AU3378995A - Semiconductor device with at least one semiconductor component - Google Patents

Semiconductor device with at least one semiconductor component

Info

Publication number
AU3378995A
AU3378995A AU33789/95A AU3378995A AU3378995A AU 3378995 A AU3378995 A AU 3378995A AU 33789/95 A AU33789/95 A AU 33789/95A AU 3378995 A AU3378995 A AU 3378995A AU 3378995 A AU3378995 A AU 3378995A
Authority
AU
Australia
Prior art keywords
semiconductor
component
semiconductor device
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU33789/95A
Inventor
Heinz Dr. Bauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dylec Ltd
Original Assignee
Dylec Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dylec Ltd filed Critical Dylec Ltd
Publication of AU3378995A publication Critical patent/AU3378995A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Element Separation (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Power Conversion In General (AREA)
AU33789/95A 1994-08-23 1995-08-21 Semiconductor device with at least one semiconductor component Abandoned AU3378995A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE9413550U DE9413550U1 (en) 1994-08-23 1994-08-23 Semiconductor arrangement with at least one semiconductor component
DE9413550 1994-08-23
PCT/DE1995/001100 WO1996006457A1 (en) 1994-08-23 1995-08-21 Semiconductor device with at least one semiconductor component

Publications (1)

Publication Number Publication Date
AU3378995A true AU3378995A (en) 1996-03-14

Family

ID=6912711

Family Applications (1)

Application Number Title Priority Date Filing Date
AU33789/95A Abandoned AU3378995A (en) 1994-08-23 1995-08-21 Semiconductor device with at least one semiconductor component

Country Status (3)

Country Link
AU (1) AU3378995A (en)
DE (1) DE9413550U1 (en)
WO (1) WO1996006457A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19607194A1 (en) * 1996-02-26 1997-08-28 Siemens Ag Potted, PCB-less electrical / electronic assembly
DE19739591A1 (en) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclable circuit board, consisting of a foil and carrier system
JPH11186003A (en) * 1997-12-25 1999-07-09 Yazaki Corp Heat sink structure of ptc device
DE20017105U1 (en) 2000-10-04 2001-01-18 Siemens AG, 80333 München Circuit arrangement
KR100544576B1 (en) * 2001-12-21 2006-01-24 주식회사 포스코 Method for Injecting Ore Particles
DE102014205161A1 (en) * 2014-03-19 2015-09-24 BSH Hausgeräte GmbH Domestic appliance, in particular coffee machine, with overload and overcurrent protection circuit

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474307A (en) * 1965-03-29 1969-10-21 Hitachi Ltd Semiconductor device for chopper circuits having lead wires of copper metal and alloys thereof
DE3039440C2 (en) * 1980-10-18 1984-02-16 ANT Nachrichtentechnik GmbH, 7150 Backnang Arrangement for receiving electrical and / or electronic components
DE7505830U (en) * 1975-02-25 1976-09-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen DEVICE FOR HIGH-VOLTAGE-PROOF AND GOOD THERMAL CONDUCTING INSTALLATION OF SEMICONDUCTOR COMPONENTS
CS214034B1 (en) * 1980-06-10 1982-04-09 Michal Pellant Semiconductor modulus
JPS57133653A (en) * 1981-02-12 1982-08-18 Toshiba Corp Resin sealed type semiconductor device
FI72409C (en) * 1984-03-09 1987-05-11 Lohja Ab Oy FOERFARANDE FOER INKAPSLING AV PAO EN BAERREMSA ANORDNADE HALVLEDARKOMPONENTER.
FR2571895B1 (en) * 1984-10-16 1987-07-24 Silicium Semiconducteur Ssc METHOD FOR MOUNTING TWO SEMICONDUCTOR COMPONENTS IN A COMMON PACKAGE AND DEVICE OBTAINED THEREBY
DE3446585A1 (en) * 1984-12-20 1986-07-03 Stanley Electric Co Ltd METHOD FOR PRODUCING A PUSHED ELECTRONIC CIRCUIT ARRANGEMENT
US4775917A (en) * 1985-12-03 1988-10-04 Wells Manufacturing Company Thermal compensated circuit board interconnect apparatus and method of forming the same
DE3604882A1 (en) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie PERFORMANCE SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE MODULE
JPS6331149A (en) * 1986-07-25 1988-02-09 Fujitsu Ltd Semiconductor device
US4841170A (en) * 1986-12-08 1989-06-20 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
KR0157844B1 (en) * 1988-07-15 1998-10-15 모리나카 마사미 Semiconductor device sealed with resin and the method of producing the same
JPH0362844A (en) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
DE3932882A1 (en) * 1989-10-02 1991-04-11 Siemens Ag WELL HEAT-CONDUCTING COMPOSITE
JPH04179263A (en) * 1990-11-14 1992-06-25 Hitachi Ltd Resin-sealed semiconductor device, and manufacture thereof
US5302553A (en) * 1991-10-04 1994-04-12 Texas Instruments Incorporated Method of forming a coated plastic package

Also Published As

Publication number Publication date
DE9413550U1 (en) 1996-01-11
WO1996006457A1 (en) 1996-02-29

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