AU4043699A - Method for producing an integrated circuit card and card produced according to said method - Google Patents

Method for producing an integrated circuit card and card produced according to said method Download PDF

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Publication number
AU4043699A
AU4043699A AU40436/99A AU4043699A AU4043699A AU 4043699 A AU4043699 A AU 4043699A AU 40436/99 A AU40436/99 A AU 40436/99A AU 4043699 A AU4043699 A AU 4043699A AU 4043699 A AU4043699 A AU 4043699A
Authority
AU
Australia
Prior art keywords
integrated circuit
plate element
adhesive strip
module
bottom face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU40436/99A
Inventor
Didier Elbaz
Jean-Christophe Fidalgo
Philippe Patrice
Michael Zafrany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SCA
Gemplus Card International SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SCA, Gemplus Card International SA filed Critical Gemplus SCA
Publication of AU4043699A publication Critical patent/AU4043699A/en
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a method for producing an integrated circuit, including a step whereby a module (12) is created and fixed on the body of a card (20) and provided with an integrated circuit (14) and contact pads (16). The invention is characterised in that the step in which the module (12) is created comprises a stage that consists in forming slots in a plate element (26) that is made from a conducting material, whereby said slots define at least partially the areas of the plate element (20) that will form the contact pads. The invention is also characterised by a subsequent step that consists in coating a lower face (32) of the plate element at least partially with adhesive matter (30) to enable the module (12) to be fixed to the body of the card (20) at a later stage.

Description

1 GEM530 The invention relates to a method of manufacturing a printed circuit card and a card manufactured according to such a method. The invention relates more particularly to the 5 method of manufacturing an integrated circuit card in which first of all a module is produced which includes notably the integrated circuit or circuits and the contact areas by means of which this integrated circuit is intended to be connected with an operating circuit 10 incorporated in an item of equipment in which the integrated circuit card is intended to be inserted. The integrated circuit or circuits of the module can for example be a memory circuit or a microprocessor. 15 The module is intended to be inserted in a card body, generally produced from plastics material, so that the contact areas of the module are flush with the level of the top face of the card body. 2 2 According to a conventional technique of producing modules, a support film is used made of dielectric plastics material, on one face of which a layer of conductive material, for example metallic, is 5 deposited. The metallic layer is etched so as to cause to appear, for each module, contact areas and connection tracks. The integrated circuit is attached to a bottom face of the support film and its terminals are 10 electrically connected, according to various known methods, to each of the contact areas. The bottom face of the support film is possibly covered with an encapsulation resin in which an integrated circuit and its connection means are embedded so as to ensure 15 perfect protection thereof. Next, the module is individualised by cutting the support film according to a predefined contour and is inserted in a cavity provided in the card body. The module is fixed in the cavity for example by gluing. 20 The object of the invention is to propose a novel design of an integrated circuit card which significantly reduces the cosgs of manufacturing an integrated circuit card, notably by limiting the costs related to the materials which come into play in the 25 manufacture of the card and those related to the various operations of assembling it. For this purpose, the invention proposes a novel method of manufacturing an integrated circuit card, characterised in that the step of producing the module 30 includes a step consisting in forming, in a plate 3 element made of conductive material, slots which at least partially delimit areas of the plate element intended to constitute the contact areas, and a subsequent step consisting in covering, at least 5 partially, a bottom face of the plate element with an adhesive strip by means of which the module is intended to be fixed subsequently in a cavity formed in the card body. According to other characteristics of the 10 invention: - the method includes a step of cutting out the module by means of which the latter is separated from the plate element; - the method includes a step of fixing the 15 integrated circuit on the same side as the bottom face of the plate element; - the step of fixing the integrated circuit is subsequent to that of fitting the adhesive strip, and the integrated circuit is fixed to the module by means 20 of the adhesive strip; - the method includes terminals which are electrically connected to a bot;,tom face of the contact areas by connecting means, and the adhesive strip has at least one connection window by means of which the 25 bottom face of the contact areas is visible in order to allow passage of the connecting means; - the connection window of the adhesive strip is formed before the step of fitting the ribbon on the plate element; 4 - the step of fitting the adhesive strip is subsequent to the fixing of the integrated circuit to the plate element; - the adhesive strip covers the integrated 5 circuit; - in the area of the integrated circuit, the adhesive strip is removed from the bottom face of the plate element so as to form a substantially closed housing in which the integrated circuit is arranged; 10 - the housing is filled with a protective resin; - a layer of stiffening resin is interposed between the adhesive strip and the bottom face of the plate element; - the layer of stiffening resin is formed by a 15 second adhesive strip which is activated before fitting the adhesive ribbon by means of which the module is intended to be fixed to the card body; - the adhesive strip (30) is activated by heat; - the adhesive strip is activated by radiation. 20 The invention also relates to an integrated circuit card manufactured according to a method incorporating any one of the ~abaye characteristics. Other characteristics and advantages of the invention will emerge from a reading of the following 25 detailed description, for an understanding of which reference should be made to the accompanying drawings in which: - Figures 1, 2A, 4A, 5A, 6 and 7 are schematic views in section along a vertical plane illustrating 30 different steps of a method of manufacturing an 5 integrated circuit card according to the teachings of the invention; - Figure 3A is a view from below corresponding to the step illustrated in Figure 2A; 5 - Figures 2B, 3B and 4B illustrate variant embodiments of the steps illustrated in Figures 2A, 3A and 4A of the method according to the invention; - Figures SB and 5C show two variant embodiments of the step illustrated in Figure 5A; 10 - Figures 8 to 12 are views in section along a vertical plane illustrating the different successive steps of a second method according to the invention; and - Figures 13 to 19 are views in section along a 15 vertical plane illustrating a third method according to the invention. Figure 7 illustrates a step of a method of manufacturing an integrated circuit card 10 according to the teachings of the invention, referred to as the 20 insertion stage, during which a module 12, which includes notably an integrated circuit 14 and contact areas 16, is engaged in a cavity 18 provided in a card body 20 so that a top face 22 of the contact areas 16, which also forms a top face of the module 12, is 25 substantially flush at the same level as a top face 24 of the card body 20. Figures 1 to 6 illustrate, different steps for producing the module 12 in accordance with the teachings of the invention.
6 As can be seen in Figure 1, the contact areas 16 are formed in a plate element 26 made of conductive material. Preferably, the plate element 26 will have the shape of a strip along which there will be formed 5 several series of contact areas 16, each series of contact areas 16 being intended to form the contact areas of a module 12. The plate element 26 is for example produced by means of a metallic material such as copper, bronze, a 10 copper-iron alloy, or an iron-nickel alloy. The thickness of the plate element can for example be 70 microns, but it can if necessary be envisaged using a plate element 26 with a thickness of 35 microns. In order to improve the nature of the electrical 15 contacts, the plate element 26 can be covered, for example by electroplating, with a nickel-gold or silver-palladium alloy. As can be seen in Figure 1, but more particularly in Figures 3A and 3B, the contact areas 16 are for 20 example six in number per series and are separated from each other, at least partially during this first step, by slots 28. As will be seen subsequently, the series of contact areas are intended to be separated from a peripheral part of the plate element 26 in the form of 25 a strip so that, once separated, they are electrically independent of each other. However, before this separation by cutting, the contact areas remain fixed, through their peripheral part, to the peripheral part of the plate element, which ensures that they are held 30 in position during the production of the module.
