AU2007214307A1 - An LED Packaging Process and Apparatus - Google Patents
An LED Packaging Process and Apparatus Download PDFInfo
- Publication number
- AU2007214307A1 AU2007214307A1 AU2007214307A AU2007214307A AU2007214307A1 AU 2007214307 A1 AU2007214307 A1 AU 2007214307A1 AU 2007214307 A AU2007214307 A AU 2007214307A AU 2007214307 A AU2007214307 A AU 2007214307A AU 2007214307 A1 AU2007214307 A1 AU 2007214307A1
- Authority
- AU
- Australia
- Prior art keywords
- liquid encapsulant
- particles
- encapsulant
- wavelength
- dispensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Landscapes
- Led Device Packages (AREA)
Description
r Regulation 3.2
AUSTRALIA
Patents Act 1990 COMPLETE SPECIFICATION FOR A STANDARD PATENT
(ORIGINAL)
Name of Applicant: Lednium Technology Pty Limited A.C.N. 002 057 383 Actual Inventors: Address for Service: Invention Title: Suite 1804, Tower A. Zenith Centre 821 Pacific Highway, Chatswood, New South Wales 2067, Australia John Albert Montagnat Balu Jaganathan DAVIES COLLISON CAVE, Patent Attorneys, 1 Nicholson Street, Melbourne 3000, Victoria, Australia An LED Packaging Process and Apparatus The following statement is a full description of this invention, including the best method of performing it known to us: QAOPER\RAB00297458 cor doc 3018/07 P OPER\RA9\kdn-, led picli poc5 spa dm.27A)K/2(X,7 -1- AN LED PACKAGING PROCESS AND APPARATUS
FIELD
The present invention relates to an LED packaging process and apparatus.
BACKGROUND
Light emitting diodes (LEDs) are increasingly being used to replace traditional light sources such as incandescent bulbs and fluorescent light tubes. LEDs are produced in a variety of sizes, with characteristic physical dimensions ranging from less than 250 .m up to 1 mm or more. The larger LEDs in particular are capable of producing intense levels of illumination, making them suitable for general lighting applications, and they can produce such light more efficiently than fluorescent lamps.
Because an individual LED produces monochromatic light, there initially existed the problem of how to produce polychromatic light from these monochromatic sources and in particular how to produce white light. This problem has been largely overcome by directing monochromatic light of a first wavelength emitted from an LED through an encapsulant or layer containing an optically active substance that changes the wavelength of a portion of the monochromatic light passing through the encapsulant or layer to a second wavelength longer than the first wavelength. This wavelength-converted light and the unaffected portion of the light of the first wavelength combine to form polychromatic light that appears to a human observer to be a colour intermediate to the colours represented by the first and second wavelengths. In particular, blue light emitted by an LED can be converted to yellow light by any one of a number of commercially available inorganic photoluminescent materials ('phosphors'), and the blue and yellow light combine to produce polychromatic light that appears to be white to a human observer.
By appropriate selection of the first wavelength of light emitted by the LED and the second wavelength produced by the phosphor, and also by selecting the relative proportions of light of each wavelength emitted from the LED package, it is possible to generate light P 'OPERXRABcdno,= ld pacLaging preee spm doc.27AAw2W7 -2with any desired hue within the full white region of CIE1931 colour space. Furthermore, it is also possible to include more than one type of phosphor in the encapsulant or layer in order to produce polychromatic light by combining more than two different wavelengths.
However, a particular difficulty that exists with this technology is that in practice the proportions of light of each wavelength are found to be difficult to control accurately and to vary significantly between packaged devices. Accordingly, when producing white LEDbased light sources or lamps, the hue of light produced by such light sources can be substantially different from that desired and can also vary substantially from device to device. This lack of predictability, reproducibility, and uniformity is of course commercially undesirable. It is desired, therefore, to provide an LED packaging process and an LED packaging apparatus that alleviate the above difficulties, or at least provide a useful alternative.
SUMMARY
In accordance with the present invention, there is provided an LED packaging process, including dispensing a liquid encapsulant over a semiconductor die containing at least one light emitting diode, the liquid encapsulant containing particles of a wavelength-converting substance to convert a portion of light of a first wavelength emitted from said at least one light emitting diode to a second wavelength longer than said first wavelength, wherein the liquid encapsulant is dispensed from a dispensing apparatus having mixing means to mix said particles and said liquid encapsulant within said dispensing apparatus so that the dispensed liquid encapsulant contains a substantially constant relative amount of said particles over time, and so that said particles are distributed substantially homogeneously throughout the dispensed liquid encapsulant.
