AU3175401A - Method for the installation of chips in card bodies - Google Patents
Method for the installation of chips in card bodiesInfo
- Publication number
- AU3175401A AU3175401A AU31754/01A AU3175401A AU3175401A AU 3175401 A AU3175401 A AU 3175401A AU 31754/01 A AU31754/01 A AU 31754/01A AU 3175401 A AU3175401 A AU 3175401A AU 3175401 A AU3175401 A AU 3175401A
- Authority
- AU
- Australia
- Prior art keywords
- chips
- installation
- card bodies
- bodies
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10006514 | 2000-02-15 | ||
DE10006514A DE10006514C5 (de) | 2000-02-15 | 2000-02-15 | Verfahren zum Einbau von Chips in Kartenkörper |
PCT/EP2001/001707 WO2001061642A1 (de) | 2000-02-15 | 2001-02-15 | Verfahren zum einbau von chips in kartenkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
AU3175401A true AU3175401A (en) | 2001-08-27 |
Family
ID=7630860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU31754/01A Abandoned AU3175401A (en) | 2000-02-15 | 2001-02-15 | Method for the installation of chips in card bodies |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU3175401A (de) |
DE (1) | DE10006514C5 (de) |
WO (1) | WO2001061642A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10207002A1 (de) * | 2002-02-19 | 2003-08-28 | Orga Kartensysteme Gmbh | Verfahren zum Implantieren von Chipmodulen in Datenträgerkarten |
DE10216163A1 (de) * | 2002-04-11 | 2003-11-06 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4410732C2 (de) * | 1994-03-28 | 1997-05-07 | Amatech Gmbh & Co Kg | Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit |
KR19980015325A (ko) * | 1995-08-25 | 1998-05-25 | 게브하르트 코흐 | 칩 카드를 제조하는 방법 및 장치 |
DE19601389A1 (de) * | 1996-01-16 | 1997-07-24 | Siemens Ag | Chipkartenkörper |
ATE209379T1 (de) * | 1996-08-22 | 2001-12-15 | Pav Card Gmbh | Verfahren zur herstellung einer elektrischen und mechanischen verbindung eines moduls in einer ausnehmung eines kartenkörpers |
DE19703990A1 (de) * | 1997-02-03 | 1998-08-06 | Giesecke & Devrient Gmbh | Modular aufgebauter, elektronischer Datenträger |
DE19708617C2 (de) * | 1997-03-03 | 1999-02-04 | Siemens Ag | Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte |
DE19709985A1 (de) * | 1997-03-11 | 1998-09-17 | Pav Card Gmbh | Chipkarte, Verbindungsanordnung und Verfahren zum Herstellen einer Chipkarte |
DE19721918C2 (de) * | 1997-05-26 | 2001-10-31 | Orga Kartensysteme Gmbh | Chipkarte und Verfahren zu deren Herstellung |
DE19731737A1 (de) * | 1997-07-23 | 1998-09-17 | Siemens Ag | Chipmodul für einen kartenförmigen Datenträger, entsprechender Kartenkörper sowie Verfahren zur Befestigung des Chipmoduls im Kartenkörper |
FR2773642B1 (fr) * | 1998-01-13 | 2000-03-03 | Schlumberger Ind Sa | Procede de connexion de plots d'un composant a circuits integres a des plages de connexion d'un substrat plastique au moyen de protuberances |
FR2774198B1 (fr) * | 1998-01-27 | 2001-08-31 | Solaic Sa | Procede de fixation d'un module electronique dans une cavite d'un corps d'objet portable, notamment corps de carte, par ultrasons |
-
2000
- 2000-02-15 DE DE10006514A patent/DE10006514C5/de not_active Expired - Fee Related
-
2001
- 2001-02-15 WO PCT/EP2001/001707 patent/WO2001061642A1/de active Application Filing
- 2001-02-15 AU AU31754/01A patent/AU3175401A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE10006514A1 (de) | 2001-08-30 |
DE10006514C2 (de) | 2002-04-18 |
DE10006514C5 (de) | 2004-08-12 |
WO2001061642A1 (de) | 2001-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |