AU4651493A - Electronic package with stress relief channel - Google Patents

Electronic package with stress relief channel

Info

Publication number
AU4651493A
AU4651493A AU46514/93A AU4651493A AU4651493A AU 4651493 A AU4651493 A AU 4651493A AU 46514/93 A AU46514/93 A AU 46514/93A AU 4651493 A AU4651493 A AU 4651493A AU 4651493 A AU4651493 A AU 4651493A
Authority
AU
Australia
Prior art keywords
stress relief
electronic package
relief channel
channel
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU46514/93A
Other languages
English (en)
Inventor
Jacob Crane
Deepak Mahulikar
Brian Mravic
Brian E. O'donnelly
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of AU4651493A publication Critical patent/AU4651493A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W40/77—
    • H10W42/121—
    • H10W72/071—
    • H10W76/134—
    • H10W70/682—
    • H10W72/07352—
    • H10W72/321—
    • H10W72/352—
    • H10W72/354—
    • H10W72/381—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/884—
    • H10W90/756—
AU46514/93A 1992-07-13 1993-06-28 Electronic package with stress relief channel Abandoned AU4651493A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/912,535 US5315155A (en) 1992-07-13 1992-07-13 Electronic package with stress relief channel
US912535 1992-07-13
PCT/US1993/006083 WO1994001886A1 (en) 1992-07-13 1993-06-28 Electronic package with stress relief channel

Publications (1)

Publication Number Publication Date
AU4651493A true AU4651493A (en) 1994-01-31

Family

ID=25432090

Family Applications (1)

Application Number Title Priority Date Filing Date
AU46514/93A Abandoned AU4651493A (en) 1992-07-13 1993-06-28 Electronic package with stress relief channel

Country Status (5)