The present invention also provides a packaged LED product produced by the process.
The present invention also provides an LED packaging apparatus, including liquid encapsulant dispensing means for dispensing a liquid encapsulant over a semiconductor die P \OPER\RABUedm-i led packagln proes spc do-27AfX/2.x 7 -3containing at least one light emitting diode, the liquid encapsulant containing particles of a wavelength-converting substance to convert a portion of light of a first wavelength emitted from said at least one light emitting diode to a second wavelength longer than said first wavelength, wherein the dispensing apparatus includes mixing means to mix said particles and said liquid encapsulant within said dispensing apparatus so that the dispensed liquid encapsulant contains a substantially constant suspension of said particles over time, and so that said particles are distributed substantially homogeneously throughout the dispensed liquid encapsulant.
Preferably, said mixing means includes a cylindrical container for said liquid encapsulant and said particles, a threaded screw disposed within said cylindrical container, and means for rotating said threaded screw to circulate and thereby mix said liquid encapsulant and said particles.
Advantageously, said mixing means may include: one or more first components located at an external surface of the cylindrical wall of said container, and one or more second components located at an internal surface of said cylindrical wall, said first components being magnetically coupled through said wall to said second components; and means for moving said first components to cause said second components to move within said container and thereby mix said liquid encapsulant and said particles.
BRIEF DESCRIPTION OF THE DRAWINGS Preferred embodiments of the present invention are hereinafter described, by way of example only, with reference to the accompanying drawings, wherein: Figures 1 and 2 are schematic plan and cross-sectional side views, respectively, of a packaged light source in accordance with a preferred embodiment of the present invention; Figure 3 is another cross-sectional side view of the packaged light source of Figures 1 and 2, illustrating how an encapsulant can be formed in two portions; P k leRAB~dn- led pakgng p-s spm dc.-27fl)82X)7 -4- Figure 4 is a schematic cross-sectional side view of a preferred embodiment of a liquid encapsulant dispensing apparatus; and Figure 5 is a schematic cross-sectional side view of a threaded screw of the dispensing apparatus of Figure 4.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Figures 1 and 2 are plan and cross-sectional side views, respectively, of a packaged LEDbased light source assembly or lamp. The lamp is similar to that described in International Patent Application No. PCT/AU2004/000283 ("the PCT application"), and is manufactured by a process similar to that described in that application. Briefly, the lamp includes an electrically and thermally conducting receptacle in the form of a shallow bowl, preferably formed by stamping copper sheet. A standard semiconductor die 104 incorporating at least one LED is mounted centrally on the upper inner surface of the receptacle 102, preferably using an electrically and thermally conductive adhesive such as silver paste. The LED die 104 includes first and second electrical terminals of opposing electrical polarities for supplying electrical power to the LED or LEDs in the die 104. In some LED dies, the rear surface of the die itself provides the first electrical terminal, and in that case the receptacle 102 is electrically connected to the first terminal by virtue of the conducting adhesive between the receptacle 102 and the base of the die 104. Otherwise, the receptacle 102 is electrically connected to the first terminal by a gold wire 105, as shown, using standard gold wire bonding.
A thin annular isolator 106 provides electrical insulation between the receptacle 102 and an upper metal contact 108, which is electrically connected to the second terminal of the die 104 by gold wire 109. Thus the receptacle 102 and the upper contact 108 themselves conveniently constitute respective electrical connections to power the LEDs in the die 104.
Finally, an encapsulant 110 fills the recess defined by the receptacle 102, the insulator 106 and the upper contact 108, and also extends beyond the recess and partly over the upper surface of the upper contact 108. As described above, the encapsulant 110 is formed from I 1 P NOPRURAB~kdn-, led paaagsnS prmm U= dom.278/2rE7 an initially liquid optically clear encapsulation material containing phosphor particles that convert a portion of the blue light emitted by the LED chip 104 to a yellow colour, so that the combined blue and yellow light emitted from the upper surface of the encapsulant 110 together form polychromatic light that appears to be white to a human observer. Further details of the manufacturing process can be found in the PCT application.
