AU547410B2 - Method for continuous metal deposition from a non- autocatalytic electroless plating bath using electric potential - Google Patents

Method for continuous metal deposition from a non- autocatalytic electroless plating bath using electric potential

Info

Publication number
AU547410B2
AU547410B2 AU75331/81A AU7533181A AU547410B2 AU 547410 B2 AU547410 B2 AU 547410B2 AU 75331/81 A AU75331/81 A AU 75331/81A AU 7533181 A AU7533181 A AU 7533181A AU 547410 B2 AU547410 B2 AU 547410B2
Authority
AU
Australia
Prior art keywords
workpiece
plating
copper
solution
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU75331/81A
Other languages
English (en)
Other versions
AU7533181A (en
Inventor
P.E. Kukanskis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of AU7533181A publication Critical patent/AU7533181A/en
Application granted granted Critical
Publication of AU547410B2 publication Critical patent/AU547410B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU75331/81A 1980-08-12 1981-08-10 Method for continuous metal deposition from a non- autocatalytic electroless plating bath using electric potential Ceased AU547410B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17748680A 1980-08-12 1980-08-12
US177486 1980-08-12

Publications (2)

Publication Number Publication Date
AU7533181A AU7533181A (en) 1982-03-17
AU547410B2 true AU547410B2 (en) 1985-10-17

Family

ID=22648801

Family Applications (1)

Application Number Title Priority Date Filing Date
AU75331/81A Ceased AU547410B2 (en) 1980-08-12 1981-08-10 Method for continuous metal deposition from a non- autocatalytic electroless plating bath using electric potential

Country Status (5)

Country Link
EP (1) EP0057232B1 (enExample)
JP (1) JPH0250196B2 (enExample)
AU (1) AU547410B2 (enExample)
CA (1) CA1177773A (enExample)
WO (1) WO1982000666A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0544075A (ja) * 1991-08-15 1993-02-23 Nippon Riironaale Kk 無電解銅めつき代替銅ストライクめつき方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2644787A (en) * 1950-01-05 1953-07-07 Eckert Mauchly Comp Corp Electrodeposition of a magnetic coating
US3264199A (en) * 1962-06-25 1966-08-02 Ford Motor Co Electroless plating of metals
US3303111A (en) * 1963-08-12 1967-02-07 Arthur L Peach Electro-electroless plating method
US3485725A (en) * 1965-10-08 1969-12-23 Ibm Method of increasing the deposition rate of electroless solutions
GB1222969A (en) * 1967-06-03 1971-02-17 Geigy Uk Ltd Plating process
US3597266A (en) * 1968-09-23 1971-08-03 Enthone Electroless nickel plating
GB1288620A (enExample) * 1969-12-31 1972-09-13
JPS5627594B2 (enExample) * 1975-03-14 1981-06-25
US4086149A (en) * 1976-08-04 1978-04-25 Ppg Industries, Inc. Cathode electrocatalyst
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
JPS5844738B2 (ja) * 1980-10-09 1983-10-05 関東化成工業株式会社 複合めつき方法

Also Published As

Publication number Publication date
WO1982000666A1 (en) 1982-03-04
AU7533181A (en) 1982-03-17
EP0057232A1 (en) 1982-08-11
JPH0250196B2 (enExample) 1990-11-01
EP0057232A4 (en) 1982-12-15
CA1177773A (en) 1984-11-13
EP0057232B1 (en) 1987-03-25
JPS57501188A (enExample) 1982-07-08

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