AU2003302847A1 - Chip-on-film and its methods of manufacturing by electro-forming - Google Patents

Chip-on-film and its methods of manufacturing by electro-forming

Info

Publication number
AU2003302847A1
AU2003302847A1 AU2003302847A AU2003302847A AU2003302847A1 AU 2003302847 A1 AU2003302847 A1 AU 2003302847A1 AU 2003302847 A AU2003302847 A AU 2003302847A AU 2003302847 A AU2003302847 A AU 2003302847A AU 2003302847 A1 AU2003302847 A1 AU 2003302847A1
Authority
AU
Australia
Prior art keywords
electro
chip
film
manufacturing
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003302847A
Inventor
Jeong-Sik Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GRAPHION TECHNOLOGIES USA LLC
Original Assignee
GRAPHION TECHNOLOGIES USA LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020020080087A external-priority patent/KR20040051464A/en
Priority claimed from KR1020020084669A external-priority patent/KR20040055536A/en
Application filed by GRAPHION TECHNOLOGIES USA LLC filed Critical GRAPHION TECHNOLOGIES USA LLC
Publication of AU2003302847A1 publication Critical patent/AU2003302847A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
AU2003302847A 2002-12-12 2003-12-12 Chip-on-film and its methods of manufacturing by electro-forming Abandoned AU2003302847A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR1020020080087A KR20040051464A (en) 2002-12-12 2002-12-12 Chip on film by electroplating and its manufacturing method.
KR10-2002-0080087 2002-12-12
KR10-2002-0084669 2002-12-20
KR1020020084669A KR20040055536A (en) 2002-12-20 2002-12-20 Chip on film by electroplating and its manufacturing method.
PCT/KR2003/002726 WO2004053975A1 (en) 2002-12-12 2003-12-12 Chip-on-film and its methods of manufacturing by electro-forming

Publications (1)

Publication Number Publication Date
AU2003302847A1 true AU2003302847A1 (en) 2004-06-30

Family

ID=32510713

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003302847A Abandoned AU2003302847A1 (en) 2002-12-12 2003-12-12 Chip-on-film and its methods of manufacturing by electro-forming

Country Status (2)

Country Link
AU (1) AU2003302847A1 (en)
WO (1) WO2004053975A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108682665B (en) * 2018-05-16 2019-06-18 清华大学 The manufacturing method of stretchable flexible electronic device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722191B2 (en) * 1985-04-10 1995-03-08 九州日立マクセル株式会社 Method for manufacturing lead frame of semiconductor device
JPH069216B2 (en) * 1985-09-09 1994-02-02 九州日立マクセル株式会社 Lead carrier film
KR0144918B1 (en) * 1995-02-23 1998-07-01 이대원 Manufacturing method of lead frame
JPH11140667A (en) * 1997-11-13 1999-05-25 Dainippon Printing Co Ltd Base material for etching, etching method and etched product
KR20020062540A (en) * 2001-01-22 2002-07-26 김태환 method of manuacturing master

Also Published As

Publication number Publication date
WO2004053975A1 (en) 2004-06-24

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase