AU2003250776A1 - Method and device for fitting substrates with components - Google Patents

Method and device for fitting substrates with components

Info

Publication number
AU2003250776A1
AU2003250776A1 AU2003250776A AU2003250776A AU2003250776A1 AU 2003250776 A1 AU2003250776 A1 AU 2003250776A1 AU 2003250776 A AU2003250776 A AU 2003250776A AU 2003250776 A AU2003250776 A AU 2003250776A AU 2003250776 A1 AU2003250776 A1 AU 2003250776A1
Authority
AU
Australia
Prior art keywords
components
fitting substrates
substrates
fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003250776A
Other languages
English (en)
Inventor
Sebastian Aigner
Mohammad Mehdianpour
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of AU2003250776A1 publication Critical patent/AU2003250776A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
AU2003250776A 2002-08-02 2003-07-07 Method and device for fitting substrates with components Abandoned AU2003250776A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10235471.5 2002-08-02
DE10235471A DE10235471A1 (de) 2002-08-02 2002-08-02 Verfahren und Vorrichtung zum Bestücken von Substraten
PCT/DE2003/002268 WO2004017702A1 (de) 2002-08-02 2003-07-07 Verfahren und vorrichtung zum bestücken von substraten

Publications (1)

Publication Number Publication Date
AU2003250776A1 true AU2003250776A1 (en) 2004-03-03

Family

ID=30469379

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003250776A Abandoned AU2003250776A1 (en) 2002-08-02 2003-07-07 Method and device for fitting substrates with components

Country Status (3)

Country Link
AU (1) AU2003250776A1 (de)
DE (1) DE10235471A1 (de)
WO (1) WO2004017702A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008019101B4 (de) 2008-04-16 2010-03-11 Siemens Electronics Assembly Systems Gmbh & Co. Kg Verfahren zum Bestücken von Substraten und Bestückautomat
DE102016114842B4 (de) * 2016-08-10 2019-07-04 Asm Assembly Systems Gmbh & Co. Kg Bauelement-Haltevorrichtung, Verfahren und Computerprogramm zum Bestücken eines Bauelementeträgers, Bestückautomat

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812666A (en) * 1987-09-17 1989-03-14 Universal Instruments Corporation Position feedback enhancement over a limited repositioning area for a moveable member
US6691400B1 (en) * 1995-12-15 2004-02-17 Matsushita Electric Industrial Co., Ltd. High speed electronic parts mounting apparatus having mounting heads which alternately mount components on a printed circuit board
JP2863731B2 (ja) * 1996-05-14 1999-03-03 株式会社テンリュウテクニックス 電子部品装着装置およびその方法
JP3339344B2 (ja) * 1997-01-17 2002-10-28 松下電器産業株式会社 電子部品装着装置
JP2000011487A (ja) * 1998-06-17 2000-01-14 Funai Electric Co Ltd Ｖｔｒのテープ走行制御装置
US6538244B1 (en) * 1999-11-03 2003-03-25 Cyberoptics Corporation Pick and place machine with improved vision system including a linescan sensor

Also Published As

Publication number Publication date
WO2004017702A1 (de) 2004-02-26
DE10235471A1 (de) 2004-02-19

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