AU2008302241B2

AU2008302241B2 - Diffusion bonding

Info

Publication number: AU2008302241B2
Application number: AU2008302241A
Authority: AU
Inventors: Jon Dreher; Larry Leyrer; Gigi Streeter; Kevin Van Dyke
Original assignee: Barnes Group Inc
Current assignee: Barnes Group Inc
Priority date: 2007-09-19
Filing date: 2008-09-18
Publication date: 2012-08-16
Anticipated expiration: 2028-09-18
Also published as: CA2699952C; EP2274131A1; CN101827682B; CN101827682A; RU2455138C2; WO2009039282A1; CA2699952A1; JP5502737B2; RU2010115350A; EP2274131A4; AU2008302241A1; JP2010538839A

Abstract

A method of forming a part that includes a first component and a second component diffusion bonded together. The first component is a pressure component, including a first bond land surface. The second component is a suction component, including a second bond land surface. A mandrel includes a first surface having a contour that mates with at least a portion of the first component and a second surface having a contour that mates with at least a portion of the second component. The first and second components are positioned on the mandrel so that the first bond land surface and the second bond land surface are in mating abutment The first and second components together with the mandrel are positioned in a die assembly. The die assembly including a first die, a second die and a plurality of fastening members for releasably securing the first die to the second die.

Description

WO 2009/039282 PCT/US2008/076865 DIFFUSION BONDING CROSS-REFERENCES [0001] The present disclosure claims priority to U.S. Provisional Patent Application No. 60/994,362, filed September 19, 2007 and U.S. Provisional Patent Application No. 61/020,548, filed January 11, 2008, the disclosures of both of which are incorporated herein by reference. BACKGROUND [0002] The present disclosure concerns improvements in or relating to diffusion bonding. [0003] It is known to use isostatic pressure techniques to diffusion bond metal components together. Diffusion bonding occurs when two mating surfaces are pressed together under temperature, time and pressure conditions that allow interchange of atoms across the interface. It is necessary that the surfaces to be joined are clean and that the variables of temperature, pressure and time are closely controlled, so that the necessary interchange of atoms may be achieved. Isostatic pressing is the application of high pressure gas (e.g. argon) at high temperature within a pressure vessel to the components to be joined. Gas pressure is applied isostatically so that there are minimal or no changes to the geometry of the components being joined. This diffusion bonding process requires the efficient sealing of the components, and conventionally, this has been accomplished outside the pressure vessel in a preliminary step. However, the seal between the components after this preliminary step is fragile, and great care has to be taken in moving the joined components to the apparatus where the diffusion bonding process is to be carried out. [0004] Further, as it relates to parts for the impact protection of jet engine fan blades, such parts are exposed to potential impacts from birds and other foreign objects specifically during takeoff where the parts are under the most severe stress while at the same time being the most susceptible to impacts. Conventionally, the parts were constructed as one-piece. However, the one-piece part is costly to manufacture. Two piece parts having a welded joint and/or a bonded joint via a conventional diffusion bonding process could not withstand the impacts associated with the use of the parts. 1 2 The raw material required to make a one-piece part is costly and is double the cost of a two-piece part. This along with the amount of machining required to generate the internal and external surfaces is tremendous. Most of the machining time required is to produce the internal surfaces and specifically an internal nose radii due to the depth of cut and the small size of the internal nose radii and therefore the need to use small cutting tools. OBJECT OF THE INVENTION [00051 It is the object of the present invention to substantially overcome or ameliorate one or more of the above disadvantages, or at least provide a useful alternative. SUMMARY OF THE INVENTION [00061 In accordance with one aspect of the present disclosure, there is provided a method of forming a part that includes a first component and a second component and which two components are diffusion bonded together, the method comprising: providing a first component, the first component being configured as a pressure component and includes a first bond land surface; providing a separate second component, the second component being configured as a suction component and includes a second bond land surface; providing a mandrel, the mandrel including a first surface having a contour that mates with at least a portion of the first component and a second surface having a contour that mates with at least a portion of the second component; positioning the first and second components on the mandrel so that the first bond land surface and the second bond land surface are in mating abutment; connecting the first component to the second component at discrete locations along a longitudinal length of the first and second components and at a location that is spaced from the first and second bond land surfaces; positioning the connected first and second components together with the mandrel in a die assembly, the die assembly including a first die, a second die and a plurality of fastening members for releasably securing the first die to the second die, the first and second dies being formed of a first material having a first coefficient of thermal expansion, the fastening members being formed of a second material having a second smaller coefficient of thermal expansion, at least one of said first and second components formed of a material having a different composition from said first and second dies and said fastening members; placing the die assembly in a vacuum furnace for a diffusion bonding cycle; 3 evacuating the furnace of gasses that can contaminate and adversely interfere with a diffusion bond between the first and second components; increasing the temperature of the furnace to a predetermined temperature; applying uniform pressure across an interface between the first and second bond land surfaces of the first and second components, said step of applying uniform pressure including use of a gas-filled container formed of flexible sheet material, the container being positioned between one of the first and second components and one of the first and second dies, wherein pressure within the container is controlled to a predetermined pressure and maintained for a predetermined time period, wherein the container provides a uniform load to the interface of the first and second bond land surfaces of the first and second components during said formation of said diffusion bond between the first and second bond land surfaces; maintaining a vacuum level, temperature and pressure within the furnace for a predetermined period of time to form a diffusion bond between the first and second bond land surfaces; and removing the die assembly including the diffusion bonded first and second components from the furnace; and, removing the die assembly including the diffusion bonded first and second components from the furnace. [00071 In accordance with another aspect of the present disclosure, there is provided a method of diffusion bonding comprising: providing a first component including a first bond land surface having a wave like conformation; providing a second component including a second bond land surface having a wave-like conformation; preparing and cleaning the mating first and second bond land surfaces to be diffusion bonded to a predetermined condition such that diffusion bonding across an interface between the surfaces is possible; connecting the first component to the second component at discrete locations along a longitudinal length of the first and second components and at a location that is spaced from the first and second bond land surfaces so that the first and second bond land surfaces are in mating abutment; providing a diffusion bonding die assembly configured to releasably secure the connected components therein, the die assembly including a first die, a second die and a plurality of fastening members for releasably securing the first die to the second die; 4 coating the die assembly and selected portions of the first and second components with a release agent, the coating being absent from the first and second bond land surfaces; placing the first and second components with the first and second bond land surfaces in mating abutment in the die assembly; placing a gas-filled container formed of flexible metal sheet material between said first component and said die assembly, said second component and said die assembly, or combinations thereof, said gas-filled container designed to applying uniform pressure to said first component, said second component, or combinations thereof during the diffusion bonding process; placing the die assembly in a vacuum furnace for a diffusion bonding cycle; evacuating the furnace of gasses that can contaminate and adversely interfere with diffusion bond between the first and second components; increasing the temperature of the furnace to a first temperature; maintaining the first temperature for a predetermined period of time; increasing the temperature of the furnace to a second temperature, said second temperature greater than the first temperature; maintaining the second temperature for a predetermined period of time; applying a first pressure at the second temperature across the interface of the first and second components for a predetermined period of time; increasing the applied pressure to a second pressure, said second pressure greater than the first pressure; applying the second pressure at the second temperature across the interface of the first and second components for a predetermined period of time; decreasing the applied pressure to a third pressure, said third pressure greater than the first pressure; applying the third pressure at the second temperature across the interface of the first and second components for a predetermined period of time; decreasing the temperature of the furnace to a third temperature, the third temperature less than the first temperature; and removing the die assembly including the diffusion bonded first and second components from the furnace. [00081 In accordance with another aspect of the present disclosure, there is provided a diffusion bonding die assembly for diffusion bonding a first component having a 5 nonplanar first bond land surface to a second component having a nonplanar second bond land surface, the diffusion bonding die assembly comprising: a mandrel configured to releasably hold the first and second components, the first bond land surface and the second bond land surface being in mating abutment on the mandrel; an upper die including an upper surface and a lower surface, the lower surface including a first portion configured to engage the mandrel and a second portion configured to mate with one of the first and second components; a lower die including an upper surface and a lower surface, the upper surface including a first portion configured to engage the mandrel and a second portion configured to mate with one of the first and second components; a flexible pressure container designed to be at least partially disposed between one of the upper and lower dies and one of the first and second bond land surfaces of the first and second components; and a plurality of fastening members for securing the upper die to the lower die, the plurality of fasteners being configured to limit expansion of the upper and lower dies during a diffusion bonding cycle, the upper and lower dies formed of a first material having a first coefficient of thermal expansion, the fastening members formed of a second material having a second coefficient of thermal expansion that is less than the first coefficient of thermal expansion. [00091 In accordance with yet another aspect of the present disclosure, there is provided a part formed by diffusion bonding, the part comprising a first component including a first bond land surface, a second surface offset from the first bond land surface via a connecting, arcuate wall, and a third surface opposite the first and second surfaces; a second component including a first surface and a second surface, a section of the second surface forming a second bond land surface which is bonded to the first bond land surface of the first component; the first bond land surface and the second bond land surface have a ribbon-like conformation; the first and second bond land surfaces diffusion bonded together; the first component including a first section and a second section, the first component generally curving along two opposed diameters from the first section to the second section; the second component including a first section and a second section, the second component generally curving along two opposed diameters from the first section to the second section.