7 The slots 28 can be formed by cutting, by electrochemical etching, or by any other known method. In a subsequent step, it can be seen in Figures 2A, 3A, 2B, 3B that an adhesive strip 30 is applied 5 against the bottom face 32 of the plate element 26. The adhesive strip is preferably produced by means of a heat-activated adhesive material, that is to say one which becomes fully adhesive only when its cross linking is caused, in this case by heat. 10 Advantageously, at the time of its application, that is to say before its activation, this material is relatively flexible and has despite everything a low adhesiveness, which enables it to adhere to the bottom face 32 of the plate element 226 against which it is 15 pressed. This type of adhesive is normally referred to as "hot melt" and is in the form of a strip whose thickness can for example be around 70 micrometres. It is however possible to use other types of adhesive, possibly activated by a catalyst or by 20 ultraviolet radiation. The adhesive strip 30 will also preferably be provided, on its bottom face, ,with a protective film (not shown), which will for example be removed at the time of the insertion of the module. In carrying out 25 the fitting, for example by lamination, it is ensured that the adhesive does not escape through the slots 28 in order to project beyond the top face 22 of the plate element 26. As can be seen more particularly in Figures 3A and 30 3B, the adhesive strip 30 has, in correspondence with 8 each series of contact areas 26, at least one window 34 through which the bottom face of the contact areas 16 remains accessible. In the example embodiment in Figures 2A and 3A, 5 the window 34 is the only one for a series of contact areas 16 whilst, in the example embodiment in Figures 2B and 3B, there are two windows 34 each giving access to the bottom face 32 of three contact areas 16. Naturally, provision could be made, at each series 10 of contact areas 26, for the adhesive strip 30 to have as many windows 34 as the series has contact areas 16, each window 34 giving access to the bottom face 32 of one of the contact areas 16. In these two example embodiments, the windows 34 15 are rectangular in shape. However, other shapes can be adopted according notably to the shape and arrangement of the contact areas 16. At the step illustrated in Figures 4A and 4B, the integrated circuit 14 is fixed on the same side as the 20 bottom face 32 of the contact areas 16. In the example illustrated in Figure 4A, the integrated circuit 14 is fixes. directly against the bottom face 32 of the areas 16, at the centre of the window 34, for example by means of a glue (not shown). 25 In the example embodiment in Figure 4B, the integrated circuit 14 is fixed on the same side as the bottom face 32 of the plate element 26 by virtue of a portion 36 of the strip 30 which lies between the two windows 34. Thus the integrated circuit 14 is fixed 30 substantially at the centre of the series of contact 9 areas 16, without requiring the addition of any particular fixing means, since use is made of the adhesive properties of the strip 30 previously placed on the bottom face 32 of the plate element 26. In this 5 case, it will be, possible to carry out, in order to ensure a particularly reliable fixing of the integrated circuit during the following two steps of producing the module, a local heating of the portion 36 of the adhesive strip 30 by means of which the integrated 10 circuit is glued against the plate element 26. This heating can for example be effected through the plate element 26, locally heating the latter in line with the part 36 whose cross-linking it is wished to ensure. Figures SA, 5B, 5C, 6 and 7 illustrate following 15 steps of the method according to the invention, in the case of the variant illustrated in Figures 2B, 3B, 4B, for which the fixing of the integrated circuit 14 is ensured by the adhesive strip 30. Figures 5A, SB, 5C illustrate three variant 20 embodiments of a step during which the electrical connection between the integrated circuit 14 and the contact areas 16 is effected. In the example embodiment in Figure SA, the circuit 14 is arranged so that its active face 38, 25 which carries contact terminals (not shown), is oriented downwards. The terminals of the integrated circuit 14 are each connected to a contact area 16 by virtue of a connection wire 40, the two ends of which are soldered respectively to the terminal of the 30 integrated circuit 14 and to the bottom face 32 of the 10 contact area 16. In this way, each connection wire 40 extends through one of the two windows 34 in the adhesive strip 30. In the example embodiment in Figure 5B, the active 5 face 38 of the integrated circuit 14 is also turned towards the bottom but each terminal of the integrated circuit 14 is connected to the corresponding contact area 16 by a mass of conductive resin 42 which is deposited for example by means of a syringe. The resin 10 used can be a glue containing conductive particles or an intrinsically conductive resin. This method of effecting the electrical connection of the integrated circuit 14 to the contact area 16 is known as connection by dispense. 