AU2003245315A8 - Method and system for predicting process performance using material processing tool and sensor data - Google Patents

Method and system for predicting process performance using material processing tool and sensor data

Info

Publication number
AU2003245315A8
AU2003245315A8 AU2003245315A AU2003245315A AU2003245315A8 AU 2003245315 A8 AU2003245315 A8 AU 2003245315A8 AU 2003245315 A AU2003245315 A AU 2003245315A AU 2003245315 A AU2003245315 A AU 2003245315A AU 2003245315 A8 AU2003245315 A8 AU 2003245315A8
Authority
AU
Australia
Prior art keywords
sensor data
material processing
processing tool
process performance
predicting process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003245315A
Other versions
AU2003245315A1 (en
Inventor
Hieu A Lam
Hongyu Yue
John Shriner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003245315A1 publication Critical patent/AU2003245315A1/en
Publication of AU2003245315A8 publication Critical patent/AU2003245315A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G05B23/0254Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model based on a quantitative model, e.g. mathematical relationships between inputs and outputs; functions: observer, Kalman filter, residual calculation, Neural Networks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32917Plasma diagnostics
    • H01J37/32935Monitoring and controlling tubes by information coming from the object and/or discharge
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31357Observer based fault detection, use model
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32179Quality control, monitor production tool with multiple sensors
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32194Quality prediction
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45028Lithography
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45031Manufacturing semiconductor wafers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Evolutionary Computation (AREA)
  • Power Engineering (AREA)
  • Artificial Intelligence (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • General Factory Administration (AREA)
AU2003245315A 2002-06-28 2003-06-27 Method and system for predicting process performance using material processing tool and sensor data Abandoned AU2003245315A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39196502P 2002-06-28 2002-06-28
US60/391,965 2002-06-28
PCT/US2003/016245 WO2004003969A2 (en) 2002-06-28 2003-06-27 Method and system for predicting process performance using material processing tool and sensor data

Publications (2)

Publication Number Publication Date
AU2003245315A1 AU2003245315A1 (en) 2004-01-19
AU2003245315A8 true AU2003245315A8 (en) 2004-01-19

Family

ID=30000785

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003245315A Abandoned AU2003245315A1 (en) 2002-06-28 2003-06-27 Method and system for predicting process performance using material processing tool and sensor data

Country Status (5)