5a BRIEF DESCRIPTION OF THE DRAWINGS [00101 Preferred embodiments of the invention will be described hereinafter, by way of examples only, with reference to the accompanying drawings, wherein: [0010A] FIGURE 1 is a side elevational view of a non-limiting part including a first component and a second component bonded to the first component in accordance to the diffusion bonding process of the present disclosure. 10011] FIGURE 2 is a side elevational view of the first component of the part of FIGURE 1. [00121 FIGURE 3 is a top perspective view of the first component of FIGURE 2. [00131 FIGURE 4 is a cross-sectional view of the first component of FIGURE 2 taken generally along lines 4-4 of FIGURE 2. 100141 FIGURE 5 is a partially enlarged view of FIGURE 4. [00151 FIGURE 6 is a side elevational view of the second component of the part of FIGURE 1. 100161 FIGURE 7 is a cross-sectional view of the second component of FIGURE 6 taken generally along lines 7-7 of FIGURE 6. [00171 FIGURE 8 is a side elevational view of the first component of the part of FIGURE 1 illustrating a non-limiting bond land surface. [0018] FIGURE 9 is a side elevational view of the second component of the part of FIGURE 1 illustrating a non-limiting bond land surface. [00191 FIGURE 10 is a front perspective view of a mandrel having the first and second components positioned thereon. [0020] FIGURE 11 is a partially enlarged view of FIGURE 10. [0021] FIGURE 12 is a side cross-sectional view of FIGURE 10. [0022] FIGURE 13 is an exploded front perspective view of a non-limiting diffusion bonding die assembly for forming the part of FIGURE 1 including a first die, a second die, a pressure bag, and the mandrel and first and second components of FIGURE 10. [0023] FIGURE 14 is a front perspective view of the diffusion bonding die assembly of FIGURE 13 is an assembled condition.

WO 2009/039282 PCT/US2008/076865 [0024] FIGURE 15 is a cross-sectional view of the diffusion bonding die assembly of FIGURE 13 taken generally along lines 15-15 of FIGURE 13. [0025] FIGURE 16 is a partially enlarged view of FIGURE 15. [0026] FIGURE 17 is a cross-sectional view of the diffusion bonding die assembly of FIGURE 13 taken generally along lines 17-17 of FIGURE 13. [0027] FIGURE 18 is a partially enlarged view of FIGURE 17. [0028] FIGURE 19 is a front perspective view of the first and second dies and the mandrel in a post diffusion bonding inspection condition. [0029] FIGURE 20 is a side perspective view of the part of FIGURE 1. [0030] FIGURE 21 is a cross-sectional view of the part of FIGURE 20. [0031] FIGURE 22 is an enlarged partial view of FIGURE 21. [0032] FIGURE 23 is a chart summary of a non-limiting diffusion bonding process according to the present disclosure. DETAILED DESCRIPTION [0033] It should, of course, be understood that the description and drawings herein are merely illustrative and that various modifications and changes can be made in the structures disclosed without departing from the present disclosure. It will also be appreciated that the various identified components for the diffusion bonding process disclosed herein are merely terms of art and should not be deemed to limit the present disclosure. [0034] Further, it should be appreciated that the component materials disclosed herein are by way of example only. The component materials can further include not only elementary metals but metal alloys per se and alloys of metals with ceramic material. The materials may be in the form of sintered powder, a casting, sheet, plate or a forging. [0035] Referring now to the drawings, wherein like numerals refer to like parts throughout the several views, FIGURE 1 illustrates a non-limiting example of a part 100 to be manufactured via a diffusion bonding process according to the present disclosure. The example should not be construed as limiting as the example is useful in understanding and practicing the diffusion bonding process described herein. 6 WO 2009/039282 PCT/US2008/076865 [0036] A general overview of the diffusion bonding process is first provided. The part 100 is manufactured in two separate components, to wit, a first, pressure side component 102 that is bonded to a second, suction side component 104 at a bond joint 110. As can be appreciated, part 100 can be formed of more than two components; however, this is not required. The first component 102 can be manufactured from AMS 4911 plate stock (approximately .375 in. thick) that is rough machined, hot formed and then machine finished in preparation for diffusion bonding. The second component 104 can be manufactured from AMS 4911 sheet stock (approximately .040 in. thick) that is machine finished as a flat pattern and then hot formed. As can be appreciated, one or both of the components can be formed of different materials and/or have different thicknesses. [0037] As is well known, AMS 4911 is a titanium alloy which is heat treatable and combines excellent strength and corrosion resistance. AMS 4911 is widely used in the aircraft industry in a variety of turbine (i.e., turbine discs) and "hot" structural applications. It is generally employed in applications up to 750 OF (400 0C). [0038] In preparation for the diffusion bonding process, the two components 102, 104 are typically cleaned, connected together and then loaded into a diffusion bonding die assembly 106 according to the present disclosure (FIGURES 13 and 14). The diffusion bonding die assembly 106 is then placed in a heating arrangement such as a vacuum furnace and a diffusion bonding cycle is run at preset parameters. After bonding, metallographic samples can be taken and evaluated for bond integrity; however, this is not required. The part 100 can also, or alternatively, be ultrasonically inspected; however, this is not required. After ultrasonic inspection, the part is typically finished machined and manually dressed to meet predetermined visual requirements. Again, the part 100 is by way of example only. It should be appreciated that parts having alternative materials, shapes and/or sizes can be manufactured via the diffusion bonding process described herein. [0039] The first and second components 102, 104 of the part 100 will now be described in greater detail. With reference to FIGURES 2-5, the first component 102 comprises a first elongated member 112 having a wave-like or ribbon-like conformation. Particularly, as shown in FIGURE 3, as the elongated member twists from a first end 7 WO 2009/039282 PCT/US2008/076865 portion 114 to a second end portion 116, the elongated member curving along two opposed diameters. The elongated member includes a first or primary bond land surface 120, a second surface 122 offset from the bond land surface via a wall 126, and a third surface 128 opposite the first and second surfaces. A plurality of spaced apart tabs 130 can extend from the first surface. As shown in FIGURE 4, the first and third surfaces together 120, 128 define a first section 134 of the elongated member and the second and third surfaces together 122, 128 define a second section 136 of the elongated member. The first section 134 increases in thickness as it transitions into the second section 136; however, this is not required. The second section decreases in thickness as it extends at an acute angle from the first section. As noted in FIGURE 1, the first component 102 has a varying thickness. [0040] With reference to FIGURES 4 and 5, the wall 126 connects the first surface 120 and the second surface 122. The wall includes an arcuate surface 140 having a first end 142 that connects to the second surface and a second end 144 that connects to a ramp 150. The ramp has a generally triangular shape, an end portion of the ramp being slightly offset from the first surface. [0041] With reference to FIGURES 6 and 7, the second component 104 comprises a second elongated member 160 having a wave-like or ribbon-like conformation, which twists from a first end portion 166 to a second end portion 168. The second elongated member includes a first surface 162 and a second surface 164. A section 170 of the second surface at least partially defines a second mating bond land surface that is bonded to the first, bond land surface 120. Similar to the first elongated member, a plurality of spaced apart tabs 172 can extend from the bonding surface section 170. As noted in FIGURE 1, the second component 104 includes a first section 174 having a constant thickness and a second, transitioning section having a decreasing thickness; however, this is not required. [0042] In preparation for the diffusion bonding process, and as indicated above, the first and second components 102, 104 are cleaned and the mating surfaces of the first and second components are prepared to a predetermined smoothness (e.g., a smoothness of about 1 micron or better). The components 102, 104 are then connected and loaded into the diffusion bonding die assembly 106. To facilitate the 8 WO 2009/039282 PCT/US2008/076865 cleaning and any subsequent inspection, and as shown in FIGURES 8 and 9, the first and second components include at least one hole 180, 182 which allows the first and second components to be hung to avoid contact with foreign surfaces. As can be appreciated, this inclusion of one or more holes in the components is not required. (0043] With reference to FIGURES 10-12, a mandrel 200 is provided to ensure the proper connecting of the first component 102 to the second component 104. The mandrel includes a base 202 and an arm 204 extending