15 In the third example illustrated in Figure 3C, the electrical connection of the integrated circuit 14 with the contact areas 16 is effected by virtue of an assembly of the chip according to a method of the "flip-chip" type in which the active face 38 of the 20 integrated circuit is turned upwards, opposite the bottom face 32 of the plate element 26. The active face 38 has, at the level of each of the terminals of the circuit 14, bumps 44 which are intended to come directly in contact with the bottom face 32 of the 25 corresponding conductive area 16. The bumps 44 are produced for example by means of a tin-lead alloy and the electrical connection is effected by fusion of this bump. In this embodiment of the invention, it will be 30 noted that the flexibility of the adhesive strip 30 11 makes it possible, if necessary, for the portion 36 of the strip which is arranged between the integrated circuit 14 and the plate element 26 to be slightly crushed to allow the connection of each of the bumps 44 5 with the corresponding contact area 16. Figure 6 illustrates a following step of producing the module 12 during which the bottom face of the module 12 is covered, at least partially, by a layer of encapsulation resin intended to provide protection of 10 the integrated circuit 14 and the connecting means 40, 42, 44 which ensure the electrical connection of the integrated circuit 14 with the contact areas 16. In the example in Figure 6, the variant embodiment illustrated in Figure 5A has been repeated, in which 15 the connection means are produced by connection wires 40. The encapsulation resin 46 can for example be deposited in fluid form before being cross-linked. If necessary, an operation of milling the bottom part of 20 the encapsulation resin 46 can also be provided in order to calibrate the total height of the module 12. At this stage, the module 42 is fully complete and it therefore suffices to separate it from a peripheral portion of the plate element 26 by cutting, for example 25 punching or by means of a laser beam. The contour of the module 12 is such that, once cut, the contact areas 16 are no longer connected by any bridge of conductive material so that they are electrically independent of each other in order not to cause a short-circuit 30 between the terminals of the integrated circuit, except 12 of course in the case where a short-circuit is necessary for the functioning of the integrated circuit 14. As can be seen in Figure 7, the size of the module 5 12 is greater than the size of the layer of encapsulation resin 46 so that, over the entire periphery of the module 12, the bottom face of the adhesive strip 30 which is intended to provide the fixing of the module 12 in the card body 20 is found to 10 be visible. As can be seen in this Figure 7, the cavity 18 provided in the card body 20 has a shallow peripheral portion 48, and a deeper central portion 50. The peripheral portion 48 thus has a depth substantially 15 equal to the total thickness of the contact areas 16 and adhesive strip 30 so that, during the insertion operation, the bottom face of the adhesive strip 30 being brought in contact with the bottom wall of the peripheral portion 30 in order to be able to adhere 20 thereto, the top face 22 of the contact area 16 is then automatically flush at the same level as the top face 24 of the card body 20. On the other hand, the central part 50 of the cavity 18 has sufficient depth to receive the part of 25 the module 12 which is covered by the protective resin 46 and which therefore has the greatest thickness. Once the module 12 has been received in the cavity 18, it suffices to heat the adhesive strip 30 in order to ensure the cross-linking of the adhesive and thus 13 ensure perfect fixing of the module 12 to the card support 20. Figures 8 to 12 illustrate a second method of manufacturing an integrated circuit card according to 5 the invention. In this second method, the adhesive strip 30 is placed against the bottom face 32 of the plate element 26 only after the fixing of the integrated circuit 14 against this bottom face 32 and after the production of the electrical connections 10 between the integrated circuit 14 and the contact areas 16. Thus, after the step of forming the slots 28 in the plate element 26, which is illustrated in Figure 8 and which is similar to that illustrated in Figure 1, 15 the fixing and electrical connection of the integrated circuit 14 is carried out directly, as illustrated in Figure 9. This Figure 9 illustrates the case where the integrated circuit 14 is assembled according to the so called "flip-chip" method but, naturally, any other 20 method of fixing and connecting the integrated circuit 14 can be used, notably those illustrated in Figures 5A and 5B re-lating to the first method according to the invention. The integrated circuit 14 will for example be 25 fixed by bonding by means of a glue (not shown). As can be seen in Figure 10, the adhesive strip 30 which is placed against the bottom face 32 of the plate element 26 has no windows. Thus it covers the entire bottom face 32 of the plate element 26, including at 30 the level of the integrated circuit 14 However, in 14 order not to damage the latter, provision will preferably be made for the ribbon 34 to be locally deformed in order to create a bulge 52 at the level of the integrated circuit 14, this bulge not being pressed 5 against the bottom face 32 of the contact areas 16, nor against the integrated circuit 14 or its connection means 40, 42, 44. The bulge 52 and the plate element 26 thus delimit a substantially closed housing 54 which is open towards 10 the outside only through the slots 28 which delimit the contact areas with each other. The connections 40, 42, 44 are therefore protected inside the housing 54. As can be seen in Figure 11, it can then be envisaged filling the housing 54 with an encapsulation 15 resin 46 which, as in the first method according to the invention, is intended to ensure an even more effective protection of them. The filling can for example be effected through one of the slots 28 which separate the contact areas 16 from each other. 