AU5577200A - Electro-magnetic interference shielding structure with thin film comprising buffer layer and preparing process therefor - Google Patents

Electro-magnetic interference shielding structure with thin film comprising buffer layer and preparing process therefor

Info

Publication number
AU5577200A
AU5577200A AU55772/00A AU5577200A AU5577200A AU 5577200 A AU5577200 A AU 5577200A AU 55772/00 A AU55772/00 A AU 55772/00A AU 5577200 A AU5577200 A AU 5577200A AU 5577200 A AU5577200 A AU 5577200A
Authority
AU
Australia
Prior art keywords
electro
thin film
buffer layer
shielding structure
magnetic interference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU55772/00A
Inventor
Jin-Bong Jung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANTECH CO Ltd
Original Assignee
HANTECH CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANTECH CO Ltd filed Critical HANTECH CO Ltd
Publication of AU5577200A publication Critical patent/AU5577200A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
AU55772/00A 2000-05-01 2000-06-30 Electro-magnetic interference shielding structure with thin film comprising buffer layer and preparing process therefor Abandoned AU5577200A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR0023277 2000-05-01
KR10-2000-0023277A KR100371931B1 (en) 2000-05-01 2000-05-01 Electro-magnetic interference shielding structure with thin film comprising buffer layer and preparing process therefor
PCT/KR2000/000699 WO2001084899A1 (en) 2000-05-01 2000-06-30 Electro-magnetic interference shielding structure with thin film comprising buffer layer and preparing process therefor

Publications (1)

Publication Number Publication Date
AU5577200A true AU5577200A (en) 2001-11-12

Family

ID=19667821

Family Applications (1)

Application Number Title Priority Date Filing Date
AU55772/00A Abandoned AU5577200A (en) 2000-05-01 2000-06-30 Electro-magnetic interference shielding structure with thin film comprising buffer layer and preparing process therefor

Country Status (3)

Country Link
KR (1) KR100371931B1 (en)
AU (1) AU5577200A (en)
WO (1) WO2001084899A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100673531B1 (en) * 2005-01-31 2007-01-24 주식회사 에이엠아이 씨 Thin electromagnetic shielding tape, electromagnetic shielding structure using thereof and manufacturing method thereof
KR100882098B1 (en) * 2007-10-31 2009-02-10 삼성전기주식회사 Low temperature co-fired ceramics and method of manufacturing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01207994A (en) * 1988-02-16 1989-08-21 Seiko Epson Corp Base material for electromagnetic wave shielding
JPH0282696A (en) * 1988-09-20 1990-03-23 Oike Ind Co Ltd Metal thin film laminate structure for electromagnetic wave shield
JPH02111000A (en) * 1988-10-19 1990-04-24 Oike Ind Co Ltd Metallic thin film laminate for electromagnetic shielding
JPH03246999A (en) * 1990-02-23 1991-11-05 Michio Arai Sheet material for electromagnetic wave shielding
US5132191A (en) * 1990-10-26 1992-07-21 General Electric Company Polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
KR20010046524A (en) * 1999-11-12 2001-06-15 김덕영 Transparent Anti-Radiation case for cellular phone

Also Published As

Publication number Publication date
WO2001084899A1 (en) 2001-11-08
KR20010100358A (en) 2001-11-14
KR100371931B1 (en) 2003-02-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase