AU3467500A - Polycrystalline module and method for producing a semiconductor module - Google Patents

Polycrystalline module and method for producing a semiconductor module

Info

Publication number
AU3467500A
AU3467500A AU34675/00A AU3467500A AU3467500A AU 3467500 A AU3467500 A AU 3467500A AU 34675/00 A AU34675/00 A AU 34675/00A AU 3467500 A AU3467500 A AU 3467500A AU 3467500 A AU3467500 A AU 3467500A
Authority
AU
Australia
Prior art keywords
module
producing
polycrystalline
semiconductor
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU34675/00A
Inventor
Vladimir Evgenievich Golynets
Sergei Mikhailovich Naida
Vladislav Nikolaevich Pyrchenkov
Nikolai Mikhailovich Strelkov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VLADISLAV NIKOLAEVICH PYRCHENK
Original Assignee
VLADISLAV NIKOLAEVICH PYRCHENK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from RU99105254A external-priority patent/RU2139598C1/en
Priority claimed from RU99105255A external-priority patent/RU2140688C1/en
Application filed by VLADISLAV NIKOLAEVICH PYRCHENK filed Critical VLADISLAV NIKOLAEVICH PYRCHENK
Publication of AU3467500A publication Critical patent/AU3467500A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02625—Liquid deposition using melted materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/20—Structure, shape, material or disposition of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
AU34675/00A 1999-03-23 2000-03-22 Polycrystalline module and method for producing a semiconductor module Abandoned AU3467500A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
RO99105254 1999-03-23
RU99105254A RU2139598C1 (en) 1999-03-23 1999-03-23 Process of manufacture of semiconductor module
RU99105255A RU2140688C1 (en) 1999-03-23 1999-03-23 Multichip module
RO99105255 1999-03-23
PCT/RU2000/000093 WO2000057477A1 (en) 1999-03-23 2000-03-22 Polycrystalline module and method for producing a semiconductor module

Publications (1)

Publication Number Publication Date
AU3467500A true AU3467500A (en) 2000-10-09

Family

ID=26654005

Family Applications (1)

Application Number Title Priority Date Filing Date
AU34675/00A Abandoned AU3467500A (en) 1999-03-23 2000-03-22 Polycrystalline module and method for producing a semiconductor module

Country Status (2)

Country Link
AU (1) AU3467500A (en)
WO (1) WO2000057477A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131863U (en) * 1973-03-10 1974-11-13
JPS6022396A (en) * 1983-07-19 1985-02-04 日本電気株式会社 Circuit board
US4984731A (en) * 1989-10-05 1991-01-15 Matsushita Electric Industrial Co., Ltd. Method of packaging electronic component parts using a eutectic die bonder
RU2003207C1 (en) * 1990-12-26 1993-11-15 Институт точной механики и вычислительной техники им.С.А.Лебедева РАН Process of manufacture of hybrid integrated circuit
RU2091906C1 (en) * 1994-04-28 1997-09-27 Акционерное общество открытого типа "Научно-исследовательский центр электронной вычислительной техники" Multichip module

Also Published As

Publication number Publication date
WO2000057477A1 (en) 2000-09-28

Similar Documents

Publication Publication Date Title
AU2231201A (en) Production method for semiconductor device
AU2735100A (en) Method of making photovoltaic device
EP1184897B8 (en) Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method
AU1683800A (en) Semiconductor device and production method thereof
AU5109000A (en) Semiconductor package, semiconductor device, electronic device and production method for semiconductor package
EP1579497A3 (en) Method for forming a semiconductor device and structure thereof
AU2001271994A1 (en) A method and system for investment integration
AU7644600A (en) Method and device for producing solar cells
AU2001242010A1 (en) Apparatus and method for dedicated interconnection over a shared external bus
AU2002221547A1 (en) Method for producing a data carrier and data carrier
AU2001247512A1 (en) Method and structure for producing flat wafer chucks
AU1431500A (en) Method for semiconductor manufacturing
AU6035000A (en) Semiconductor and manufacturing method for semiconductor
AU5059200A (en) Solar cell and method for producing a solar cell
AU6387900A (en) Method and structure for manufacturing improved yield semiconductor packaged devices
AU2001279628A1 (en) Separation module and method for producing the same
AU2002216181A1 (en) Method for producing a positively doped semiconductor with large forbidden band
AU2001273948A1 (en) Photovoltaic module and method for the production thereof
AU1924001A (en) Apparatus and method for coupling to a memory module
AU2001248676A1 (en) Sensor module and a method for the production of the same
AU3467500A (en) Polycrystalline module and method for producing a semiconductor module
AU5406500A (en) Method and device for producing pellets
AU7770300A (en) Chip card and a method for producing a chip card
AU1734801A (en) Processes for producing tetrahydropyranyl-4-sulfonate and 4-aminotetrahydropyrancompound
AU2240401A (en) A method and an arrangement relating to chip carriers

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase