AU4092097A - Solid state switching device arrangement for silicon transfer switch - Google Patents
Solid state switching device arrangement for silicon transfer switchInfo
- Publication number
- AU4092097A AU4092097A AU40920/97A AU4092097A AU4092097A AU 4092097 A AU4092097 A AU 4092097A AU 40920/97 A AU40920/97 A AU 40920/97A AU 4092097 A AU4092097 A AU 4092097A AU 4092097 A AU4092097 A AU 4092097A
- Authority
- AU
- Australia
- Prior art keywords
- switching device
- solid state
- state switching
- transfer switch
- device arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/112—Mixed assemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71029196A | 1996-09-16 | 1996-09-16 | |
US08710291 | 1996-09-16 | ||
US82185297A | 1997-03-21 | 1997-03-21 | |
US08821852 | 1997-03-21 | ||
PCT/US1997/015031 WO1998011767A1 (en) | 1996-09-16 | 1997-08-26 | Solid state switching device arrangement for silicon transfer switch |
Publications (1)
Publication Number | Publication Date |
---|---|
AU4092097A true AU4092097A (en) | 1998-04-02 |
Family
ID=27108417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU40920/97A Abandoned AU4092097A (en) | 1996-09-16 | 1997-08-26 | Solid state switching device arrangement for silicon transfer switch |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU4092097A (en) |
WO (1) | WO1998011767A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6628505B1 (en) | 2000-07-29 | 2003-09-30 | Biosource, Inc. | Flow-through capacitor, system and method |
WO2002029836A1 (en) | 2000-10-02 | 2002-04-11 | Andelman Marc D | Fringe-field capacitor electrode for electrochemical device |
US7755872B2 (en) | 2006-09-14 | 2010-07-13 | Schweitzer Engineering Laboratories, Inc. | System, method and device to preserve protection communication active during a bypass operation |
DE102011001731A1 (en) * | 2011-04-01 | 2012-10-04 | Igel Elektronik Gmbh | Device for soft start |
US9287764B2 (en) * | 2013-02-28 | 2016-03-15 | Alstom Technology Ltd. | Energy delivery system and method for a gate drive unit controlling a thyristor-based valve |
CA2980553C (en) | 2015-03-31 | 2022-11-15 | General Electric Technology Gmbh | Top head housing |
CN105489572B (en) * | 2015-12-04 | 2018-01-23 | 许继集团有限公司 | Power component module and its radiator |
CN114144010B (en) * | 2021-11-17 | 2024-02-09 | 杭州汉安半导体有限公司 | High-voltage motor soft starting device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3684943A (en) * | 1971-02-01 | 1972-08-15 | Gen Electric | Converter valve-pair arrangement |
DE2341097A1 (en) * | 1973-08-14 | 1975-02-27 | Siemens Ag | COOLING ARRANGEMENT FOR FLAT SEMICONDUCTOR ELEMENTS, IN PARTICULAR FOR DISC CELL THYRISTORS |
DE2417031A1 (en) * | 1974-04-08 | 1975-10-16 | Siemens Ag | THYRISTOR COLUMN |
JPS63159894U (en) * | 1987-04-08 | 1988-10-19 | ||
US4864385A (en) * | 1987-12-29 | 1989-09-05 | Hitachi, Ltd. | Power semiconductors connected antiparallel via heatsinks |
EP0431215A1 (en) * | 1989-12-08 | 1991-06-12 | Siemens Aktiengesellschaft | Methode for protecting a GTO-thyristor against excessive overvoltage and circuit arrangement for carrying out this method |
-
1997
- 1997-08-26 WO PCT/US1997/015031 patent/WO1998011767A1/en active Application Filing
- 1997-08-26 AU AU40920/97A patent/AU4092097A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1998011767A1 (en) | 1998-03-19 |
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