AU553298B2 - Flexible substrate with glass layers - Google Patents

Flexible substrate with glass layers

Info

Publication number
AU553298B2
AU553298B2 AU31142/84A AU3114284A AU553298B2 AU 553298 B2 AU553298 B2 AU 553298B2 AU 31142/84 A AU31142/84 A AU 31142/84A AU 3114284 A AU3114284 A AU 3114284A AU 553298 B2 AU553298 B2 AU 553298B2
Authority
AU
Australia
Prior art keywords
glass
layer
substrates
glass layer
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU31142/84A
Other languages
English (en)
Other versions
AU3114284A (en
Inventor
Yukiko Fujimaki
Hideyo Iida
Koumei Kato
Toshio Mishuku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Publication of AU3114284A publication Critical patent/AU3114284A/en
Application granted granted Critical
Publication of AU553298B2 publication Critical patent/AU553298B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D5/00—Coating with enamels or vitreous layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D5/00—Coating with enamels or vitreous layers
    • C23D5/02—Coating with enamels or vitreous layers by wet methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H10F77/1692—Thin semiconductor films on metallic or insulating substrates the films including only Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249967—Inorganic matrix in void-containing component
    • Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249967—Inorganic matrix in void-containing component
    • Y10T428/24997—Of metal-containing material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Photovoltaic Devices (AREA)
  • Glass Compositions (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Surface Treatment Of Glass (AREA)
AU31142/84A 1984-03-07 1984-07-25 Flexible substrate with glass layers Ceased AU553298B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59-44554 1984-03-07
JP59044554A JPH0652795B2 (ja) 1984-03-07 1984-03-07 可撓性非晶質半導体太陽電池

Publications (2)

Publication Number Publication Date
AU3114284A AU3114284A (en) 1985-09-12
AU553298B2 true AU553298B2 (en) 1986-07-10

Family

ID=12694716

Family Applications (1)

Application Number Title Priority Date Filing Date
AU31142/84A Ceased AU553298B2 (en) 1984-03-07 1984-07-25 Flexible substrate with glass layers

Country Status (5)

Country Link
US (1) US4510195A (enExample)
JP (1) JPH0652795B2 (enExample)
AU (1) AU553298B2 (enExample)
DE (1) DE3428559C2 (enExample)
FR (1) FR2560818B1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142584A (ja) * 1983-12-28 1985-07-27 川崎製鉄株式会社 プリント基板およびその製造方法
US4772564A (en) * 1985-10-30 1988-09-20 Astrosystems, Inc. Fault tolerant thin-film photovoltaic cell fabrication process
US4781766A (en) * 1985-10-30 1988-11-01 Astrosystems, Inc. Fault tolerant thin-film photovoltaic cell and method
US4677250A (en) * 1985-10-30 1987-06-30 Astrosystems, Inc. Fault tolerant thin-film photovoltaic cell
US4983423A (en) * 1988-05-24 1991-01-08 Ceramem Corporation Method of forming a porous inorganic membrane on a porous support using a reactive inorganic binder
US4971633A (en) * 1989-09-26 1990-11-20 The United States Of America As Represented By The Department Of Energy Photovoltaic cell assembly
EP1535353A2 (de) * 2002-09-05 2005-06-01 Siemens Aktiengesellschaft Organisches photovoltaisches bauelement und herstellungsverfahren dazu
TWI240426B (en) * 2005-01-13 2005-09-21 Chung-Hua Li Manufacturing method for laminated structure of solar cell, electrode of solar cell, and the solar cell
KR100719554B1 (ko) * 2005-07-06 2007-05-17 삼성에스디아이 주식회사 평판 디스플레이 장치 및 그 제조방법
JP2009502027A (ja) * 2005-07-15 2009-01-22 コナルカ テクノロジーズ インコーポレイテッド 回折用フォイル
WO2010088446A2 (en) * 2009-02-02 2010-08-05 Dow Global Technologies Inc. Robust photovoltaic cell
WO2011135195A1 (fr) * 2010-11-16 2011-11-03 Arcelormittal Investigación Y Desarrollo Sl Support d'alimentation pour dispositifs électroniques
EP2662908B1 (en) * 2012-04-20 2016-11-30 Acreo Swedish ICT AB Thermoelectric device based on ion transport
EP3527363A1 (en) * 2013-01-07 2019-08-21 Corning Incorporated Strengthened laminated glass structures
KR20150123837A (ko) * 2013-02-21 2015-11-04 코닝 인코포레이티드 강화된 소결 유리 구조의 제조 방법
JP6305515B2 (ja) * 2013-04-10 2018-04-04 ショット グラス テクノロジーズ （スゾウ） カンパニー リミテッドＳｃｈｏｔｔ Ｇｌａｓｓ Ｔｅｃｈｎｏｌｏｇｉｅｓ （Ｓｕｚｈｏｕ） Ｃｏ．， Ｌｔｄ． フレキシブルガラス／金属箔複合物品およびそれらの製造方法
DE102015110107A1 (de) * 2015-06-24 2016-12-29 Schott Ag Flexibler Verbundkörper, umfassend Glas und ein flexibles Substrat, sowie Verfahren zu dessen Herstellung
JP6524382B2 (ja) * 2017-10-03 2019-06-05 直文 蕨 気泡を内包したガラス層を具備した金属又はセラミックスとガラスの複合体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1154752B (de) * 1960-03-03 1963-09-19 Wasagchemie Ag Verfahren zur Herstellung von glasartigen poroesen Formkoerpern
BE646554A (enExample) * 1963-05-16 1964-10-14
US3330627A (en) * 1963-09-09 1967-07-11 Titanium Metals Corp Corrosion resistant chlorinator lining
US3523817A (en) * 1967-07-17 1970-08-11 Lisk Savory Corp Anti-sticking enameled cooking utensil
US3627560A (en) * 1969-01-13 1971-12-14 Fedders Corp Self-cleaning cooking apparatus
US3605999A (en) * 1969-07-23 1971-09-20 Aerojet General Co Insulative coated metal substrates and apparatus for holding substrates
JPS5113821A (en) * 1974-07-24 1976-02-03 Kogyo Gijutsuin Tahohoro oyobi sonoseizohoho
US4024309A (en) * 1975-03-17 1977-05-17 Ronald P. Wilder Foam glass structural element and method of producing
US3961997A (en) * 1975-05-12 1976-06-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Fabrication of polycrystalline solar cells on low-cost substrates
JPS55154573U (enExample) * 1979-04-20 1980-11-07
GB2054958A (en) * 1979-07-23 1981-02-18 Gen Electric Co Ltd Substrate for a microwave integrated circuit
CS219732B1 (en) * 1981-01-21 1983-03-25 Radomir Kuzel Method of making the isolation coatings on the steel products
DE3113745A1 (de) * 1981-04-04 1982-10-21 Robert Bosch Gmbh, 7000 Stuttgart Duennschicht-dehnungsmessstreifen und verfahren zu seiner herstellung
EP0078541B1 (en) * 1981-11-04 1991-01-16 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Flexible photovoltaic device
JPS5989772A (ja) * 1982-11-15 1984-05-24 Matsushita Electric Works Ltd ほうろう製品の製造法

Also Published As

Publication number Publication date
DE3428559C2 (de) 1986-10-23
JPS60189286A (ja) 1985-09-26
FR2560818B1 (fr) 1988-01-22
FR2560818A1 (fr) 1985-09-13
US4510195A (en) 1985-04-09
DE3428559C3 (enExample) 1991-12-12
AU3114284A (en) 1985-09-12
JPH0652795B2 (ja) 1994-07-06
DE3428559A1 (de) 1985-09-12

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