AU3378995A - Semiconductor device with at least one semiconductor component - Google Patents
Semiconductor device with at least one semiconductor componentInfo
- Publication number
- AU3378995A AU3378995A AU33789/95A AU3378995A AU3378995A AU 3378995 A AU3378995 A AU 3378995A AU 33789/95 A AU33789/95 A AU 33789/95A AU 3378995 A AU3378995 A AU 3378995A AU 3378995 A AU3378995 A AU 3378995A
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor
- component
- semiconductor device
- semiconductor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Element Separation (AREA)
- Semiconductor Integrated Circuits (AREA)
- Power Conversion In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9413550U DE9413550U1 (en) | 1994-08-23 | 1994-08-23 | Semiconductor arrangement with at least one semiconductor component |
DE9413550 | 1994-08-23 | ||
PCT/DE1995/001100 WO1996006457A1 (en) | 1994-08-23 | 1995-08-21 | Semiconductor device with at least one semiconductor component |
Publications (1)
Publication Number | Publication Date |
---|---|
AU3378995A true AU3378995A (en) | 1996-03-14 |
Family
ID=6912711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU33789/95A Abandoned AU3378995A (en) | 1994-08-23 | 1995-08-21 | Semiconductor device with at least one semiconductor component |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU3378995A (en) |
DE (1) | DE9413550U1 (en) |
WO (1) | WO1996006457A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19607194A1 (en) * | 1996-02-26 | 1997-08-28 | Siemens Ag | Potted, PCB-less electrical / electronic assembly |
DE19739591A1 (en) * | 1997-09-10 | 1999-03-11 | Wuerth Elektronik Gmbh & Co Kg | Recyclable circuit board, consisting of a foil and carrier system |
JPH11186003A (en) * | 1997-12-25 | 1999-07-09 | Yazaki Corp | Heat sink structure of ptc device |
DE20017105U1 (en) | 2000-10-04 | 2001-01-18 | Siemens AG, 80333 München | Circuit arrangement |
KR100544576B1 (en) * | 2001-12-21 | 2006-01-24 | 주식회사 포스코 | Method for Injecting Ore Particles |
DE102014205161A1 (en) * | 2014-03-19 | 2015-09-24 | BSH Hausgeräte GmbH | Domestic appliance, in particular coffee machine, with overload and overcurrent protection circuit |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3474307A (en) * | 1965-03-29 | 1969-10-21 | Hitachi Ltd | Semiconductor device for chopper circuits having lead wires of copper metal and alloys thereof |
DE3039440C2 (en) * | 1980-10-18 | 1984-02-16 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Arrangement for receiving electrical and / or electronic components |
DE7505830U (en) * | 1975-02-25 | 1976-09-02 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | DEVICE FOR HIGH-VOLTAGE-PROOF AND GOOD THERMAL CONDUCTING INSTALLATION OF SEMICONDUCTOR COMPONENTS |
CS214034B1 (en) * | 1980-06-10 | 1982-04-09 | Michal Pellant | Semiconductor modulus |
JPS57133653A (en) * | 1981-02-12 | 1982-08-18 | Toshiba Corp | Resin sealed type semiconductor device |
FI72409C (en) * | 1984-03-09 | 1987-05-11 | Lohja Ab Oy | FOERFARANDE FOER INKAPSLING AV PAO EN BAERREMSA ANORDNADE HALVLEDARKOMPONENTER. |
FR2571895B1 (en) * | 1984-10-16 | 1987-07-24 | Silicium Semiconducteur Ssc | METHOD FOR MOUNTING TWO SEMICONDUCTOR COMPONENTS IN A COMMON PACKAGE AND DEVICE OBTAINED THEREBY |
DE3446585A1 (en) * | 1984-12-20 | 1986-07-03 | Stanley Electric Co Ltd | METHOD FOR PRODUCING A PUSHED ELECTRONIC CIRCUIT ARRANGEMENT |
US4775917A (en) * | 1985-12-03 | 1988-10-04 | Wells Manufacturing Company | Thermal compensated circuit board interconnect apparatus and method of forming the same |
DE3604882A1 (en) * | 1986-02-15 | 1987-08-20 | Bbc Brown Boveri & Cie | PERFORMANCE SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE MODULE |
JPS6331149A (en) * | 1986-07-25 | 1988-02-09 | Fujitsu Ltd | Semiconductor device |
US4841170A (en) * | 1986-12-08 | 1989-06-20 | John Fluke Mfg. Co., Inc. | Temperature controlled hybrid assembly |
KR0157844B1 (en) * | 1988-07-15 | 1998-10-15 | 모리나카 마사미 | Semiconductor device sealed with resin and the method of producing the same |
JPH0362844A (en) * | 1989-02-27 | 1991-03-18 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device |
DE3932882A1 (en) * | 1989-10-02 | 1991-04-11 | Siemens Ag | WELL HEAT-CONDUCTING COMPOSITE |
JPH04179263A (en) * | 1990-11-14 | 1992-06-25 | Hitachi Ltd | Resin-sealed semiconductor device, and manufacture thereof |
US5302553A (en) * | 1991-10-04 | 1994-04-12 | Texas Instruments Incorporated | Method of forming a coated plastic package |
-
1994
- 1994-08-23 DE DE9413550U patent/DE9413550U1/en not_active Expired - Lifetime
-
1995
- 1995-08-21 WO PCT/DE1995/001100 patent/WO1996006457A1/en active Application Filing
- 1995-08-21 AU AU33789/95A patent/AU3378995A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE9413550U1 (en) | 1996-01-11 |
WO1996006457A1 (en) | 1996-02-29 |
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