AU5478800A - Multiple ultraviolet beam solid-state laser systems and methods - Google Patents
Multiple ultraviolet beam solid-state laser systems and methodsInfo
- Publication number
- AU5478800A AU5478800A AU54788/00A AU5478800A AU5478800A AU 5478800 A AU5478800 A AU 5478800A AU 54788/00 A AU54788/00 A AU 54788/00A AU 5478800 A AU5478800 A AU 5478800A AU 5478800 A AU5478800 A AU 5478800A
- Authority
- AU
- Australia
- Prior art keywords
- methods
- state laser
- laser systems
- ultraviolet beam
- multiple ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37829799A | 1999-08-20 | 1999-08-20 | |
US09378297 | 1999-08-20 | ||
PCT/US2000/015941 WO2001014096A1 (en) | 1999-08-20 | 2000-06-08 | Multiple ultraviolet beam solid-state laser systems and methods |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5478800A true AU5478800A (en) | 2001-03-19 |
Family
ID=23492552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU54788/00A Abandoned AU5478800A (en) | 1999-08-20 | 2000-06-08 | Multiple ultraviolet beam solid-state laser systems and methods |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU5478800A (en) |
TW (1) | TW464579B (en) |
WO (1) | WO2001014096A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7139294B2 (en) * | 2004-05-14 | 2006-11-21 | Electro Scientific Industries, Inc. | Multi-output harmonic laser and methods employing same |
CN101990729B (en) | 2008-03-31 | 2013-02-27 | 伊雷克托科学工业股份有限公司 | Combining multiple laser beams to form high repetition rate, high average power polarized laser beam |
CN102163793A (en) * | 2011-02-25 | 2011-08-24 | 天津梅曼激光技术有限公司 | Multiple extra-cavity frequency conversion ultraviolet laser |
CN103427325A (en) * | 2012-05-15 | 2013-12-04 | 天津梅曼激光技术有限公司 | Internal cavity and external cavity mixing type non-linear frequency conversion ultraviolet laser |
JP2017100168A (en) * | 2015-12-03 | 2017-06-08 | キヤノン株式会社 | Laser processing device, component manufacturing method, program and recording medium |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5272309A (en) * | 1990-08-01 | 1993-12-21 | Microelectronics And Computer Technology Corporation | Bonding metal members with multiple laser beams |
US5847960A (en) * | 1995-03-20 | 1998-12-08 | Electro Scientific Industries, Inc. | Multi-tool positioning system |
DE69737991T2 (en) * | 1996-11-20 | 2008-04-30 | Ibiden Co., Ltd., Ogaki | LASER PROCESSING DEVICE, METHOD AND DEVICE FOR PRODUCING A MULTILAYER PRINTED PCB |
JPH1190659A (en) * | 1997-09-22 | 1999-04-06 | Nikon Corp | Laser repairing device |
-
2000
- 2000-06-08 WO PCT/US2000/015941 patent/WO2001014096A1/en active Application Filing
- 2000-06-08 AU AU54788/00A patent/AU5478800A/en not_active Abandoned
- 2000-06-12 TW TW89111367A patent/TW464579B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2001014096A1 (en) | 2001-03-01 |
TW464579B (en) | 2001-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |