AU2855400A - System and method for interconnecting layers in a printed circuit board - Google Patents

System and method for interconnecting layers in a printed circuit board

Info

Publication number
AU2855400A
AU2855400A AU28554/00A AU2855400A AU2855400A AU 2855400 A AU2855400 A AU 2855400A AU 28554/00 A AU28554/00 A AU 28554/00A AU 2855400 A AU2855400 A AU 2855400A AU 2855400 A AU2855400 A AU 2855400A
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
interconnecting layers
interconnecting
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU28554/00A
Inventor
Jerry D. Koontz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INTERWORKS COMPUTER PRODUCTS Inc
Original Assignee
INTERWORKS COMP PRODUCTS Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INTERWORKS COMP PRODUCTS Inc filed Critical INTERWORKS COMP PRODUCTS Inc
Publication of AU2855400A publication Critical patent/AU2855400A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU28554/00A 1999-01-22 2000-01-21 System and method for interconnecting layers in a printed circuit board Abandoned AU2855400A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23597099A 1999-01-22 1999-01-22
US09235970 1999-01-22
PCT/US2000/001518 WO2000044209A1 (en) 1999-01-22 2000-01-21 System and method for interconnecting layers in a printed circuit board

Publications (1)

Publication Number Publication Date
AU2855400A true AU2855400A (en) 2000-08-07

Family

ID=22887605

Family Applications (1)

Application Number Title Priority Date Filing Date
AU28554/00A Abandoned AU2855400A (en) 1999-01-22 2000-01-21 System and method for interconnecting layers in a printed circuit board

Country Status (2)

Country Link
AU (1) AU2855400A (en)
WO (1) WO2000044209A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7488329B2 (en) 2000-03-07 2009-02-10 Zimmer Technology, Inc. Method and apparatus for reducing femoral fractures

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001605A (en) * 1988-11-30 1991-03-19 Hughes Aircraft Company Multilayer printed wiring board with single layer vias
EP0602257B1 (en) * 1992-12-12 1997-09-10 International Business Machines Corporation Printed circuits with local higher wiring density and method for manufacturing such printed circuits
US5418689A (en) * 1993-02-01 1995-05-23 International Business Machines Corporation Printed circuit board or card for direct chip attachment and fabrication thereof
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes
US5764485A (en) * 1996-04-19 1998-06-09 Lebaschi; Ali Multi-layer PCB blockade-via pad-connection
EP0883173B1 (en) * 1996-09-12 2007-09-12 Ibiden Co., Ltd. Circuit board for mounting electronic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7488329B2 (en) 2000-03-07 2009-02-10 Zimmer Technology, Inc. Method and apparatus for reducing femoral fractures

Also Published As

Publication number Publication date
WO2000044209A1 (en) 2000-07-27

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase