KR20040055536A - Chip on film by electroplating and its manufacturing method. - Google Patents

Abstract

PURPOSE: A chip-on-film by an electric forming process is provided to fabricate a more elaborate product by a simpler process by forming a product in an electric forming bath. CONSTITUTION: The chip-on-film is coupled to a base part where a pattern is thin. An etch part or a processing part is formed in an electrode base. An electric forming process material is formed in the electric forming master by an electric forming process such that the electric forming master is characterized in that the etch part or the processing part is filled with a release agent. A thin base part is formed on the electric forming process material.

Description

Chip-on-film by Jeonju processing and its manufacturing method. {Omitted}

The present invention relates to a chip-on-film and a method of manufacturing the same, which are generally configured in various forms such as micro-current circuits, PCB boards, and lead frames that are commonly used in semiconductors and other electronic devices. The present invention is very readily applicable to chip-on films and other forms of similar products, which will also fall within the scope of the present invention. The present invention has been used in an extremely wide range of fields, and particularly has an excellent effect in producing a chip-on film having an extremely fine shape. Conventionally, these have been generally produced by etching techniques, but in the present invention, they can be produced more precise articles with higher productivity by electroplating. The present invention in the production of these, using the Jeonju master to produce the Jeonju processing products, by immersing the Jeonju master in the Jeonju bath to form various types of Jeonju processing products through electrolysis to combine them with a thin base Configure the product of the invention.

In the conventional etching method, due to the corrosion of the metal, there is a complication in the manufacturing process that must be produced by etching each unit workpiece, and the processing by the etching method inevitably corrodes the material as much as the amount of corrosion. There is no choice but to discard it. The present invention is capable of forming a more precise pattern than the etching method by adopting the processing by the electric pole processing method, and because only the required material is constituted in the electric pole master, there is no need to waste material at all. . The product according to the present invention also enables the production of the product by a simpler process than the conventional technique by forming the product through the pole immediately in the electric bath, without undergoing the exposure and etching process for each product in the production process. In other words, not only the economic effect that can further reduce the production cost, but also the error can be reduced by simplifying the manufacturing process.

1 is an explanatory diagram of a pattern on which a pattern pattern is formed.

2 shows a state diagram of a state in which a pattern pattern is joined to the base.

3 is a state diagram in which a photosensitive material is applied to an electrode base base material.

4 is an explanatory diagram for explaining the formation of the exposed portion 9 by exposing a photosensitive agent using a pattern film.

5 is an explanatory diagram for explaining a state in which the etching unit 10 is formed by etching the electrode base base material on which the exposure unit is formed.

FIG. 6 is a state diagram showing the filling of the release material 12 into the etching portion of FIG.

7 is an explanatory diagram showing that the etching space portion is filled with a foam release agent.

8 is an explanatory diagram for explaining a state in which the electric pole is immersed in the electric bath tub of the electric pole master of the present invention.

FIG. 9 is an explanatory diagram for explaining a method of fabricating a chip-on film by bonding a thin base to a workpiece formed on a pole pole.

10 is a state diagram showing demolding of the electroformed workpiece on which the base is formed from the electroplating master.

11 is another embodiment of the present invention.

12 is a state diagram in which a release member is filled in the triangular pin portion of FIG.

FIG. 13 is an explanatory diagram for explaining a state in which the electric pole is immersed by immersing the electric pole master of FIG.

FIG. 14 is an explanatory diagram of a fabrication method of fabricating a chip-on film by bonding a thin base to an electroformed workpiece formed on a Jeonju master.

FIG. 15 is a state diagram of the chip-on film of FIG. 14 demolded from a pole master.

16 and 11 illustrate embodiments of various shapes of an electrode base.

* Description of the symbols for the main parts of the drawings *

DESCRIPTION OF SYMBOLS 1: Pattern 2: Pattern glyph 3: Base part 4: Inversion pattern 7: Photosensitive material 8: Electrode base member 10: Etching part 12: Release material 13: Foaming | molding agent 14: Electroplated workpiece

In the present invention, in a chip-on film bonded to a thin base portion, an etching part or a processing part is formed in an electrode base, and a release material is filled into the etching part or processing part. The chip-on film and its manufacturing method characterized by forming a base pole through, and forming a thin base on the surface of the pole pole. As the release material in the present invention, a foamable release material may be used, and silicone or foamable silicon may be used as an example of such a release material, and stainless steel may be used as an example of the electrode base. Hereinafter, the present invention will be described in detail with reference to the drawings.