Country Link
US (2) US20050252884A1 (en)
JP (1) JP2005531927A (en)
AU (1) AU2003245315A1 (en)
TW (1) TWI259546B (en)
WO (1) WO2004003969A2 (en)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4317701B2 (en) * 2003-03-12 2009-08-19 東京エレクトロン株式会社 Processing result prediction method and prediction apparatus
JP4694150B2 (en) * 2003-06-20 2011-06-08 東京エレクトロン株式会社 Processing method and processing system
US6967305B2 (en) * 2003-08-18 2005-11-22 Mks Instruments, Inc. Control of plasma transitions in sputter processing systems
US7292659B1 (en) * 2003-09-26 2007-11-06 Sun Microsystems, Inc. Correlating and aligning monitored signals for computer system performance parameters
US7700494B2 (en) * 2004-12-30 2010-04-20 Tokyo Electron Limited, Inc. Low-pressure removal of photoresist and etch residue
US7344993B2 (en) * 2005-01-11 2008-03-18 Tokyo Electron Limited, Inc. Low-pressure removal of photoresist and etch residue
US7838072B2 (en) * 2005-01-26 2010-11-23 Tokyo Electron Limited Method and apparatus for monolayer deposition (MLD)
WO2006088350A1 (en) * 2005-02-21 2006-08-24 Chemometry Consultancy Method and system for selection of calibration model dimensionality, and use of such a calibration model
US7614302B2 (en) * 2005-08-01 2009-11-10 Baker Hughes Incorporated Acoustic fluid analysis method
US7165011B1 (en) * 2005-09-01 2007-01-16 Tokyo Electron Limited Built-in self test for a thermal processing system
JP4920991B2 (en) * 2006-02-22 2012-04-18 株式会社日立ハイテクノロジーズ Plasma processing apparatus and plasma processing method
US7266468B1 (en) * 2006-03-03 2007-09-04 Perceptron, Inc. Structural data analysis system
WO2007109081A2 (en) 2006-03-16 2007-09-27 Applied Materials, Inc. Method and apparatus for improved operation of an abatement system
US8026113B2 (en) * 2006-03-24 2011-09-27 Tokyo Electron Limited Method of monitoring a semiconductor processing system using a wireless sensor network
US7526699B2 (en) * 2006-03-31 2009-04-28 Tokyo Electron Limited Method for creating a built-in self test (BIST) table for monitoring a monolayer deposition (MLD) system
US7302363B2 (en) * 2006-03-31 2007-11-27 Tokyo Electron Limited Monitoring a system during low-pressure processes
US7519885B2 (en) * 2006-03-31 2009-04-14 Tokyo Electron Limited Monitoring a monolayer deposition (MLD) system using a built-in self test (BIST) table
US7421351B2 (en) * 2006-12-21 2008-09-02 Honeywell International Inc. Monitoring and fault detection in dynamic systems
WO2008147523A1 (en) * 2007-05-25 2008-12-04 Applied Materials, Inc. Cogeneration abatement system for electronic device manufacturing
KR101468606B1 (en) * 2007-05-25 2014-12-04 어플라이드 머티어리얼스, 인코포레이티드 Methods and apparatus for assembling and operating electronic device manufacturing systems
US20090018688A1 (en) * 2007-06-15 2009-01-15 Applied Materials, Inc. Methods and systems for designing and validating operation of abatement systems
FR2918775A1 (en) * 2007-07-12 2009-01-16 Pdf Solutions Sas Soc Par Acti STANDARDIZATION OF PROCESS VARIABLES IN A PROCESS OF MANUFACTURE
WO2009055750A1 (en) * 2007-10-26 2009-04-30 Applied Materials, Inc. Methods and apparatus for smart abatement using an improved fuel circuit
US7962234B2 (en) * 2008-06-09 2011-06-14 International Business Machines Corporation Multidimensional process window optimization in semiconductor manufacturing
JP5166138B2 (en) * 2008-07-02 2013-03-21 パナソニック株式会社 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
JP2010199126A (en) * 2009-02-23 2010-09-09 Panasonic Corp Plasma treatment method and plasma treatment device
US8437870B2 (en) * 2009-06-05 2013-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for implementing a virtual metrology advanced process control platform
US8501631B2 (en) * 2009-11-19 2013-08-06 Lam Research Corporation Plasma processing system control based on RF voltage
SG10201406954SA (en) * 2009-11-19 2014-11-27 Lam Res Corp Methods and apparatus for controlling a plasma processing system
US8901935B2 (en) * 2009-11-19 2014-12-02 Lam Research Corporation Methods and apparatus for detecting the confinement state of plasma in a plasma processing system
TWI417746B (en) 2010-12-03 2013-12-01 Ind Tech Res Inst Method of efficacy anticipation and failure examination for an apparatus
JP5947023B2 (en) * 2011-11-14 2016-07-06 東京エレクトロン株式会社 Temperature control apparatus, plasma processing apparatus, processing apparatus, and temperature control method
US9390893B2 (en) 2012-02-22 2016-07-12 Lam Research Corporation Sub-pulsing during a state
US9197196B2 (en) 2012-02-22 2015-11-24 Lam Research Corporation State-based adjustment of power and frequency
US9462672B2 (en) 2012-02-22 2016-10-04 Lam Research Corporation Adjustment of power and frequency based on three or more states
US9114666B2 (en) 2012-02-22 2015-08-25 Lam Research Corporation Methods and apparatus for controlling plasma in a plasma processing system
US10325759B2 (en) 2012-02-22 2019-06-18 Lam Research Corporation Multiple control modes
US9171699B2 (en) 2012-02-22 2015-10-27 Lam Research Corporation Impedance-based adjustment of power and frequency
US9368329B2 (en) 2012-02-22 2016-06-14 Lam Research Corporation Methods and apparatus for synchronizing RF pulses in a plasma processing system
US10128090B2 (en) 2012-02-22 2018-11-13 Lam Research Corporation RF impedance model based fault detection