20 The assembly thus formed is then inset in the card body 20 in order to be fixed therein by virtue of the adhesive strip 30, whose adhesion is caused for example by heating through the contact areas 16. The third method according to the invention, which 25 is illustrated in Figures 13 to 19, is a variant of the second method in which provision has been made for increasing the mechanical strength of the module 12 by interposing, between the plate element 26 and the adhesive strip 30 which is intended to ensure the 15 fixing of the module 12 in the card body 20, a layer of stiffening resin 56. As illustrated in Figure 14, the layer of resin 56 is for example placed on the bottom face 32 of the 5 plate element 26 after the formation of the stops 28 which separate the contact areas 16 from each other, but before the fixing and connection of the integrated circuit 14. As can be seen in Figure 14, the layer of 10 stiffening resin 56 is also provided with windows 34, similar to those described with regard to the first method according to the invention, in order to allow access to the bottom face of the contact areas 16 in order to ensure the electrical connection of the 15 integrated circuit 14. For example, as a layer of protective resin 46, it is possible to use an adhesive strip similar to the one described previously, and similar to the one which will be used for ensuring the fixing of the module 20 to the 20 card body 20 as illustrated in Figures 17 to 19. However, for this layer of resin to fulfil its role of stiffening the plate element 2:6, it is necessary, as from the step illustrated in Figure 14, to ensure the cross-linking of the adhesive, for example by heating 25 if it is a case of a heat-activated adhesive. The fixing of the integrated circuit 14, which is illustrated in Figure 15, is provided for example by means of a glue (not shown). The step in Figure 16 illustrates one possibility 30 of effecting the electrical connection of the 16 integrated circuit 14 with the contact areas 16, in this case by the dispense method described with reference to Figure 6 with regard to the first embodiment of the invention. However, any other method 5 of producing the connection means can be envisaged. Once the fixing and connection of the integrated circuit have been effected, the steps illustrated in Figures 17, 18 and 19 are identical to those described in relation to Figures 10, 11 and 12 with regard to the 10 second method according to the invention. The three methods of producing an integrated circuit card according to the invention have the advantage, compared with the prior art, of being able to dispense with the support film which, in the prior 15 art, fulfilled only a function of supporting the contact areas 16 and did not actively participate in the fixing or stiffening of the module 12. Moreover, the step of forming the slots 28 intended to delimit between them the contact areas 16 is greatly 20 facilitated, notably when it is performed by punching.

Claims (15)

1. A method of manufacturing an integrated circuit card, of the type including the step consisting 5 in producing a module (12) which is fixed to a card body (20) and which includes notably an integrated circuit (14) and contact areas (16) by means of which the integrated circuit (14) is intended to be electrically connected with an operating circuit, 10 characterised in that the step of producing the module (12) includes a step consisting in forming, in a plate element (26) made of conductive material, slots (28) which at least partially delimit zones of the plate element (20) intended to form the contact areas 15 (16), and a subsequent step consisting in at least partially covering a bottom face (32) of the plate element (26) with an adhesive strip (30) by means of which the module (12) is intended to be fixed subsequently to the card body (20). 20
2. A method according to Claim 1, characterised in that it includes a step of cutting the module (12) by means of which the latter-, is separated from the plate element (26).
3. A method according to any one of the preceding 25 claims, characterised in that it includes a step of fixing the integrated circuit (14) on the same side as the bottom face (12) of the plate element.
4. A method according to Claim 3, characterised in that the step of fixing the integrated circuit (14) 30 is subsequent to that of fitting the adhesive strip 18 (30), and in that the integrated circuit (14) is fixed to the module (12) by means of the adhesive strip (30).
5. A method according to Claim 4, characterised in that the integrated circuit (14) has terminals which 5 are electrically connected to a bottom face (32) of the contact areas (16) by connection means (40, 42, 44), and in that the adhesive strip (30) has at least one connection window (34) by means of which the bottom face (32) of the contact areas (16) is visible in order 10 to allow the passage of the connecting means (40, 42, 44).
6. A method according to Claim 5, characterised in that the connection window (34) in the adhesive strip (30) is formed before the step of fitting the 15 strip (30) on the plate element (26).
