AU2003243906A1 - Bonding device and bonding method - Google Patents

Bonding device and bonding method

Info

Publication number
AU2003243906A1
AU2003243906A1 AU2003243906A AU2003243906A AU2003243906A1 AU 2003243906 A1 AU2003243906 A1 AU 2003243906A1 AU 2003243906 A AU2003243906 A AU 2003243906A AU 2003243906 A AU2003243906 A AU 2003243906A AU 2003243906 A1 AU2003243906 A1 AU 2003243906A1
Authority
AU
Australia
Prior art keywords
bonding
bonding method
bonding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003243906A
Inventor
Rudolf Kaiser
Horst Lapsien
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT Amicra GmbH
Original Assignee
Amicra Microtechnologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amicra Microtechnologies GmbH filed Critical Amicra Microtechnologies GmbH
Publication of AU2003243906A1 publication Critical patent/AU2003243906A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
AU2003243906A 2003-06-02 2003-06-02 Bonding device and bonding method Abandoned AU2003243906A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2003/001793 WO2004112100A1 (en) 2003-06-02 2003-06-02 Bonding device and bonding method

Publications (1)

Publication Number Publication Date
AU2003243906A1 true AU2003243906A1 (en) 2005-01-04

Family

ID=33546408

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003243906A Abandoned AU2003243906A1 (en) 2003-06-02 2003-06-02 Bonding device and bonding method

Country Status (3)

Country Link
AU (1) AU2003243906A1 (en)
DE (1) DE10394243B4 (en)
WO (1) WO2004112100A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013105660B3 (en) * 2013-06-03 2014-07-24 Amicra Microtechnologies Gmbh Assembly device and method for applying electrical and / or opto-electrical components to substrates
SG11201903110SA (en) * 2016-10-08 2019-05-30 Capcon Ltd Apparatus, control method and control device of semiconductor packaging
DE102017125932A1 (en) 2017-11-07 2019-05-09 Asm Amicra Microtechnologies Gmbh Method for bonding electrical, electronic, optical, opto-electrical and / or mechanical components to substrates and an associated bonding device
DE102019120954B4 (en) 2019-08-02 2023-02-02 Asmpt Amicra Gmbh Method for producing an adhesive connection, carrier plate for producing an adhesive connection and adhesive device for producing an adhesive connection
DE102019120955B8 (en) 2019-08-02 2021-03-18 Asm Amicra Microtechnologies Gmbh Bonding tool, bonding device and bonding process

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8714814U1 (en) * 1987-11-06 1989-03-09 J. Muehlbauer Gmbh, 8495 Roding, De
DE8714813U1 (en) * 1987-11-06 1989-03-09 J. Muehlbauer Gmbh, 8495 Roding, De
DE8714815U1 (en) * 1987-11-06 1989-03-09 J. Muehlbauer Gmbh, 8495 Roding, De
US4980971A (en) * 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
GB9006035D0 (en) * 1990-03-16 1990-05-09 Emhart Deutschland Die eject system for die bonder
JP2662131B2 (en) * 1991-12-26 1997-10-08 松下電器産業株式会社 Bonding equipment
US5547537A (en) * 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
DE19510230C2 (en) * 1995-03-24 1999-08-05 Michael Geringer Transfer device for electrical components, in particular chips
DE19515684C2 (en) * 1995-04-28 2003-11-06 Michael Geringer Process for separating electrical components
DE19748442A1 (en) * 1997-11-03 1999-05-06 Georg Sillner Transporting and/or sorting device for small component
EP0913857B1 (en) * 1997-10-30 2004-01-28 ESEC Trading SA Method and device for positioning the bonding head of a machine for the bonding of semiconductor chips as a carrier material
EP0953398A1 (en) * 1998-02-06 1999-11-03 Esec Sa Process and chip for calibrating a wire bonder
FR2789068B1 (en) * 1999-02-03 2001-03-16 Optique Et Microsystemes Sa ALIGNMENT DEVICE FOR THE ASSEMBLY OF MICROSYSTEMS AND FOR MICRO DISTRIBUTION ON MICROSYSTEMS OR ON BIOTECHNOLOGICAL MICRO-COMPONENTS
DE10109009C2 (en) * 2001-02-23 2003-12-18 Geringer Michael Bonder

Also Published As

Publication number Publication date
DE10394243D2 (en) 2006-03-02
WO2004112100A1 (en) 2004-12-23
DE10394243B4 (en) 2015-10-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase