AU4491596A - Integrated circuit card and integrated circuit module - Google Patents

Integrated circuit card and integrated circuit module

Info

Publication number
AU4491596A
AU4491596A AU44915/96A AU4491596A AU4491596A AU 4491596 A AU4491596 A AU 4491596A AU 44915/96 A AU44915/96 A AU 44915/96A AU 4491596 A AU4491596 A AU 4491596A AU 4491596 A AU4491596 A AU 4491596A
Authority
AU
Australia
Prior art keywords
integrated circuit
card
circuit module
module
circuit card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU44915/96A
Other languages
English (en)
Inventor
Jean-Noel Audoux
Michel Gaumet
Michel Gouiller
Jean Herisson-Garin
Alain Larchevesque
Benoit Thevenot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solaic SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic SA filed Critical Solaic SA
Publication of AU4491596A publication Critical patent/AU4491596A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
AU44915/96A 1995-11-15 1996-01-09 Integrated circuit card and integrated circuit module Abandoned AU4491596A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9513530 1995-11-15
FR9513530A FR2741009B1 (fr) 1995-11-15 1995-11-15 Carte a circuit integre et module a circuit integre
PCT/FR1996/000031 WO1997018531A1 (fr) 1995-11-15 1996-01-09 Carte a circuit integre et module a circuit integre

Publications (1)

Publication Number Publication Date
AU4491596A true AU4491596A (en) 1997-06-05

Family

ID=9484587

Family Applications (1)

Application Number Title Priority Date Filing Date
AU44915/96A Abandoned AU4491596A (en) 1995-11-15 1996-01-09 Integrated circuit card and integrated circuit module

Country Status (3)

Country Link
AU (1) AU4491596A (fr)
FR (1) FR2741009B1 (fr)
WO (1) WO1997018531A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2792091B1 (fr) * 1999-04-12 2001-08-17 Schlumberger Systems & Service Carte a memoire electronique securisee
DE10016715C1 (de) * 2000-04-04 2001-09-06 Infineon Technologies Ag Herstellungsverfahren für laminierte Chipkarten

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2624635B1 (fr) * 1987-12-14 1991-05-10 Sgs Thomson Microelectronics Support de composant electronique pour carte memoire et produit ainsi obtenu
JPH01184191A (ja) * 1988-01-20 1989-07-21 Asahi Chem Ind Co Ltd Ｉｃチツプおよびｉｃカード
FR2684471B1 (fr) * 1991-12-02 1994-03-04 Solaic Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
JPH0664379A (ja) * 1992-08-12 1994-03-08 Oki Electric Ind Co Ltd Ｉｃカードおよびその製造方法

Also Published As

Publication number Publication date
WO1997018531A1 (fr) 1997-05-22
FR2741009B1 (fr) 1997-12-12
FR2741009A1 (fr) 1997-05-16

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