from the base. The arm is generally triangular in shape and includes a first surface 205, a second surface 206 and an arcuate end portion 208. As can be appreciated, the arm 204 can have other shapes. The first and second surfaces have contours which mate with the ribbon-like contours of the respective first and second components 102, 104. The end portion 208 has a contour which mates with the arcuate surface 140 of the wall 126. This allows the first component 102 to be releasably positioned on the mandrel. At least one pin 210 extends outwardly from a lower portion of the second surface 206 of the arm 204. The at least one pin allows the second component to be releasably placed on the mandrel. As shown, two pins are provided; however, a greater or lesser number of pins can be used. The pins are located a predetermined distance from the end portion 208 so that once the second component 104 is positioned on the pins 210, the tabs 172 can be aligned with the tabs 130 (see FIGURE 11). Once aligned, the tabs 130, 172 are held together by suitable fastening means, such as, but not limited to, small C-clamps (not shown). The mandrel 200 and clamped first and second components 102, 104 are then placed in an argon chamber (not shown) wherein the tabs 130, 172 can be tack welded together. Although, it should be appreciated that the first and second components can be connected via additional or alternative means. In that instance, the tabs 130, 172 are not required. The mandrel and connected first and second components are then quickly placed in the diffusion bonding die assembly 106 to ensure that the bonding surfaces remain clean. [0044] As shown in FIGURES 13 and 14, the diffusion bonding die assembly 106 comprises a first die 220 and a second die 222. The second die includes a surface 230 having a configuration which can mate with one of the first and second components 102, 104. The first die includes a surface 232 which can conform to the other of the first 9 WO 2009/039282 PCT/US2008/076865 and second components. For example, the surfaces 230, 232 can have a wave-like or ribbon-like conformation; however, surfaces 230, 232 can have other or additional shapes. In the depicted embodiment, surface 230 protrudes at least partially from the second die and engages the second component 104. Surface 232 protrudes at least partially from the first die and engages the first component 102. The first die 220 includes a plurality of spaced apart cutouts 250 located on opposed sides 252, 254 of the die. A wall 256 of the first die includes a plurality of spaced apart shelves 258 which extend outwardly from the wall 256. The cutouts 250 extend through the shelves 258. Similarly, the second die 222 includes a plurality of spaced apart cutouts 260 located on opposed sides 262, 264 of the die. A wall 270 of the second die 222 includes a plurality of spaced apart shelves 272 which extend outwardly from the wall 270. The cutouts 260 extend through the shelves 272. In an assembled position (FIGURE 14), the wall 256 is parallel to the wall 270; however, this is not required. The first and second dies 220, 222 can be formed of a HH2 casting, which is a 309 stainless steel that has a high carbon content; however, other materials can be used. [0045] As shown in FIGURES 15 and 16, in an assembled position, the mandrel 200 is securely positioned between the first and second dies 220, 222. Particularly, the mandrel 200 includes first and second opposed grooves 274 and 276, respectively. Each groove extends the length of the mandrel base 202; although, this is not required. The first and second grooves 274, 276 are configured to receive first and second projections 280, 282 located on the respective first and second dies 220, 222. Spacing is provided between portions of the base 202 and the first and second dies. As shown in FIGURES 17 and 18, the mandrel 200 further includes first and second recesses 288, 290, respectively. The recesses are located in an offset region 292 of the mandrel base and are generally normal to the first and second grooves 274, 276. The first and second recesses 288, 290 are configured to receive first and second tabs 294, 296 located on the respective first and second dies 220, 222. Each tab extends inwardly from a respective offset region 300, 302 of each die 220, 222. Further, the surface 232 of the first die 220 includes an offset portion 304. At least a portion of the pressure bag 340 is disposed in the offset portion for bond transition. 10 WO 2009/039282 PCT/US2008/076865 [0046] With reference again to FIGURE 14, in the assembled position, the cutouts 250 are aligned with the cutouts 260 and corresponding cutouts 310 located on the base 202 of the mandrel 200. The cutouts are dimensioned to receive fastening member or pins 320. As shown, each pin can be generally dumbbell-shaped; although, this is not required. The pin includes and a shaft 322 and caps 324, 326 located on ends of the shaft. The shaft is cylindrically shaped and the caps are rectangularly shaped; although, this is not required. As shown, sixteen pins are provided, eight for each side of each first and second die 220, 222. Although, it should be appreciated that more or less than sixteen pins can be used to secure the diffusion bonding die assembly 106. Each pin can be stamped with its own unique number and correlates with a cutout location stamped on the die assembly 106. Additionally, the pins can be marked with a letter of the alphabet that associates them with a specific die. Each pin has a predetermined length, the length of the pin being dependent on it location on the die. [0047] The pins can be formed from a Haynes 230 alloy; however, other materials can be used. As is well known, Haynes 230 alloy is a nickel-chromium-tungsten molybdenum alloy that combines excellent high temperature strength, outstanding resistance to oxidizing environments up to 2100*F (1 149*C) for prolonged exposures, premier resistance to nitriding environments, and excellent long-term thermal stability. It is readily fabricated and formed, and is castable. Other attractive features include lower thermal expansion characteristics than most high-temperature alloys, and a pronounced resistance to grain coarsening with prolonged exposure to high-temperatures. [0048] As illustrated in FIGURE 13, a pressure container or bag 340 is positioned between one of the first and second dies 220, 222 and one of the first and second components 102, 104 positioned on the mandrel 200 for applying a uniform pressure between the one of the first and second dies and one of the first and second components during the diffusion bonding process. The pressure bag is made of a flexible sheet of material, such as, but not limited to, a sheet of 309 stainless steel, so that the pressure bag can conform to the shape of one of the first and second components located on the mandrel 200. This is desirable because the twisting, ribbon 11 WO 2009/039282 PCT/US2008/076865 like shape of each part component 102, 104 makes it difficult for the first and second components to be simply pressed in a conventional die. [0049] In the depicted embodiment of FIGURE 13, the pressure bag is disposed between the surface 232 of the first die 220 and the second component 104 located on the mandrel 200. One of the first die and the mandrel can include means for proper positioning of the pressure bag thereon. For example, the first die can include locating pins (not shown) which engage corresponding holes (not shown) located on the pressure bag. The pressure bag 340 defines a chamber (not shown) for receiving a gas from a remote source via a gas line 342 connected to the pressure bag. In this embodiment, compressed argon gas is released from a storage tank at approximately 200 PSI to approximately 250 PSI; although, alternative gases and pressures are contemplated. The argon gas flows through a hose and into the pressure bag line 342. The line can be regulated by a digital pressure gage (not shown) that can be monitored by the operator. The argon gas dew point can be periodically monitored (e.g., monthly, etc.) to determine that moisture content generally does not to exceed about -76 F. [0050] As it relates to the complementary materials for the first and second dies 220, 222 and the pins 320, the HH2 material compared to the Haynes 230 alloy provides a small but significant difference in the coefficients of thermal expansion between the two materials. It should be appreciated by one skilled in the art that alternative complementary metal or metal alloys are contemplated so long as differing coefficients of thermal expansion exists between the alternative materials. As is well known, coefficients of thermal expansion of a material are complicated and can vary dramatically as the actual temperature varies, but defines the relationship of the change in size of a material as the temperature of the material changes. A coefficient of thermal expansion is the fractional increase in length per unit rise in temperature. It can be defined at a precise temperature or over a temperature range. Thermal expansion is an important considerations in design, and are often overlooked. As will be appreciated by one skilled in the art, the coefficient of thermal expansion for the HH2 material is slightly higher than that of Haynes 230 alloy. Thus, the first and second dies 220, 222 will expand slightly more than the pins 320 upon exposure to a temperature exceeding the annealing temperatures of both materials. In use, as the temperature in the furnace 12 WO 2009/039282 PCT/US2008/076865 increases, the first and second dies 220, 222 will start to expand. This expansion will be limited by the pins 320, which are expanding at a slower rate. Additionally, because the pins 320 can have differing lengths, the length of the pins can further limit the expansion of the first and second dies. The difference in expansion between the first and second dies and pins transfers pressure to the pressure bag 340, which, in turn, provides a uniform load to the bond land surfaces 120, 170 of the first and second components 102, 104. Further, the increase of temperature in the furnace will increase the pressure within the pressure bag 340, which, in turn, increases the pressure between the first and second dies 220, 222 and the first and second components 102, 104. [0051] Non-expandable thermocouples 344 can be located in at least one of the first and second dies 220, 222 for monitoring temperature. The thermocouples are generally used for up to thirty bond cycles and can be calibrated to special limits. Usage of the thermocouples can be controlled by system accuracy tests performed at about 1500*F to a maximum deviation of ±4 0 F (±0.4%) to maximum ±5"F or up to the thirty bond cycles, whichever occurs first. [0052] With reference to FIGURES 20-21, the part 100, after the diffusion bonding process and the connected tabs 130 and 172 are carefully removed from the part, includes a bond area 370. The bond area can be ultrasonically inspected to ensure proper connection between the bond land surface 120 of first component 102 and the section 170 of the second surface 164 of second component 104. The external surfaces of the part can then be cleaned and finished. [0053] With reference to FIGURE 23, a summary of the diffusion bonding process according to the present disclosure is provided. As indicated previously, the first component 102 can be manufactured from AMS 4911 plate stock (approximately .375 in. thick) that is rough machined, hot formed and then machine finished in preparation for diffusion bonding. The second component 104 can be manufactured from AMS 4911 sheet stock (e.g., .040 in. thick) that is machine finished as a flat pattern and then hot formed. [0054] In preparation for the diffusion bonding process, the two components 102, 104 are cleaned, connected together and loaded into the diffusion bonding die 13 WO 2009/039282 PCT/US2008/076865 assembly 106. In order to chemically clean the first and second components, the halves can be placed on cleaning racks made of 316 stainless steel. Up to four separate processing tanks can be utilized for the cleaning, namely, an alkaline cleaner tank, a chemical clean etch tank, a city rinse tank and/or a deionize rinse tank. The parameters of each of the tanks are provided below. The maximum time between cleaning and diffusion bonding is generally eight (8) hours or less. ALKALINE CLEANER CHEM-CLEAN ETCH CITY RINSE TANK DEIONIZE RINSE TANK TANK TANK Solution Components Solution Components at Solution Components - Solution Components at start up: start up: 100% City Water 100% Deionized water Water = 48" = 745 gals 35 +/- 5% Nitric (HNO 3 ) Operating Conditions - Operating Conditions = 17.8" = 278 gals Temperature - As Temperature - As 8-10 oz./gal Turco received in city line; received in city line Vitro-Kleene = 500 lbs 3 +/- 1% Hydrofluoric through Dl unit; (1 1/4 drum) (HF) = 1.5" = 24 gals Agitation - Air or Spray Agitation - Spray rinse when activated; when activated Operating Conditions - Remainder Water= Temperature - 160*F- 31.6" = 493 gals No contaminants - such Control limits 200*F; as rust particles if Conductivity - <10 Air Agitation Operating Conditions - overflow tank umhos (which = 6ppm Temperature - RT to NaCI); Total Dissolved Frequency Analysis - 120*F max; Air Agitation Control limits - Chlorine Solids (TDS) -10 ppm Once per week content - 2.0 ppm max.; max Frequency Analysis - Total Dissolved Spec limit - Vitro- Twice weekly Kleene 7-12 oz/gal Solids (TDS) - 750 ppm Spec limit- HNO 3 (30- max.; Chlorides - 30 Target limits - Vitro- 40%); *HF (6% Max); ppm max Kleene 8-10oz/gal Etch rate .0015-.005 I/S/H Target limits - HNO 3 (31 39%); Etch rate .0019 .0046 I/S/H *Note: Acid tanks - shall be controlled by etch rate. Process may continue if etch rate is within limits and HF is below minimum limit [0055] The first and second dies 220, 222 are inspected to ensure die flatness and parallelism. The length of each pin 320 is typically measured for accuracy. The contours of each die 220, 222 and the mandrel 200 can be inspected after every 10th bond cycle; however, inspections can occur after more or less numbers of bond cycles. 14 WO 2009/039282 PCT/US2008/076865 The second die can be divided into multiple sections (e.g. 3, 4, 5, 6 sections, etc.) and compared to certain die parameters. Data regarding the die can be collected and stored electronically to be monitored. This data collection can serve as a trouble shooting tool relative to part quality. The pressure bag 340 can be pressure tested prior to every bond cycle to confirm that the pressure bag will hold pressure (e.g., 50 psi with argon gas) and that there are no leaks. With reference to FIGURE 19, the diffusion bonding die assembly 106 and mandrel can be inspected after one or more cycles. Particularly, the first and second dies 220, 222 and the mandrel 200 are generally assembled without the pressure bag 340 to verify that a gap 306 surrounding the first and second dies and mandrel does not exceed a maximum gap of approximately 0.010 inches. [0056] The furnace is also periodically checked. For example, furnace burn outs can be performed weekly at about 2000*F for one hour. Furnace leak rates meeting less than or equal to about 3 microns or less per hour are performed weekly. Furnace temperature uniformity surveys to about ±15 0 F are performed quarterly. System accuracy tests are performed monthly to about 0.5% to maximum about ±5"F (this includes control thermocouples and load thermocouples). Instrumentation calibrations are performed quarterly to about ±2*F readable within about 1 F. [0057] Prior to diffusion bonding, the following items generally are verified: 1) that a scheduled burnout has been performed; 2) that the scheduled leak rate has been performed and is less than or equal to a predetermined amount per hour; 3) that there is sufficient gas for delivery to the pressure bag 340 during a bond cycle; and 4) that the first and second dies 220, 222 are clean and free of any oils/grease/cutting fluid residue, etc. If the diffusion bonding die assembly 106 is not clean, the diffusion bonding die should be burned out at about 1800 F for about 1 hour, furnace cool to about 1000*F maximum and gas fan quench; 5) that the first and second dies 220, 222 and mandrel 200 and pressure bag 340 are clean from any previous bond cycle (i.e., have been scotch-brited smooth), with no remaining solids, residue or raised material on the surfaces. The surfaces must be dry. [0058] To assemble the diffusion bonding die assembly 106 for a diffusion bonding cycle, the operator should wear clean lint free gloves. The mandrel 200, first and 15 WO 2009/039282 PCT/US2008/076865 second dies 220, 222 and the pressure bag 340 can be coated with a release agent, such as a boron nitride spray. Specifically identified critical areas of the first and second components are also coated with the release agent. The release agent is typically used when diffusion bonding titanium components. The part 100 is loaded onto the mandrel 200 and the mandrel is placed on the second die 222 as described above making sure that the connected tabs 130, 172 of the part 100 are seated properly into the second die. The pressure bag 340 is placed at least partially over the part and secured on the first die. The pins 320 are then secured to the diffusion bonding die assembly 106, noting that the pins can be numbered and correlated with a numbered position on the first die 220. The pressure bag 340 is inflated with gas and held to verify that the pressure bag maintains adequate pressure. The diffusion bonding die assembly 106 including mandrel 200 and part 100 are then loaded into a vacuum furnace in a predetermined orientation (i.e., 450 front right to back left). The gas pressure valves are left open to prevent pressure build up in the pressure bag until soak point. The furnace's pyrometry system is controlled per set requirements. The furnace is first purged with argon gas to displace any atmospheric contamination and then the furnace is evacuated to a predetermined vacuum level. Multiple bonding dies may be run in one furnace load depending on the size of the vacuum furnace being used. [0059] The diffusion bonding cycle of the present disclosure is typically run to the following preset parameters; although, it should be appreciated that the exemplary parameters can vary. FURNACELOAD EQUIPMENT: VACUUM BONDING PRESS MAT L SPEC: AMS 4911 MAX. STK. THK.: 0.300" (Ref Only) APPROX. PART SIZE: 6" x 42" (Die Size 10" x 1' x 3.5') ATMOSPHERE (DURING RAMP): 5 x 104 Torr Max. ATMOSPHERE (DURING SAOK): 5 x 104 Torr Max. Controller Set Point May Be Set Within 10 Deg. F. Higher Or Lower Than The Soak Temps To Bring The TC Spread Within The Evenly Distributed ± Range. Pump Furnace Down To < 3 microns Then Backfill With Argon And Turn On Fan Twice At Start Of Cycle 1 4 Ramp Rate: 20 F./ Min Max. 1 Soak Temp: 1500 ± 50 Deg. F. 1S Soak Time: Equalize TC's to ± 20 As Cycle Temp Increases Verify That There Is No Pressure In The Pressure Bag 16 WO 2009/039282 PCT/US2008/076865 20 Ramp Rate: 5 F./ Min. Max. 2 Soak Temp: 1700 ± 15 Deg. F. 2 d Soak Time: Hold 150-170 Minutes Once load reaches soak temp pressurize to 100 10 psi for 50-60 minutes, increase to 200 ± 10 psi for next 50-60 minutes, then decrease to 150 10 psi for remaining cycle. Release pressure after end of cycle. 3 1 Ramp Rate: Furnace Cool 3 rd Soak Temp: 1200 Deg. F. 3 r Soak Time: N/A 4' Ramp Rate: N/A 4h Soak Temp: N/A 4 * Soak Time: N/A GAS FAN COOL USING ARGON ATMOSPHERE TO A MAX. TEMP. OF 300 DEG. F FURNACE LOAD EQUIPMENT: VACUUM BONDING PRESS MAT'L SPEC: AMS 4911 MAX. STK. THK.: 0.300" (Ref Only) APPROX. PART SIZE: 6" x 42" (Die Size 10" x 1' x 3.5') ATMOSPHERE (DURING RAMP): 5 x 10 4 Torr Max. ATMOSPHERE (DURING SAOK): 5 x 104 Torr Max. Controller Set Point May Be Set Within 10 Deg. F. Higher Or Lower Than The Soak Temps To Bring The TC Spread Within The Evenly Distributed ± Range. Pump Furnace Down To s 3 microns Then Backfill With Argon And Turn On Fan Twice At Start Of Cycle 1 st Ramp Rate: 20 F./ Min. Max. 1 s" Soak Temp: 1500 ± 20 Deg. F. 1 t Soak Time: Equalize TC's to ± 20 As Cycle Temp Increases Verify That There Is No Pressure In The Pressure Bag 2 "dRamp Rate: 5 F./ Min. Max. 2n Soak Temp: 1700 ±15 Deg. F. 2 nd Soak Time: Hold 150-170 Minutes Once load reaches soak temp pressurize to 100 ± 10 psi for 50-60 minutes, increase to 250 10 psi for next 50-60 minutes, then decrease to 200 10 psi for remaining cycle. Release pressure after end of cycle. 3 rd Ramp Rate: Furnace Cool 3 d Soak Temp: 1000 Deg. F. 3 rd Soak Time: N/A 4' Ramp Rate: N/A 4 th Soak Temp: N/A 4 th Soak Time: N/A GAS FAN COOL USING ARGON ATMOSPHERE TO A MAX. TEMP. OF 300 DEG. F. [0060] After bonding, metallographic samples are taken and evaluated for bond integrity. The part 100 can also be ultrasonically inspected. For example, the bond are 370 can be inspected using a pulse-echo L-wave mode. The bond area is inspected 17 18 with the ultrasonic beam generally normal to the part surface (e.g. about + I degree) and focused at the bond joint. Laboratory testing can be performed directly from samples obtained from excess trim areas of each diffusion bonded part. After ultrasonic inspection, the part is then finished machined, cleaned and manually dressed to meet predetermined visual requirements. Again, the part 100 is by way of example only. It should be appreciated that parts having alternative shapes and sizes can be manufactured via the diffusion bonding process described herein. [0061] As is evident from the foregoing, the diffusion bond die assembly 106 is unique for several reasons. The die can operate at up to about 1720'F. The die material can be cast HH2 which has a slightly higher carbon content than standard cast 309 stainless steel. The mechanical, uniform load that is applied to the bond land at temperature can be produced using a 309 stainless steel pressure bag 340. This allows this type of tool to be run in almost any standard vacuum furnace with only slight modification for plumbing for the pressure bag. The first and second dies 220, 222 can be held together at temperature using pins 320 made of Haynes 230 alloy. This material can be used because it has a slightly lower coefficient of thermal expansion in comparison to HH2 die material. As shown in FIGURE 16, this allows the die to be put together loose and then become tight at a temperature when the load is place on the bond land. [0062] It will be appreciated that several of the above-disclosed and other features and methods, or alternatives thereof, may be desirably combined into many other different systems or applications. Also those variations presently unforeseen or unanticipated alternatives, modifications, variations or improvements therein may be subsequently made by those skilled in the art.