The inventors have determined that the reason for the poor predictability, uniformity, and reproducibility of the precise hue of light emitted from LED and phosphor-based polychromatic light sources such as that shown in Figures 1 and 2 is a lack of homogeneity in the encapsulant and phosphor particle mixture. The encapsulating substance is initially in the liquid state, thereby enabling the phosphor particles to be introduced into suspension within it, and allowing the resulting suspension to be introduced into and to fill the recess defined by the receptacle 102, insulator 206, and upper ring contact 108, completely covering the upper and side surfaces of the LED die 104.
The encapsulating substance can be an epoxy or a silicone, which are fairly viscous but are significantly less dense than the phosphor particles. For example, a typical phosphor has a specific gravity in excess of 5.00, whereas the specific gravity of a typical epoxy is only about 1.50. In existing packaging methods, the phosphor particles (in the form of a powder) and the epoxy or silicone are mixed together, and the resulting suspension is then transferred into an essentially static dispensing apparatus, typically in the form of a syringe. However, the inventors have determined that as soon as the mixing is terminated, the substantial difference in density between the phosphor particles and the liquid encapsulant causes the phosphor particles to immediately begin settling out of the suspension under the influence of gravity, notwithstanding the opposing tendency of the viscous encapsulant liquid to maintain the particles in suspension.
Although it is possible to increase the viscosity of the liquid encapsulant to counteract this tendency, there is a practical limit to the maximum viscosity of the encapsulant which can be used in a practical packaging operation which still allows the encapsulation mixture to P lOPER\R A Mod- 10d pacLaggn s peores sp dcc-21/Pe22)7 -6be effectively applied. In any case, the inventors have determined that even at the maximum practical level of viscosity, larger phosphor particles particles in excess of still settle out of the suspension during manufacture of light sources to a degree that degrades the predictability, uniformity, and reproducibility of the hue of light generated by those light sources. The phosphor particles used in the lighting device described herein have a grain size greater than 20 tm and a median grain diameter d 50 greater than 5 Pm.
Moreover, when more than one type of phosphor is suspended in the encapsulant, the two particle types have different chemical compositions and consequently will typically have different densities. Hence the rates at which the respective particle types settle out of the suspension can differ significantly. Once the suspension of phosphor particles becomes inhomogeneous, the hue of light emitted by the lamp can change substantially and the homogeneity of that hue with emission angle degraded substantially.
It will be apparent from the discussion above that it is important to provide a homogeneous and controlled mixture of phosphor and encapsulant in each LED package in order to produce LED lamps that generate light having well defined and reproducible colour coordinates, correlated colour temperature and colour rendering index. Yet this can be particularly difficult when many LED lamps are manufactured in a continuous manufacturing process due to the time-dependent nature of the settling out of phosphor particles from suspension.
Figure 3 is a schematic diagram of the light source described above, in which the encapsulant 110 is shown in two portions (differentiated in Figure 3 by removing the shading from one of the two portions), namely a lower component 302 which is the portion of the encapsulant 110 that lies below the upper surface of the top ring contact 108, and an upper component 304, which is the remaining portion of the encapsulant 110 that projects above the upper surface of the top ring contact 108 and extends partially over that surface.
r P %OPER\RAB cdn,-, kd prksging prcss spc dx.27ft)W/.)7 -7- The encapsulant can be formed by one of three different processes. In the first and most preferred process, the entire encapsulant 110 is formed at one time as a single entity, as follows. A casting mould (not shown) is placed over the recess and clamped onto the upper surface of the top ring contact 108 to form a seal. The internal cavity of the mould has the same shape as the upper portion 304 of the encapsulant 110. A liquid encapsulant consisting of a water clear epoxy resin and a homogeneous suspension of phosphor particles is dispensed through an opening in the top of the casting mould to fill the recess and the mould cavity, thus forming the complete volume and shape of the final encapsulant 110. The epoxy is then cured until it has polymerised, completing the formation of the final encapsulant 110.
The polymerisation is preferably conducted in a series of heating steps, beginning with a moderate heating step of about 15 minutes duration at a temperature around 90 0 C to rapidly initiate sufficient polymerisation to maintain the homogeneous distribution of phosphor particles throughout the encapsulant 110. This initial curing period is followed by a longer exposure to a higher temperature, preferably at approximately 120 0 C for a period of approximately one hour. During this step, the majority of the epoxy polymer becomes cross linked. The polymerisation is then completed by heating the epoxy to approximately 150 0 C for an even longer period of approximately 2 hours, during which time the epoxy is completely polymerised into a stable state. The polymerised encapsulant 110 is then cooled and the casting mould removed to complete the process.