1 is an explanatory diagram of a pattern on which a pattern pattern is formed. In general, in the present invention, the shape of the minute shape that is used in various fields in the form of a minute conduction circuit, a PCB substrate, a lead frame, and the like, which is commonly used in semiconductors and other electronic devices, is defined as a word as a pattern. Patterns of various types of patterns that are generally present is mainly composed of a conductive material as shown in Figure 1 (A). The pattern is composed of various patterns of patterns 2 and a base 3 supporting the pattern patterns around the pattern patterns. The pattern film is usually configured in the shape of a transparent portion and an opaque portion. The concept of the pattern in the present invention is defined to be referred to as a pattern of everything that is composed of a particular shape or pattern. In general, patterns consist of extremely fine dimensions. As an example, the distance of the pattern's spacing in the pattern is a precise shape of only a few microns or tens of microns. In addition, the present invention defines the term inversion pattern. The inversion pattern defines a pattern in which the transparent and opaque portions of the above pattern are replaced as the inversion pattern. The inversion pattern of FIG. 1A is comprised in the same shape as FIG. 1B.

2 shows a state diagram of a state in which a pattern pattern is joined to the base. Usually, the pattern pattern 6 is configured as a conductive material. The most common conductive material is copper. In order to support the conductive material, a base 5 having a shape of a thin film is usually formed. Of course, the present invention is mainly described in the form of a thin film, but the film portion may have a considerable thickness to be a plate-like support. This plate-shaped base also belongs to the scope of the present invention, of course.

3 is a state diagram in which a photosensitive material is applied to an electrode base base material. A wide plate-like base material for forming the electrode base of the present invention is called an electrode base base material 8, and the electrode base base material can mainly use stainless steel as an example. Stainless steel is not only strong in strength, but also easy to demould with the pole pole during pole pole processing.

4 is an explanatory diagram for explaining the formation of the exposed portion 9 by exposing a photosensitive agent using a pattern film.

5 is an explanatory diagram for explaining a state where the etching space portion 10 is formed by etching the electrode base base material on which the exposure portion is formed. The electrode base base material having the etching space 10 formed through the above process is defined as an electrode base in the present invention.

6 is a state diagram showing that the releasing material 12 is filled in the etching space of FIG. A release material is filled in the etching space portion above the electrode base portion. At this time, the electrode base portion exposed in addition to the etching space portion of the electrode base portion is referred to as a pin portion electrode base. When the electroplating process is performed, the electroplating material starts to be produced in the electrode part base.

7 is an explanatory diagram showing that the etching space portion is filled with a foam release agent. The foamable release material is defined as a release material in which the release material is expanded and expanded by the physical environment change such as temperature change after the release material is filled, and the expanded release material is solidified. After filling the foaming release material 13 in the etching space, the release material is foamed by applying a change in physical conditions, the release material has a smooth arc-like surface, the release material in the arc arc the transverse workpiece in the electroplating process It inhibits growth and induces vertical growth. Examples of the most representative blowing agent release material in the present invention include silicone mixed with a blowing agent.

8 is an explanatory diagram for explaining a state in which the electric pole is immersed in the electric bath tub of the electric pole master of the present invention. When the cathode is connected to the electrode base and the electroplating is started in the electric bath, the molten metal begins to be combined and the electroplated material 14 is formed. In the electrolytic molten metal, a conductive metal such as nickel or copper starts to form. This is commonly used.

FIG. 9 is an explanatory diagram for explaining a method of fabricating a chip-on film by bonding a thin base to a workpiece formed on a pole pole. After the liquid thermoplastic resin is applied thinly and uniformly to the surface of the electroformed workpiece and the release material, the thermoplastic resin is dried and hardened. Of course, the thin adhesive film can be coated in place of the thermoplastic resin. In the present invention, the release material and the adhesive film or the release material and the thermoplastic resin can be easily separated without mutual coupling.

10 is a state diagram showing demolding of the electroformed workpiece on which the base is formed from the electroplating master. Jeonju processing material integrated in the thermoplastic resin is very easily demoulded from Jeonju Master. As an embodiment of the present invention, when the thermoplastic resin is an epoxy resin, the electroforming material is copper, and the release material is silicon, the epoxy resin is not bonded to silicon, but is bonded to copper. When the thermoplastic resin is dried and solidified in the liquid phase, it supports the workpiece with solid bonding force.

11 is another embodiment of the present invention. It is processed to have a cross section of the triangular protrusion on the electrode base, and the chip-on film is configured by a method of forming a jeonju master by filling a release material in the processing portion. 11 illustrates that a triangular pin portion 18 having an upper portion of the electrode base 19 having a triangular cross section is formed.

12 is a state diagram in which a release member is filled in the triangular pin portion of FIG. The release master 20 is filled in the space portion of the fin section of the triangular cross section formed on the electrode base 19 to form an electric pole master.

FIG. 13 is an explanatory diagram for explaining a state in which the electric pole is immersed by immersing the electric pole master of FIG. When the cathode is connected to the electrode base and the electroplating is started in the electroplating bath, the molten metal begins to be combined to start the electroplating work 21 to be formed.

FIG. 14 is an explanatory diagram illustrating a method of fabricating a chip-on film by bonding a thin base to a workpiece formed on a pole pole. After the liquid thermoplastic resin is applied thinly and uniformly to the surface of the electroformed workpiece and the release material, the thermoplastic resin is dried and hardened. Of course, the base 23 may be coated with a thin adhesive film in place of the thermoplastic resin.

FIG. 15 is a state diagram of the chip-on film of FIG. 14 demolded from a pole master. When the base 23 is formed of the thermoplastic resin, both the left and right surfaces of the electroformed workpiece 24 are surrounded by the base, thereby inducing more firm coupling.

16 and 11 illustrate embodiments of various shapes of an electrode base. It is possible to configure the cross-sectional shape in any shape, but in particular, when the triangular pin portion 25 having the flat portion is formed, the area of the surface of the electroformed workpiece can be obtained by the width of the flat portion. In order to fabricate the dimensions of the pole pole work extremely sharp values constitute a triangular pin portion (26). It is a matter of course that the rectangular cross section or the arc-shaped pin portion 27 may be configured by making the cross-sectional shape of the electrode base rectangular or circular.

Of course, the electrode base and the release material in the present invention can be made of a variety of materials. In one embodiment of the electrode base and the release material in the present invention, the electrode base may be stainless steel. This is because stainless steel is excellent in durability, and when demolding, electro-formed products such as copper are easily demolded. In the present invention, as the release material, silicon was used as an example. When silicone is used as a release material, the release material has elasticity, and even when demolding the electroformed workpiece, the release material is not damaged at all. In addition, the silicon is very easily separated from the electroformed workpiece. In another embodiment of the present invention, in the release material, it may be preferable that the release material constitutes a release material having foamability. The foamable release material means that the release material can be filled with foam after the filling of the release material by heat or other methods. As an embodiment, after filling the release material by mixing the foamed foam by heat into the silicone, when the heat is applied to the release material, the release material is swollen, and the foamed release material foamed in a gentle arc shape is the jeonju It will increase the efficiency.

According to the present invention, it is possible to easily manufacture more precise and dense electroformed workpieces compared to the corrosion processing of metals by the conventional etching method. At all, if the release material is broken there is an advantage that can be utilized to repair only that part. The product according to the present invention also produces a product through electric poles in an electric pole immediately after the electric pole is produced, without having to undergo exposure and etching for each product in the production process. It allows you to produce more sophisticated products.

Claims (21)

In a chip-on film bonded to a thin base portion, an electroplated workpiece is formed on an electrode base by forming an etching portion or a processing portion and filling a release material with the etching portion or the processing portion. Comprising the chip-on film, characterized in that to form a thin base on the surface of the electroformed workpiece. The chip on film according to claim 1, wherein the release material is a blowing agent release material. The chip-on film according to claim 1 or 2, wherein the release material is silicon. The chip-on film according to claim 1 or 2, wherein the electrode base is stainless steel. The chip-on film according to claim 1 or 2, wherein the base portion covering the surface of the electroformed workpiece is produced by applying a liquid thermoplastic resin and then drying. 6. The chip on film as claimed in claim 5, wherein the thermoplastic resin is an epoxy resin. The chip-on film according to claim 1 or 2, wherein the base portion covering the surface of the electroformed workpiece is made of an adhesive film. The chip-on film according to claim 1 or 2, wherein the processing portion formed on the electrode base is configured in the shape of a triangular pin portion. The chip-on film according to claim 1 or 2, wherein the processing portion formed on the electrode base is configured in the shape of a planar triangular pin portion. The chip-on film according to claim 1 or 2, wherein the processing portion formed on the electrode base is configured in the shape of an arc-shaped pin portion. The chip-on film according to claim 1 or 2, wherein the processing portion formed on the electrode base is configured in the shape of a rectangular pin portion. In the method for manufacturing a chip-on film bonded to a thin base portion, an electroplating process is performed on an electric pole master, wherein an etching portion or a processing portion is formed on an electrode base, and a release material is filled in the etching portion or the processing portion. A method of manufacturing a chip-on film, comprising: forming an electroplated workpiece through the base, and forming a thin base on the surface of the electroplated workpiece. The method of manufacturing a chip on film according to claim 12, wherein the release material is a foam release agent. The method for producing a chip on film according to claim 12 or 13, wherein the release material is silicon. 15. The method of claim 13 or 14, wherein the electrode base is stainless steel. The method for producing a chip-on film according to claim 12 or 13, wherein the base portion covering the surface of the electroformed workpiece is produced by applying a liquid thermoplastic resin and then drying it. The method of claim 16, wherein the thermoplastic resin is an epoxy resin. The method for manufacturing a chip on film according to claim 12 or 13, wherein the base covering the surface of the electroformed workpiece is made of an adhesive film. The method for manufacturing a chip on film according to claim 12 or 13, wherein the processing portion formed on the electrode base is configured in the shape of a triangular pin portion. The method for manufacturing a chip on film according to claim 12 or 13, wherein the processing portion formed on the electrode base is configured in the shape of a planar triangular pin portion. The method for producing a chip on film according to claim 12 or 13, wherein the processing portion formed on the electrode base is configured in the shape of an arc-shaped pin portion.