Claims

1. A method of forming a part that includes a first component and a second component and which two components are diffusion bonded together, the method comprising: providing a first component, the first component being configured as a pressure component and includes a first bond land surface; providing a separate second component, the second component being configured as a suction component and includes a second bond land surface; providing a mandrel, the mandrel including a first surface having a contour that mates with at least a portion of the first component and a second surface having a contour that mates with at least a portion of the second component; positioning the first and second components on the mandrel so that the first bond land surface and the second bond land surface are in mating abutment; connecting the first component to the second component at discrete locations along a longitudinal length of the first and second components and at a location that is spaced from the first and second bond land surfaces; positioning the connected first and second components together with the mandrel in a die assembly, the die assembly including a first die, a second die and a plurality of fastening members for releasably securing the first die to the second die, the first and second dies being formed of a first material having a first coefficient of thermal expansion, the fastening members being formed of a second material having a second smaller coefficient of thermal expansion, at least one of said first and second components formed of a material having a different composition from said first and second dies and said fastening members; placing the die assembly in a vacuum furnace for a diffusion bonding cycle; evacuating the furnace of gasses that can contaminate and adversely interfere with a diffusion bond between the first and second components; increasing the temperature of the furnace to a predetermined temperature; applying uniform pressure across an interface between the first and second bond land surfaces of the first and second components, said step of applying uniform pressure including use of a gas-filled container formed of flexible sheet material, the container being positioned between one of the first and second components and one of the first and second dies, wherein pressure within the container is controlled to a predetermined pressure and maintained for a predetermined time period, wherein the container provides 20 a uniform load to the interface of the first and second bond land surfaces of the first and second components during said formation of said diffusion bond between the first and second bond land surfaces; maintaining a vacuum level, temperature and pressure within the furnace for a predetermined period of time to form a diffusion bond between the first and second bond land surfaces; and removing the die assembly including the diffusion bonded first and second components from the furnace; and, removing the die assembly including the diffusion bonded first and second components from the furnace.

2. The method as defined in claim 1, further comprising forming an offset portion on an inner surface of one of the first and second dies and locating at least a portion of the container therein for bond transition.

3. The method as defined in claim 1 or 2, wherein said step of applying uniform pressure includes use of the first material and second material of the respective first and second dies and plurality of fastening members, wherein increase of temperature in the furnace causes the first and second dies to expand at a greater rate than the plurality of fastening members, the plurality of fastening members restricting the expansion of the first and second dies during said formation of said diffusion bond between the first and second bond land surfaces.

4. The method as defined in any one of claims 1-3, further comprising providing at least two fastening members of differing lengths.

5. The method as defined in any one of claims 1-4, further comprising manufacturing the first and second components from titanium alloy plate stock, wherein the at least one of the first and second components has a non-planar conformation, and manufacturing the plurality of fastening members from Haynes 230 alloy and at least one of said first and second die components is formed of a cast stainless steel material having a higher carbon content than standard cast 309 stainless steel.

6. The method as defined in any one of claims 1-5, wherein the temperature of the furnace during the formation of said diffusion bond between the first 21 and second bond land surfaces is no more than about 1720*F (940*C), the temperature being held above about 1550'F (840*C) for up to about 170 minutes, the pressure in the container during the formation of the diffusion bond between the first and second bond land surfaces is increased and then maintained at least 90 psi (620 kPa) for at least about 50 minutes, then increased and then maintained at no more than about 260 psi (1790 kPa) for at least about 50 minutes, and then decreased and maintained at no more than 210 psi (1450 kPa) for the remainder of the diffusion bonding cycle.

7. The method as defined in any one of claims 1-6, further comprising providing at least two tabs on the first component and at least two tabs on the second component, and aligning the at least two tabs of the first and second components on the mandrel, and connecting the at least two tabs of the first component to the at least two tabs of the second component so that first component to the second component are connected at the discrete locations along the longitudinal length of the first and second components and at a location that is spaced from the first and second bond land surfaces.

8. The method as defined in any one of claims 1-7, further comprising coating the mandrel and the first and second dies with a release agent.

9. A method of diffusion bonding comprising: providing a first component including a first bond land surface having a wave like conformation; providing a second component including a second bond land surface having a wave-like conformation; preparing and cleaning the mating first and second bond land surfaces to be diffusion bonded to a predetermined condition such that diffusion bonding across an interface between the surfaces is possible; connecting the first component to the second component at discrete locations along a longitudinal length of the first and second components and at a location that is spaced from the first and second bond land surfaces so that the first and second bond land surfaces are in mating abutment; providing a diffusion bonding die assembly configured to releasably secure the connected components therein, the die assembly including a first die, a second die and a plurality of fastening members for releasably securing the first die to the second die; 22 coating the die assembly and selected portions of the first and second components with a release agent, the coating being absent from the first and second bond land surfaces; placing the first and second components with the first and second bond land surfaces in mating abutment in the die assembly; placing a gas-filled container formed of flexible metal sheet material between said first component and said die assembly, said second component and said die assembly, or combinations thereof, said gas-filled container designed to applying uniform pressure to said first component, said second component, or combinations thereof during the diffusion bonding process; placing the die assembly in a vacuum furnace for a diffusion bonding cycle; evacuating the furnace of gasses that can contaminate and adversely interfere with diffusion bond between the first and second components; increasing the temperature of the furnace to a first temperature; maintaining the first temperature for a predetermined period of time; increasing the temperature of the furnace to a second temperature, said second temperature greater than the first temperature; maintaining the second temperature for a predetermined period of time; applying a first pressure at the second temperature across the interface of the first and second components for a predetermined period of time; increasing the applied pressure to a second pressure, said second pressure greater than the first pressure; applying the second pressure at the second temperature across the interface of the first and second components for a predetermined period of time; decreasing the applied pressure to a third pressure, said third pressure greater than the first pressure; applying the third pressure at the second temperature across the interface of the first and second components for a predetermined period of time; decreasing the temperature of the furnace to a third temperature, the third temperature less than the first temperature; and removing the die assembly including the diffusion bonded first and second components from the furnace.