In a second preferred process, a liquid encapsulant without phosphor particles is dispensed into the open volume corresponding to the lower encapsulant portion 302 only up to the upper surface of the upper ring contact 108). The liquid encapsulant is preferably a water clear optical silicone gel that is then cured until it forms a semisolid gel phase.
Next, the upper portion 304 of the encapsulant 110 which, unlike the lower portion 302, does contain phosphor particles, is formed over the lower portion 302. The upper portion 304 is not physically constrained but sits proud of the upper ring contact 108, and is P OPER\RAB\ dn-, kd packaging pc dospec .2Tnf(X7 -8preferably formed by clamping the casting mould onto the upper surface of the top ring contact 108, as described above, and dispensing liquid epoxy encapsulant which contains a homogeneous suspension of phosphor particles into the casting mould to define the upper portion 304. Alternatively, the upper portion 304 can be formed in place by transfer moulding or injection moulding, or can even be formed independently and subsequently attached by an adhesive applied to the upper surface of the top ring contact 108. In each of the alternate steps above, the material of the upper portion 304 of the encapsulant 110 contains a homogeneous suspension of phosphor particles and is cured to a solid consistency by heat treatment.
In the third alternative process, the lower silicone portion 302 is formed as described above and then, a thin film of a binder, preferably silane, is applied to the exposed upper surface of the lower silicone portion 302 and is subsequently cured by heat treatment. The upper encapsulant portion 304 is then formed by one of the processes described above from an encapsulant which contains a homogeneous suspension of phosphor particles. The use of a binder such as silane between the two encapsulant portions 302, 304 is preferred because it enhances the adhesion of the upper portion 304 of the encapsulation 110 to the lower portion 302 of the encapsulation 110. Thus whereas the second preferred process described above provides adhesion between the upper portion 304 of the encapsulation 110 and the upper surface of the top ring contact 108, there is a relatively small area on which to apply an adhesive, whereas this preferred process provides an area for adhesion which includes that provided by the second process and also the entire upper surface of the lower portion 302 of the encapsulation.
Irrespective of which of the above processes is used to form the encapsulant 110, the homogeneity of the dispensed liquid encapsulant containing phosphor particles in suspension is assured by dispensing the liquid encapsulant from a dispensing apparatus that continuously mixes the liquid encapsulant contained within it.
P OPER\RABUcdn- lod pclging proc-ss SpMc d -217AMW/2x)7 -9- As shown in Figure 4, the dispensing apparatus includes a threaded shaft or screw 402 disposed within a cylindrical dispensing tube 404. A small opening 406 at one end of the dispensing tube 404 allows liquid encapsulant contained within the dispensing tube 404 to be dispensed to a desired location. The other end of the dispensing tube 404 is attached to a housing 408 containing a motor shaft 410 that is coupled to the screw 402 via a shaft extension 412 that passes through a mounting flange 414 and a cylinder cap 416. O-ring seals in the cylinder cap 416 form a seal with the shaft extension 412. The motor shaft 410 axially rotates the screw 402 within the dispensing tube 404 at a selectable angular velocity. As shown in Figure 4, the screw 402 diameter is substantially smaller than the inner diameter of the dispensing tube 404 to allow the encapsulant to circulate within the dispensing tube 404 when the screw 402 is rotated.
As shown more clearly in Figure 5, the thread of the screw 402 has a large pitch and a deep cut thread so that the rotation of the screw 402 efficiently draws the liquid encapsulant in an axial direction away from the opening 406. For example, the screw pitch is preferably about 2/3 of the outside diameter of the screw and the cut thread is preferably about half of the screw pitch. In use, the screw 402 is preferably arranged in a substantially vertical orientation so that the liquid encapsulant is drawn upwards by the screw thread and falls, at least partly under the influence of gravity, from a higher to a lower position within the cylinder and along the gap between the screw 402 and the inner wall of the dispensing tube 404. Continuous rotation of the screw 402 ensures that the mixture of liquid encapsulant and phosphor particles remains homogeneous, regardless of the level of the liquid encapsulant within the dispensing tube 404 or the period of time that the mixture has remained within the dispensing apparatus before being dispensed.
