both sides of the foam board, so that the foam board is hardly broken even when a worker stands on the foam board when applying concrete or the like. Besides, even if the foam board is broken, thanks to the film, the broken sections are pro- S tected from being blown off by the wind. Thus, the heat insulating properties are not greatly degraded by the breaking off.

ooooo 3 I 1 Particularly, by joining the film to the both sides of the foam board, the moistureproofing layer is structured doubly by the top and bottom films, providing a high moistureproofing effect synergistically, and by sandwiching the foam board between the both films, the foam board can be reinforced highly.

Now, the present invention will be described more in detail with reference to the drawings below.

Fig. 1 is a vertical sectional view showing part of the floor for earthen floor structured using a foam board 4 having a film 3 adhered to its bottom side in advance, Fig.

:0 2 is a vertical sectional view showing part of the floor for earthen floor constructed using a foam board 4 having filv;s 3a, 3b joined to its both sides in advance, Fig. 3 is an explanatory view laying a foam board 4 having a film 3 joined to its bottom side in advance, and Fig. 4 and Fig. are each an explanatory view of laying a foam board 4 having films 3a, 3b joined to its both sides in advance.

In Fig. 1 and Fig. 2, 6 is a base, and the inner ground 1 is adjusted its height by putting fill as required. On the outer face of the base 6, a heat insulating material 7 is preferably applied to prevent heat from escaping Si sideways. This heat insulating material 7 may have the same

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4 material as or different from a foam board 4 to be described afterward.

Inside the base 6, stones 2 are paved on the ground 1.

As the stones 2, broken stones, gravel, pebbles, etc. may be used for example.

The thickness of the layer of stones 2 may be determined suitably depending on the hardness of the ground 1. On the layer of stones 2, sand 8 is sprinkled to fill the gaps among stones 2 to make the top face substantially smooth. As a result, a foam board 4 provided with a film 3 or films 3a, 3b is readily disposed horizontally so that the floor surface can be made horizontal easily.

Then, a foam board 4 having a film 3 or films 3a, 3b adhered to the bottom side or the both sides in advance is laid on the stones 2.

As the films 3, 3a, 3b, those prepared by coating or .0 laminating a heat sealing plastic such as ethylene-vinyl acetate copolymer or ethylene-acrylic acid copolymer to polyethylene, polypropylene, polyvinyl chloride, etc. can be goo*o suitably used. With these films 3, 3a, 3b, the adhesion to the foam board 4 can be done by utilizing the heat melt S. bonding of the above heat sealing plastic layer. Another film may be joined to the foam board 4 by means of an adhesive or the like.

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5 The foam board 4 is preferably hard so that it can bear a load from the floor surface. Specifically, its examples include polystyrene, polyurethane, polyethylene, polyvinyl chloride, phenolic resin and other foam bodies, and still other foam bodies having inorganic fillers added to those plastics. Most preferable ones are Styrofoam (trademark) and other extruded foam polystyrene boards. Since the foam board 4 is protected from water by the film 3 on its bottom side or the films 3a, 3b on its both sides, it is not required to be a skin board but may sufficiently be a cut board. And the foam board 4 is preferably needed to have a compression strength of about 2 kgf/cm 2 or above so that it can bear a load.

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S. As for the earthen floor, it is preferable to have a functions that when a room temperature rises excessively S high, it lets heat leave by some extent into the ground 1 and accumulates that heat in the ground 1 in combination with the heat sealing material 7 applied to the outside of the base, and when the room temperature lowers, that accumu- *ease: S lated heat is released into the room. Therefore, the foam board 4 is preferred to have a heat conductivity of about 0.015-0.040 kcal.Hr.°C, a thickness of 20-100 mm, optimally about 25-50 mm rather than to have a thickness with an excessively high heat insulating properties.

oo C .oeo -6 I ii L~ Laying the foam board 4 which has the film 3 joined to its bottom side or the films 3a, 3b on its both sides in advance can be done by simply putting neighboring foam boards 4 side by side. But, to enhance the moistureproofness of the joined section, it is preferable to do as follows: First, as shown in Fig. 3 and Fig. 4, the film 3 or the film 3a (may be the film 3b) is arranged to project out of the foam board 4, and the neighboring foam board 4 with the film 3 or the films 3a, 3b is laid on the above projected portion, so that the moistureproofness at the joined section can be enhanced. As shown in Fig. 5, the moistureproofness S' at the joined section can be further enhanced by projecting the both films 3a, 3b out of the foam board 4 and covering the top and bottom of the joined section of the foam boards .g 4 with the projected parts.

*o On the foam board 4 with the film 3 or the film 3a, 3b e* laid as described above, concrete 5 is applied, then its surface is finished with a conditioning mortar 9 to complete the construction of the floor for earthen floor. When the 0 floor area is wide, the concrete 5 is preferably applied after arranging bars on the foam board 4 with the film 3 or A" the films 3a, 3b.

*7 SS3b e e esa 7 In Fig. 1 and Fig. 2, 10 is a finishing mortar for the base 6, 11 a base, 12 an external wall material, and 13 calking.

According to the present invention, the damage to the film 3 or the films 3a, 3b under construction does not greatly lower the moistureproofness of the floor and the breakage in the foam board 4 does not largely lower the heat insulating properties. Thus a comfortable room environment can be attained as designed. Besides, workability is improved and a working time can be shortened.

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Claims (5)

1. A method for constructing a floor for earthen floor which comprises laying stones on the ground, placing sheets of heat insulating material, which comprise synthetic resin foam boards having a plastic film integrlly joined to their bottom side, in edge-to-edge abutting relationship on the stones, and applying concrete on said sheets.

2. A method for constructing a floor for earthen floor which comprises laying stones on the ground, placing sheets of heat insulating material, which comprise synthetic resin foam boards having a plastic film intcgrlly joine to their bottom and top sides, in edge-to-edge abutting relationship on the stones, and applying concrete on said sheets.

3. A method for constructing a floor for earthen floor substantially as hereinbefore described with reference to (a OA one of Figa. 1 to DATED: 15 February, 1991 DOW KAKOH KABUSHIKI KAISHA By their Patent Attorneys: PHILLIPC ORMONDE FITZPATRICK 0 o D 0 SOS* *050 7 7 4 T y W r any one of Figs. 2, 4 and

4. A method for constructing a f loor for earthern f loor substantially as hereinbefore described with reference to either one of Figures 1 or 3. DATED: 25 June 1991 DOW IKAKOR KABUSHIKI KAISHA By their Patent Attorneys: PHILLIPS ORMONDE FITZPATRICK *T C

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