Country Link
US (1) US5315155A (cg-RX-API-DMAC10.html)
AU (1) AU4651493A (cg-RX-API-DMAC10.html)
MX (1) MX9304184A (cg-RX-API-DMAC10.html)
TW (1) TW224183B (cg-RX-API-DMAC10.html)
WO (1) WO1994001886A1 (cg-RX-API-DMAC10.html)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766325A (ja) * 1993-08-26 1995-03-10 Rohm Co Ltd 合成樹脂パッケージ型電子部品の構造
JP3233535B2 (ja) * 1994-08-15 2001-11-26 株式会社東芝 半導体装置及びその製造方法
JPH11509372A (ja) * 1995-07-14 1999-08-17 オリン コーポレイション 金属ボール・グリッド電子パッケージ
JP2904141B2 (ja) * 1996-08-20 1999-06-14 日本電気株式会社 半導体装置
US6281572B1 (en) * 1997-12-05 2001-08-28 The Charles Stark Draper Laboratory, Inc. Integrated circuit header assembly
US6749105B2 (en) * 2002-03-21 2004-06-15 Motorola, Inc. Method and apparatus for securing a metallic substrate to a metallic housing
US6946742B2 (en) * 2002-12-19 2005-09-20 Analog Devices, Inc. Packaged microchip with isolator having selected modulus of elasticity
US6768196B2 (en) 2002-09-04 2004-07-27 Analog Devices, Inc. Packaged microchip with isolation
US20040041254A1 (en) * 2002-09-04 2004-03-04 Lewis Long Packaged microchip
US7166911B2 (en) * 2002-09-04 2007-01-23 Analog Devices, Inc. Packaged microchip with premolded-type package
US20050056870A1 (en) * 2002-12-19 2005-03-17 Karpman Maurice S. Stress sensitive microchip with premolded-type package
JP4338620B2 (ja) * 2004-11-01 2009-10-07 三菱電機株式会社 半導体装置及びその製造方法
US8344487B2 (en) * 2006-06-29 2013-01-01 Analog Devices, Inc. Stress mitigation in packaged microchips
US8174830B2 (en) * 2008-05-06 2012-05-08 Rockwell Collins, Inc. System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
US7915527B1 (en) 2006-08-23 2011-03-29 Rockwell Collins, Inc. Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings
US8076185B1 (en) 2006-08-23 2011-12-13 Rockwell Collins, Inc. Integrated circuit protection and ruggedization coatings and methods
US8617913B2 (en) * 2006-08-23 2013-12-31 Rockwell Collins, Inc. Alkali silicate glass based coating and method for applying
US8581108B1 (en) 2006-08-23 2013-11-12 Rockwell Collins, Inc. Method for providing near-hermetically coated integrated circuit assemblies
US8084855B2 (en) 2006-08-23 2011-12-27 Rockwell Collins, Inc. Integrated circuit tampering protection and reverse engineering prevention coatings and methods
US8166645B2 (en) 2006-08-23 2012-05-01 Rockwell Collins, Inc. Method for providing near-hermetically coated, thermally protected integrated circuit assemblies
US8637980B1 (en) 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
US7694610B2 (en) * 2007-06-27 2010-04-13 Siemens Medical Solutions Usa, Inc. Photo-multiplier tube removal tool
US8363189B2 (en) * 2007-12-18 2013-01-29 Rockwell Collins, Inc. Alkali silicate glass for displays
US8205337B2 (en) * 2008-09-12 2012-06-26 Rockwell Collins, Inc. Fabrication process for a flexible, thin thermal spreader
US8650886B2 (en) * 2008-09-12 2014-02-18 Rockwell Collins, Inc. Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections
US8221089B2 (en) * 2008-09-12 2012-07-17 Rockwell Collins, Inc. Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader
US8017872B2 (en) * 2008-05-06 2011-09-13 Rockwell Collins, Inc. System and method for proportional cooling with liquid metal
US8616266B2 (en) * 2008-09-12 2013-12-31 Rockwell Collins, Inc. Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
US8119040B2 (en) 2008-09-29 2012-02-21 Rockwell Collins, Inc. Glass thick film embedded passive material
JP2011014615A (ja) * 2009-06-30 2011-01-20 Denso Corp センサ装置およびその製造方法
WO2011013776A1 (ja) * 2009-07-31 2011-02-03 旭硝子株式会社 半導体デバイス用封着ガラス、封着材料、封着材料ペースト、および半導体デバイスとその製造方法
RU2480860C2 (ru) * 2009-12-31 2013-04-27 Государственное образовательное учреждение высшего профессионального образования "Воронежский государственный технический университет" Система монтажа полупроводникового кристалла к основанию корпуса
US8237171B2 (en) * 2010-02-09 2012-08-07 Microsemi Corporation High voltage high package pressure semiconductor package
US8587107B2 (en) * 2010-02-09 2013-11-19 Microsemi Corporation Silicon carbide semiconductor
US8705237B2 (en) * 2011-06-01 2014-04-22 Honeywell International Inc. Thermally conductive and electrically insulative card guide
US9435915B1 (en) 2012-09-28 2016-09-06 Rockwell Collins, Inc. Antiglare treatment for glass
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
JP6381021B2 (ja) * 2014-06-04 2018-08-29 Ｎｅｃスペーステクノロジー株式会社 パッケージおよびパッケージの製造方法
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
DE102014119396A1 (de) * 2014-12-22 2016-06-23 Endress + Hauser Gmbh + Co. Kg Druckmesseinrichtung
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
CN106744644A (zh) * 2016-10-11 2017-05-31 中国科学院地质与地球物理研究所 一种mems传感器低应力封装管壳及封装系统
US9917040B1 (en) * 2016-12-12 2018-03-13 Stmicroelectronics, Inc. Stress relieved thermal base for integrated circuit packaging
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4149910A (en) * 1975-05-27 1979-04-17 Olin Corporation Glass or ceramic-to-metal composites or seals involving iron base alloys
US4185139A (en) * 1977-12-30 1980-01-22 International Standard Electric Corporation Filler for a glass-ceramic material comprising CaF2 granules overcoated with a silicon dioxide film
US4202700A (en) * 1979-05-02 1980-05-13 The United States Of America As Represented By The United States Department Of Energy Glassy composition for hermetic seals
JPS57192050A (en) * 1981-05-21 1982-11-26 Nec Corp Package for semiconductor element
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
JPS5921032A (ja) * 1982-07-26 1984-02-02 Sumitomo Electric Ind Ltd 半導体装置用基板
US4784974A (en) * 1982-08-05 1988-11-15 Olin Corporation Method of making a hermetically sealed semiconductor casing
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
US4451540A (en) * 1982-08-30 1984-05-29 Isotronics, Inc. System for packaging of electronic circuits
US4532222A (en) * 1983-03-21 1985-07-30 Olin Corporation Reinforced glass composites
US4752521A (en) * 1984-09-19 1988-06-21 Olin Corporation Sealing glass composite
US4805009A (en) * 1985-03-11 1989-02-14 Olin Corporation Hermetically sealed semiconductor package
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US4715892A (en) * 1986-03-12 1987-12-29 Olin Corporation Cermet substrate with glass adhesion component
US4882212A (en) * 1986-10-30 1989-11-21 Olin Corporation Electronic packaging of components incorporating a ceramic-glass-metal composite
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system
US4872047A (en) * 1986-11-07 1989-10-03 Olin Corporation Semiconductor die attach system
US4761518A (en) * 1987-01-20 1988-08-02 Olin Corporation Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs
US4756754A (en) * 1987-03-06 1988-07-12 Olin Corporation Cermet composite
US4769345A (en) * 1987-03-12 1988-09-06 Olin Corporation Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor
US4961106A (en) * 1987-03-27 1990-10-02 Olin Corporation Metal packages having improved thermal dissipation
US4839716A (en) * 1987-06-01 1989-06-13 Olin Corporation Semiconductor packaging
US4796083A (en) * 1987-07-02 1989-01-03 Olin Corporation Semiconductor casing
JPS6425443A (en) * 1987-07-21 1989-01-27 Nec Corp Semiconductor device
US4952531A (en) * 1988-03-17 1990-08-28 Olin Corporation Sealing glass for matched sealing of copper and copper alloys
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
US5012386A (en) * 1989-10-27 1991-04-30 Motorola, Inc. High performance overmolded electronic package
US5066368A (en) * 1990-08-17 1991-11-19 Olin Corporation Process for producing black integrally colored anodized aluminum components

Also Published As

Publication number Publication date
WO1994001886A1 (en) 1994-01-20
MX9304184A (es) 1994-02-28
TW224183B (cg-RX-API-DMAC10.html) 1994-05-21
US5315155A (en) 1994-05-24

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