In an alternative embodiment (not shown), the screw 402 is omitted and the shaft extension 412 terminates at a planar stirrer and the dispensing tube is fitted with steel balls or other magnetic components that are free to move within the dispensing tube. In this embodiment, the dispensing tube is manufactured from non-magnetic materials. Magnets located at the outside of the dispensing tube are moved axially in a reciprocating manner along the P \OPER\RABdn-, led pk.de&ng p-e pe do.-27/PIR 7 exterior of the dispensing tube so that the magnetic components within the dispensing tube move in sympathy with the external magnets along the inner wall of the dispensing tube, thereby mixing the liquid encapsulant and phosphor particles contained within the dispensing tube. Continuous reciprocal movement of the magnets ensures that the contents of the cylinder are mixed in a truly homogeneous distribution.
As described above, the dispensing tube 404 has a small opening 406 at one end from which the liquid encapsulant and phosphor mixture is dispensed. The dispensing is controlled by controlling the pressure within the dispensing tube 404. Normally, a small partial vacuum is maintained within the dispensing tube 404 to prevent any of the viscous encapsulant from escaping from the opening 406 under the influence of gravity. In order to dispense the encapsulant, a positive pressure is applied to the dispensing tube 404 to drive encapsulant out through the opening 406. By accurately controlling the pressure within the dispensing tube 404, precise amounts of a homogeneous mixture of liquid encapsulant and phosphor particles can be controllably and repeatedly dispensed as desired. In practice, this is achieved by correlating the measured flow of the liquid encapsulant with the absolute value of the pneumatic pressure and with changes of pressure.
When LED-based light sources such as those described above are packaged using encapsulants 110 formed by any one of the processes described herein, the colour of light emitted from the packaged devices is found to be accurately controllable, uniform from device to device, and reproducible. Many such devices can be formed on a production line and the hue of light produced by the first and last devices from any and all batches of encapsulant appear identical to human observers.
Many modifications will be apparent to those skilled in the art without departing from the scope of the present invention as hereinbefore described with reference to the accompanying drawings.
Claims (4)
1. An LED packaging process, including dispensing a liquid encapsulant over a semiconductor die containing at least one light emitting diode, the liquid encapsulant containing particles of a wavelength-converting substance to convert a portion of light of a first wavelength emitted from said at least one light emitting diode to a second wavelength longer than said first wavelength, wherein the liquid encapsulant is dispensed from a dispensing apparatus having mixing means to mix said particles and said liquid encapsulant within said dispensing apparatus so that the dispensed liquid encapsulant contains a substantially constant relative amount of said particles over time, and so that said particles are distributed substantially homogeneously throughout the dispensed liquid encapsulant.
2. An LED packaging apparatus, including liquid encapsulant dispensing means for dispensing a liquid encapsulant over a semiconductor die containing at least one light emitting diode, the liquid encapsulant containing particles of a wavelength- converting substance to convert a portion of light of a first wavelength emitted from said at least one light emitting diode to a second wavelength longer than said first wavelength, wherein the dispensing apparatus includes mixing means to mix said particles and said liquid encapsulant within said dispensing apparatus so that the dispensed liquid encapsulant contains a substantially constant suspension of said particles over time, and so that said particles are distributed substantially homogeneously throughout the dispensed liquid encapsulant.
3. An LED packaging apparatus as claimed in claim 2, wherein said mixing means includes a cylindrical container for said liquid encapsulant and said particles, a threaded screw disposed within said cylindrical container, and means for rotating said threaded screw to circulate and thereby mix said liquid encapsulant and said particles. P \OPER\RAB\ledniu led packaging proc spct doc-27/m/2007
12- 4. An LED packaging apparatus as claimed in claim 2 or 3, wherein said mixing means includes: one or more first components located at an external surface of the cylindrical wall of said container, and one or more second components located at an internal surface of said cylindrical wall, said first components being magnetically coupled through said wall to said second components; and means for moving said first components to cause said second components to move within said container and thereby mix said liquid encapsulant and said particles. A packaged LED, substantially as described herein with reference to the accompanying drawings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2007214307A AU2007214307A1 (en) | 2007-08-30 | 2007-08-30 | An LED Packaging Process and Apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2007214307A AU2007214307A1 (en) | 2007-08-30 | 2007-08-30 | An LED Packaging Process and Apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2007214307A1 true AU2007214307A1 (en) | 2007-10-11 |
Family
ID=38596506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2007214307A Abandoned AU2007214307A1 (en) | 2007-08-30 | 2007-08-30 | An LED Packaging Process and Apparatus |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU2007214307A1 (en) |
-
2007
- 2007-08-30 AU AU2007214307A patent/AU2007214307A1/en not_active Abandoned
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK1 | Application lapsed section 142(2)(a) - no request for examination in relevant period |