7. A method according to Claim 3, characterised in that the step of fitting the adhesive strip (30) is subsequent to the fixing of the integrated circuit '(14) to the plate element (26). 20
8. A method according to Claim 7, characterised in that the strip of adhesive (30) covers the integrated circuit (14).
9. A method according to Claim 8, characterised in that, in the zone of the integrated circuit (14), 25 the adhesive strip (30) is unstuck (52) from the bottom face (32) of the plate element (26) so as to form a substantially closed housing (54) in which the integrated circuit (14) is arranged. 19
10. A method according to Claim 9, characterised in that the housing (54) is filled with a protective resin (46).
11. A method according to any one of Claims 7 to 5 10, characterised in that a layer of stiffening resin (56) is interposed between the adhesive strip (30) and the bottom face (3,2) of the plate element (26).
12. A method according to Claim 11, characterised in that the layer of stiffening resin (56) is formed by 10 a second adhesive strip which is activated before the fitting of the adhesive strip (30) by means of which the module (12) is intended to be fixed to the card body (20).
13. A method according to any one of the 15 preceding claims, characterised in that the adhesive strip (30) is heat activated.
14. A method according to any one of Claims 1 to 12, characterised in that the adhesive strip (30) is activated by radiation. 20
15. An integrated circuit card, characterised in that it is made according to a method in accordance with any one of the preceding claims.
AU40436/99A 1998-06-12 1999-05-31 Method for producing an integrated circuit card and card produced according to said method Abandoned AU4043699A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9807602A FR2779851B1 (en) 1998-06-12 1998-06-12 METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT CARD AND CARD OBTAINED
FR9807602 1998-06-12
PCT/FR1999/001268 WO1999066445A1 (en) 1998-06-12 1999-05-31 Method for producing an integrated circuit card and card produced according to said method

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CA (1) CA2333790A1 (en)
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FR2828333B1 (en) * 2000-06-23 2003-11-07 Gemplus Card Int METHOD FOR ELECTRICAL INSULATION OF CHIPS COMPRISING INTEGRATED CIRCUITS BY DEPOSITING AN INSULATING LAYER
FR2816107B1 (en) * 2000-10-30 2003-11-28 Gemplus Card Int MOVIE INTEGRATED CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
FR2817656B1 (en) * 2000-12-05 2003-09-26 Gemplus Card Int ELECTRICAL INSULATION OF GROUPED MICROCIRCUITS BEFORE UNIT BONDING
FR2968431B1 (en) * 2010-12-06 2012-12-28 Oberthur Technologies METHOD FOR MANUFACTURING MICROCIRCUIT DEVICE
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
WO2014149926A1 (en) 2013-03-15 2014-09-25 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
EP3422828A1 (en) * 2017-06-29 2019-01-02 voestalpine Stahl GmbH Method and device for producing an electrical connector contact - kontaktinator
US11361204B2 (en) 2018-03-07 2022-06-14 X-Card Holdings, Llc Metal card

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GB2120861B (en) * 1982-05-27 1985-10-02 Vladimir Iosifovich Livshits Process for manufacturing panels to be used in microelectronic systems
FR2632100B1 (en) * 1988-05-25 1992-02-21 Schlumberger Ind Sa PROCESS FOR PRODUCING AN ELECTRONIC MEMORY CARD AND ELECTRONIC MEMORY CARDS OBTAINED BY IMPLEMENTING SAID METHOD
DE4336501A1 (en) * 1993-10-26 1995-04-27 Giesecke & Devrient Gmbh Process for the production of identity cards with electronic modules
DE4443767A1 (en) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Electronic module and data carrier with electrical module
FR2740935B1 (en) * 1995-11-03 1997-12-05 Schlumberger Ind Sa METHOD FOR MANUFACTURING AN ASSEMBLY OF ELECTRONIC MODULES FOR ELECTRONIC MEMORY CARDS

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FR2779851A1 (en) 1999-12-17
EP1084482A1 (en) 2001-03-21
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WO1999066445A8 (en) 2000-02-10
WO1999066445A1 (en) 1999-12-23
CA2333790A1 (en) 1999-12-23
ATE259980T1 (en) 2004-03-15
MXPA00012220A (en) 2002-06-04
JP2002518751A (en) 2002-06-25

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