AU6093199A - Method for mounting an electric of electronic installation and heat exchanger for power electrical or electronic components - Google Patents
Method for mounting an electric of electronic installation and heat exchanger for power electrical or electronic componentsInfo
- Publication number
- AU6093199A AU6093199A AU60931/99A AU6093199A AU6093199A AU 6093199 A AU6093199 A AU 6093199A AU 60931/99 A AU60931/99 A AU 60931/99A AU 6093199 A AU6093199 A AU 6093199A AU 6093199 A AU6093199 A AU 6093199A
- Authority
- AU
- Australia
- Prior art keywords
- mounting
- electric
- heat exchanger
- power electrical
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000009434 installation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9812715 | 1998-10-07 | ||
FR9812715A FR2784537A1 (en) | 1998-10-07 | 1998-10-07 | METHOD FOR ASSEMBLING AN ELECTRICAL OR ELECTRONIC POWER INSTALLATION AND HEAT EXCHANGER FOR ELECTRICAL OR ELECTRONIC POWER COMPONENTS |
PCT/FR1999/002406 WO2000021131A1 (en) | 1998-10-07 | 1999-10-07 | Method for mounting an electric of electronic installation and heat exchanger for power electrical or electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6093199A true AU6093199A (en) | 2000-04-26 |
Family
ID=9531410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU60931/99A Abandoned AU6093199A (en) | 1998-10-07 | 1999-10-07 | Method for mounting an electric of electronic installation and heat exchanger for power electrical or electronic components |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU6093199A (en) |
FR (1) | FR2784537A1 (en) |
WO (1) | WO2000021131A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1154679A1 (en) * | 2000-05-12 | 2001-11-14 | Troy Reid | Cooling device for electronic equipment and cooling system for computer |
EP1249868A1 (en) | 2001-04-12 | 2002-10-16 | ABB Schweiz AG | Cooling device for an electronic component as well as cooling system using those cooling devices |
DE10335197B4 (en) * | 2003-07-30 | 2005-10-27 | Kermi Gmbh | Cooling device for an electronic component, in particular for a microprocessor |
DE102009054585A1 (en) * | 2009-12-14 | 2011-06-16 | Robert Bosch Gmbh | control unit |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4166665A (en) * | 1976-12-27 | 1979-09-04 | Cutchaw John M | Liquid cooled connector for large scale integrated circuit packages |
US4721996A (en) * | 1986-10-14 | 1988-01-26 | Unisys Corporation | Spring loaded module for cooling integrated circuit packages directly with a liquid |
US4830623A (en) * | 1988-02-10 | 1989-05-16 | Rogers Corporation | Connector arrangement for electrically interconnecting first and second arrays of pad-type contacts |
US5662163A (en) * | 1995-11-29 | 1997-09-02 | Silicon Graphics, Inc. | Readily removable heat sink assembly |
-
1998
- 1998-10-07 FR FR9812715A patent/FR2784537A1/en active Pending
-
1999
- 1999-10-07 AU AU60931/99A patent/AU6093199A/en not_active Abandoned
- 1999-10-07 WO PCT/FR1999/002406 patent/WO2000021131A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2000021131A1 (en) | 2000-04-13 |
FR2784537A1 (en) | 2000-04-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |