AU3307271A - Adhesive agent - Google Patents

Adhesive agent

Info

Publication number
AU3307271A
AU3307271A AU33072/71A AU3307271A AU3307271A AU 3307271 A AU3307271 A AU 3307271A AU 33072/71 A AU33072/71 A AU 33072/71A AU 3307271 A AU3307271 A AU 3307271A AU 3307271 A AU3307271 A AU 3307271A
Authority
AU
Australia
Prior art keywords
adhesive agent
adhesive
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU33072/71A
Inventor
Helmut Schmid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Services Ltd
STC PLC
Original Assignee
Standard Telephone and Cables Pty Ltd
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables Pty Ltd, Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables Pty Ltd
Publication of AU3307271A publication Critical patent/AU3307271A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU33072/71A 1970-09-08 1971-09-03 Adhesive agent Expired AU3307271A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702044484 DE2044484B2 (en) 1970-09-08 1970-09-08 Adhesion promoter for the production of printed circuits using the assembly method

Publications (1)

Publication Number Publication Date
AU3307271A true AU3307271A (en) 1973-03-08

Family

ID=5781908

Family Applications (1)

Application Number Title Priority Date Filing Date
AU33072/71A Expired AU3307271A (en) 1970-09-08 1971-09-03 Adhesive agent

Country Status (3)

Country Link
AU (1) AU3307271A (en)
DE (1) DE2044484B2 (en)
GB (1) GB1357647A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431447A1 (en) * 1974-07-01 1976-01-22 Dynamit Nobel Ag Ignition resistant laminates for printed circuit boards - featuring a non-aromatic non-conjugated resin layer beneath the conductor
DE2612438C2 (en) * 1976-03-24 1983-04-28 Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel Adhesion promoter layer for the production of printed circuit boards
DE2812497C3 (en) * 1978-03-22 1982-03-11 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Printed circuit
DE3028496C2 (en) * 1980-07-26 1986-04-24 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Adhesion promoter for a carrier material
US4804575A (en) * 1987-01-14 1989-02-14 Kollmorgen Corporation Multilayer printed wiring boards
TW293232B (en) * 1995-02-23 1996-12-11 Hitachi Ltd

Also Published As

Publication number Publication date
DE2044484B2 (en) 1973-09-27
GB1357647A (en) 1974-06-26
DE2044484A1 (en) 1972-03-09

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