US10157729B2 (en) 2012-02-22 2018-12-18 Lam Research Corporation Soft pulsing
US9320126B2 (en) 2012-12-17 2016-04-19 Lam Research Corporation Determining a value of a variable on an RF transmission model
US9842725B2 (en) 2013-01-31 2017-12-12 Lam Research Corporation Using modeling to determine ion energy associated with a plasma system
US9502216B2 (en) 2013-01-31 2016-11-22 Lam Research Corporation Using modeling to determine wafer bias associated with a plasma system
US9295148B2 (en) 2012-12-14 2016-03-22 Lam Research Corporation Computation of statistics for statistical data decimation
US9408288B2 (en) 2012-09-14 2016-08-02 Lam Research Corporation Edge ramping
US9746849B2 (en) * 2012-11-09 2017-08-29 Tokyo Electron Limited Method and apparatus for autonomous tool parameter impact identification system for semiconductor manufacturing
JP5384758B2 (en) * 2013-01-31 2014-01-08 株式会社日立ハイテクノロジーズ Plasma etching equipment
US9779196B2 (en) 2013-01-31 2017-10-03 Lam Research Corporation Segmenting a model within a plasma system
US9620337B2 (en) 2013-01-31 2017-04-11 Lam Research Corporation Determining a malfunctioning device in a plasma system
US9107284B2 (en) 2013-03-13 2015-08-11 Lam Research Corporation Chamber matching using voltage control mode
US9119283B2 (en) 2013-03-14 2015-08-25 Lam Research Corporation Chamber matching for power control mode
US9502221B2 (en) 2013-07-26 2016-11-22 Lam Research Corporation Etch rate modeling and use thereof with multiple parameters for in-chamber and chamber-to-chamber matching
DE102013014147B4 (en) * 2013-08-23 2017-02-16 Centrotherm Photovoltaics Ag METHOD AND DEVICE FOR DETECTING A PLASMA IGNITION
TWI677264B (en) * 2013-12-13 2019-11-11 美商蘭姆研究公司 Rf impedance model based fault detection
US9594105B2 (en) 2014-01-10 2017-03-14 Lam Research Corporation Cable power loss determination for virtual metrology
US10950421B2 (en) * 2014-04-21 2021-03-16 Lam Research Corporation Using modeling for identifying a location of a fault in an RF transmission system for a plasma system
US10102321B2 (en) * 2014-10-24 2018-10-16 Lam Research Corporation System, method and apparatus for refining radio frequency transmission system models
US9536749B2 (en) 2014-12-15 2017-01-03 Lam Research Corporation Ion energy control by RF pulse shape
JP6310866B2 (en) * 2015-01-30 2018-04-11 株式会社日立ハイテクノロジーズ Plasma processing apparatus, plasma processing method and analysis method
US20160365253A1 (en) * 2015-06-09 2016-12-15 Macronix International Co., Ltd. System and method for chemical mechanical planarization process prediction and optimization
WO2017030474A1 (en) * 2015-08-18 2017-02-23 Telefonaktiebolaget Lm Ericsson (Publ) Methods and devices for determining termination characteristics of an electrically conductive line
US11774306B2 (en) 2018-06-26 2023-10-03 Applied Materials, Inc. System and method for maintenance of rotation-lift assembly
JP6990634B2 (en) * 2018-08-21 2022-02-03 株式会社日立ハイテク State prediction device and semiconductor manufacturing device
US11756840B2 (en) * 2018-09-20 2023-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. Reflectance measurement system and method thereof
CN111665820B (en) * 2020-06-08 2021-11-23 杭州电子科技大学 Distributed fault detection and fault-tolerant control method of industrial interconnection system
CN111914210B (en) * 2020-06-13 2023-09-19 宁波大学 Complex chemical process state monitoring method based on correlation characteristic analysis
JP2022111771A (en) * 2021-01-20 2022-08-01 東京エレクトロン株式会社 Plasma processing system and plasma processing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04212414A (en) 1990-08-16 1992-08-04 Fuji Electric Co Ltd Plasma process equipment
US5888414A (en) * 1991-06-27 1999-03-30 Applied Materials, Inc. Plasma reactor and processes using RF inductive coupling and scavenger temperature control
US5642296A (en) * 1993-07-29 1997-06-24 Texas Instruments Incorporated Method of diagnosing malfunctions in semiconductor manufacturing equipment
JPH085542A (en) 1994-06-20 1996-01-12 Hitachi Ltd Method and apparatus for fabricating semiconductor device
JPH08246169A (en) 1995-03-13 1996-09-24 Hitachi Ltd Plasma-treating device
US6197116B1 (en) * 1996-08-29 2001-03-06 Fujitsu Limited Plasma processing system
JP3630931B2 (en) 1996-08-29 2005-03-23 富士通株式会社 Plasma processing apparatus, process monitoring method, and semiconductor device manufacturing method
US5971591A (en) * 1997-10-20 1999-10-26 Eni Technologies, Inc. Process detection system for plasma process
US6183594B1 (en) * 1998-09-25 2001-02-06 International Business Machines Corporation Method and system for detecting the end-point in etching processes
US6582618B1 (en) 1999-09-08 2003-06-24 Advanced Micro Devices, Inc. Method of determining etch endpoint using principal components analysis of optical emission spectra
US6616759B2 (en) * 2001-09-06 2003-09-09 Hitachi, Ltd. Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor

Also Published As

Publication number Publication date
WO2004003969A2 (en) 2004-01-08
US20050252884A1 (en) 2005-11-17
WO2004003969A3 (en) 2004-05-13
AU2003245315A1 (en) 2004-01-19
US7844559B2 (en) 2010-11-30
US20090099991A1 (en) 2009-04-16
TW200402114A (en) 2004-02-01
JP2005531927A (en) 2005-10-20
TWI259546B (en) 2006-08-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase