AU4034200A - Optical endpoint detection system for rotational chemical mechanical polishing - Google Patents

Optical endpoint detection system for rotational chemical mechanical polishing

Info

Publication number
AU4034200A
AU4034200A AU40342/00A AU4034200A AU4034200A AU 4034200 A AU4034200 A AU 4034200A AU 40342/00 A AU40342/00 A AU 40342/00A AU 4034200 A AU4034200 A AU 4034200A AU 4034200 A AU4034200 A AU 4034200A
Authority
AU
Australia
Prior art keywords
detection system
mechanical polishing
chemical mechanical
endpoint detection
optical endpoint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU40342/00A
Inventor
John A. Adams
Christopher E. Barns
Thomas Frederick Allen Bibby Jr.
Mark Anthony Meloni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of AU4034200A publication Critical patent/AU4034200A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU40342/00A 1999-03-26 2000-03-24 Optical endpoint detection system for rotational chemical mechanical polishing Abandoned AU4034200A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US27745299A 1999-03-26 1999-03-26
US09277452 1999-03-26
PCT/US2000/008084 WO2000058716A1 (en) 1999-03-26 2000-03-24 Optical endpoint detection system for rotational chemical mechanical polishing

Publications (1)

Publication Number Publication Date
AU4034200A true AU4034200A (en) 2000-10-16

Family

ID=23060935

Family Applications (1)

Application Number Title Priority Date Filing Date
AU40342/00A Abandoned AU4034200A (en) 1999-03-26 2000-03-24 Optical endpoint detection system for rotational chemical mechanical polishing

Country Status (2)

Country Link
AU (1) AU4034200A (en)
WO (1) WO2000058716A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6805613B1 (en) 2000-10-17 2004-10-19 Speedfam-Ipec Corporation Multiprobe detection system for chemical-mechanical planarization tool
CN102346012B (en) * 2010-07-28 2013-09-04 中国石油天然气股份有限公司 Construction method of pipe-soil relative displacement monitoring system for oil-gas pipeline in mining subsidence area
JP7354131B2 (en) 2018-03-13 2023-10-02 アプライド マテリアルズ インコーポレイテッド Vibration monitoring during chemical mechanical polishing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5838447A (en) * 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
US6010538A (en) * 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US5872633A (en) * 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
US5795218A (en) * 1996-09-30 1998-08-18 Micron Technology, Inc. Polishing pad with elongated microcolumns

Also Published As

Publication number Publication date
WO2000058716A1 (en) 2000-10-05

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase