AU3238384A - The discharge of heat from circuits - Google Patents

The discharge of heat from circuits

Info

Publication number
AU3238384A
AU3238384A AU32383/84A AU3238384A AU3238384A AU 3238384 A AU3238384 A AU 3238384A AU 32383/84 A AU32383/84 A AU 32383/84A AU 3238384 A AU3238384 A AU 3238384A AU 3238384 A AU3238384 A AU 3238384A
Authority
AU
Australia
Prior art keywords
circuits
discharge
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU32383/84A
Other versions
AU554687B2 (en
Inventor
Karl Gerd Drekmeier
Egon Reithmaier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of AU3238384A publication Critical patent/AU3238384A/en
Application granted granted Critical
Publication of AU554687B2 publication Critical patent/AU554687B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU32383/84A 1983-08-25 1984-08-24 The discharge of heat from circuits Expired - Fee Related AU554687B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19833330708 DE3330708A1 (en) 1983-08-25 1983-08-25 ARRANGEMENT OF HEAT EXTRACTION IN LAYER CIRCUITS
DE3330708 1983-08-25

Publications (2)

Publication Number Publication Date
AU3238384A true AU3238384A (en) 1985-02-28
AU554687B2 AU554687B2 (en) 1986-08-28

Family

ID=6207436

Family Applications (1)

Application Number Title Priority Date Filing Date
AU32383/84A Expired - Fee Related AU554687B2 (en) 1983-08-25 1984-08-24 The discharge of heat from circuits

Country Status (3)

Country Link
EP (1) EP0139973B1 (en)
AU (1) AU554687B2 (en)
DE (2) DE3330708A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3639881A1 (en) * 1986-11-21 1988-06-01 Fraunhofer Ges Forschung Device for cooling optoelectronic components
EP0290535A1 (en) * 1986-11-21 1988-11-17 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Device for cooling opto-electronic components, and use of a flanged connection for this purpose
DE4314199C2 (en) * 1993-04-30 1997-09-04 Bodenseewerk Geraetetech Device for heat dissipation from a vibration-damped suspended assembly
US5473511A (en) * 1994-05-05 1995-12-05 Ford Motor Company Printed circuit board with high heat dissipation
DE19602606C1 (en) * 1996-01-25 1997-07-17 Dornier Gmbh Thermally conductive components

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2994017A (en) * 1956-09-07 1961-07-25 Int Rectifier Corp Air-cooled rectifier assembly
JPS58200560A (en) * 1982-05-18 1983-11-22 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
DE3475143D1 (en) 1988-12-15
EP0139973B1 (en) 1988-11-09
EP0139973A2 (en) 1985-05-08
EP0139973A3 (en) 1985-09-25
AU554687B2 (en) 1986-08-28
DE3330708A1 (en) 1985-03-07

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