10. The method as defined in claim 9, the material of the first and second components being different from the material of the first and second dies, said material of 23 said fasteners being different from the first and second dies and the first and second components, the first and second dies formed of a first material having a first coefficient of thermal expansion, the fastening members formed of a second material having a second smaller coefficient of thermal expansion than the expansion coefficient of the first material.

11. The method as defined in claim 9 or 10, wherein the step of applying uniform pressure includes the use of the first and second dies and plurality of fastening members, wherein increase of temperature in the furnace causes the first and second dies to expand at a greater rate than the plurality of fastening members, the plurality of fastening members restricting the expansion of the first and second dies which, in turn, at least partially causes the first and second dies to provide a uniform load to the interface of the first and second components.

12. The method as defined in any one of claims 9-11, wherein the second temperature is 1685'F (920'C) to 1715'F (935'C), the temperature being held for 150 to 170 minutes, the first pressure applied is 90 psi (620 kPa) to 110 psi (760 kPa) for 50 to 60 minutes, the second pressure applied is 240 psi (1655 kPa) to 260 psi (1790 kPa) for 50 to 60 minutes, and the third pressure applied is 190 psi (1310 kPa) to 210 psi (1450 kPa) for the remainder of the diffusion bonding cycle, and the third temperature is at least about 1000 *F (540*C).

13. The method as defined in any one of claims 9-11, wherein the second temperature is 1685*F (920*C) to 171S*F (935*C), the temperature being held for 150 to 170 minutes, the first pressure applied is 90 psi (620 kPa) to 110 psi (760 kPa) for 50 to 60 minutes, the second pressure applied is 190 psi (1310 kPa) to 210 psi (1450 kPa) for 50 to 60 minutes, and the third pressure applied is 140 psi (965 kPa) to 160 psi (1100 kPa) for the remainder of the diffusion bonding cycle , and the third temperature is at least about 1200 *F (650*C).

14. The method as defined in any one of claims 9-13, further comprising ultrasonically inspecting a bond area of the diffusion bonded first and second components. 24

15. A diffusion bonding die assembly for diffusion bonding a first component having a nonplanar first bond land surface to a second component having a nonplanar second bond land surface, the diffusion bonding die assembly comprising: a mandrel configured to releasably hold the first and second components, the first bond land surface and the second bond land surface being in mating abutment on the mandrel; an upper die including an upper surface and a lower surface, the lower surface including a first portion configured to engage the mandrel and a second portion configured to mate with one of the first and second components; a lower die including an upper surface and a lower surface, the upper surface including a first portion configured to engage the mandrel and a second portion configured to mate with one of the first and second components; a flexible pressure container designed to be at least partially disposed between one of the upper and lower dies and one of the first and second bond land surfaces of the first and second components; and a plurality of fastening members for securing the upper die to the lower die, the plurality of fasteners being configured to limit expansion of the upper and lower dies during a diffusion bonding cycle, the upper and lower dies formed of a first material having a first coefficient of thermal expansion, the fastening members formed of a second material having a second coefficient of thermal expansion that is less than the first coefficient of thermal expansion.

16. The diffusion bonding die assembly as defined in claim 15, wherein the upper die includes a plurality of first cutouts and the lower die includes a plurality of corresponding second cutouts, the first and second cutouts being dimensioned to receive at least a portion of the fastening members.

17. The diffusion bonding die assembly as defined in claim 15 or 16, wherein the mandrel includes a plurality of cutouts for receiving at least a portion of the fastening members.

18. The diffusion bonding die assembly as defined in any one of claims 15 17, wherein each fastening member has a predetermined length, the length of the fastening member being dependent on its mounting location on the upper and lower dies, a plurality of the fasteners having a different length. 25

19. The diffusion bonding die assembly as defined in any one of claims 15 18, wherein the lower surface of the upper die includes an offset portion, at least a portion of the pressure container being disposed in the offset portion for bond transition.

20. The diffusion bonding die assembly as defined in any one of claims 15 19, wherein the mandrel including a base and an arm extending from the base, the arm including a first surface and an opposite second surface, at least a portion of the first component being releasably secured to the first surface, at least a portion of the second component being releasably secured to the second surface, the arm of the mandrel includes an arcuate end portion, the arcuate end portion engaging a portion of the first component for releasably holding the first component to the mandrel.

21. A part formed by diffusion bonding, the part comprising a first component including a first bond land surface, a second surface offset from the first bond land surface via a connecting, arcuate wall, and a third surface opposite the first and second surfaces; a second component including a first surface and a second surface, a section of the second surface forming a second bond land surface which is bonded to the first bond land surface of the first component; the first bond land surface and the second bond land surface have a ribbon-like conformation; the first and second bond land surfaces diffusion bonded together; the first component including a first section and a second section, the first component generally curving along two opposed diameters from the first section to the second section; the second component including a first section and a second section, the second component generally curving along two opposed diameters from the first section to the second section.

22. The part as defined in claim 21, wherein the first and third surfaces together define the first section of the first component and the second and third surfaces together define the second section of the first component, the first section increasing in thickness as it transitions into the second section, the second section decreasing in thickness as it extends from the first section.

23. The part as defined in claim 21 or 22, wherein the first section of the second component has a constant thickness and the second section of the second component has a decreasing thickness. 26

24. The part as defined in any one of claims 21-23, further comprising a ramp, the ramp connecting the wall and the first surface, an end portion of the ramp being offset from the first surface. Dated 10 October, 2011 Barnes Group Inc. Patent Attorneys for the Applicant/Nominated Person SPRUSON & FERGUSON