AU4715300A - Microfabricated template for multiple charged particle beam calibrations and shielded charged particle beam lithography - Google Patents

Microfabricated template for multiple charged particle beam calibrations and shielded charged particle beam lithography

Info

Publication number
AU4715300A
AU4715300A AU47153/00A AU4715300A AU4715300A AU 4715300 A AU4715300 A AU 4715300A AU 47153/00 A AU47153/00 A AU 47153/00A AU 4715300 A AU4715300 A AU 4715300A AU 4715300 A AU4715300 A AU 4715300A
Authority
AU
Australia
Prior art keywords
charged particle
particle beam
shielded
calibrations
microfabricated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU47153/00A
Inventor
T. H. P. Chang
Ho-Seob Kim
Kim Y. Lee
Marian Mankos
Lawrence Muray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Etec Systems Inc
Original Assignee
Etec Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Etec Systems Inc filed Critical Etec Systems Inc
Publication of AU4715300A publication Critical patent/AU4715300A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/10—Lenses
    • H01J2237/12—Lenses electrostatic
    • H01J2237/1205—Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
AU47153/00A 1999-05-03 2000-05-03 Microfabricated template for multiple charged particle beam calibrations and shielded charged particle beam lithography Abandoned AU4715300A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US30450599A 1999-05-03 1999-05-03
US09304505 1999-05-03
PCT/US2000/040082 WO2000067291A2 (en) 1999-05-03 2000-05-03 Microfabricated template for multiple charged particle beam calibrations and shielded charged particle beam lithography

Publications (1)

Publication Number Publication Date
AU4715300A true AU4715300A (en) 2000-11-17

Family

ID=23176813

Family Applications (1)

Application Number Title Priority Date Filing Date
AU47153/00A Abandoned AU4715300A (en) 1999-05-03 2000-05-03 Microfabricated template for multiple charged particle beam calibrations and shielded charged particle beam lithography

Country Status (7)

Country Link
EP (1) EP1135789A2 (en)
JP (1) JP2002543607A (en)
KR (1) KR20010100758A (en)
AU (1) AU4715300A (en)
CA (1) CA2336557A1 (en)
IL (1) IL140714A0 (en)
WO (1) WO2000067291A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4677109B2 (en) * 2001-03-06 2011-04-27 株式会社トプコン Reference template manufacturing method and reference template manufactured by the method
EP1768162A3 (en) 2001-10-05 2007-05-09 ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik Mbh Multiple electron beam device
US8122846B2 (en) 2005-10-26 2012-02-28 Micronic Mydata AB Platforms, apparatuses, systems and methods for processing and analyzing substrates
WO2007050023A1 (en) 2005-10-26 2007-05-03 Micronic Laser Systems Ab Writing apparatuses and methods
EP2117035B1 (en) * 2007-03-02 2017-06-14 Advantest Corporation Multi-column electron beam exposure apparatuses and methods
JP6453780B2 (en) 2013-03-12 2019-01-16 マイクロニック アーベーＭｙｃｒｏｎｉｃ Ａｂ Method and apparatus for mechanically formed alignment reference body
WO2014140047A2 (en) 2013-03-12 2014-09-18 Micronic Mydata AB Method and device for writing photomasks with reduced mura errors
CN112397363B (en) * 2020-09-28 2022-08-30 西安增材制造国家研究院有限公司 Electron gun beam spot correction device and correction method
DE102021120913B3 (en) * 2021-08-11 2023-02-09 Carl Zeiss Smt Gmbh Device for analyzing and/or processing a sample with a particle beam and method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1100237A (en) * 1977-03-23 1981-04-28 Roger F.W. Pease Multiple electron beam exposure system
DE3020809A1 (en) * 1980-06-02 1981-12-10 M.A.N. Maschinenfabrik Augsburg-Nürnberg AG, 8000 München METHOD FOR PRODUCING AN ELECTRON BEAM LEFT WINDOW
US4528452A (en) * 1982-12-09 1985-07-09 Electron Beam Corporation Alignment and detection system for electron image projectors
EP0289885A1 (en) * 1987-05-08 1988-11-09 Siemens Aktiengesellschaft Aperture system for production of several partical probes with changeable cross-section
US5012105A (en) * 1989-02-02 1991-04-30 Nippon Seiko Kabushiki Kaisha Multiple-imaging charged particle-beam exposure system
US4987311A (en) * 1989-08-08 1991-01-22 Etec Systems, Inc. Electron-detector diode biassing scheme for improved writing by an electron beam lithography machine
US5155412A (en) * 1991-05-28 1992-10-13 International Business Machines Corporation Method for selectively scaling a field emission electron gun and device formed thereby
US5122663A (en) * 1991-07-24 1992-06-16 International Business Machine Corporation Compact, integrated electron beam imaging system
JP3033484B2 (en) * 1995-12-21 2000-04-17 日本電気株式会社 Electron beam exposure equipment
US5838006A (en) * 1996-10-17 1998-11-17 Etec Systems, Inc. Conical baffle for reducing charging drift in a particle beam system
US5831272A (en) * 1997-10-21 1998-11-03 Utsumi; Takao Low energy electron beam lithography
US6989546B2 (en) * 1998-08-19 2006-01-24 Ims-Innenmikrofabrikations Systeme Gmbh Particle multibeam lithography

Also Published As

Publication number Publication date
WO2000067291A2 (en) 2000-11-09
CA2336557A1 (en) 2000-11-09
EP1135789A2 (en) 2001-09-26
KR20010100758A (en) 2001-11-14
WO2000067291A3 (en) 2001-07-05
IL140714A0 (en) 2002-02-10
JP2002543607A (en) 2002-12-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase