AU2003242534A8 - High energy density capacitors - Google Patents

High energy density capacitors

Info

Publication number
AU2003242534A8
AU2003242534A8 AU2003242534A AU2003242534A AU2003242534A8 AU 2003242534 A8 AU2003242534 A8 AU 2003242534A8 AU 2003242534 A AU2003242534 A AU 2003242534A AU 2003242534 A AU2003242534 A AU 2003242534A AU 2003242534 A8 AU2003242534 A8 AU 2003242534A8
Authority
AU
Australia
Prior art keywords
high energy
energy density
density capacitors
capacitors
energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003242534A
Other languages
English (en)
Other versions
AU2003242534A1 (en
Inventor
Klaus Kuhling
Hans-Josef Sterzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of AU2003242534A8 publication Critical patent/AU2003242534A8/xx
Publication of AU2003242534A1 publication Critical patent/AU2003242534A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
AU2003242534A 2002-05-14 2003-05-12 High energy density capacitors Abandoned AU2003242534A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10221498.0 2002-05-14
DE10221498A DE10221498A1 (de) 2002-05-14 2002-05-14 Kondensatoren hoher Energiedichte
PCT/EP2003/004928 WO2003096362A2 (de) 2002-05-14 2003-05-12 Kondensatoren hoher energiedichte

Publications (2)

Publication Number Publication Date
AU2003242534A8 true AU2003242534A8 (en) 2003-11-11
AU2003242534A1 AU2003242534A1 (en) 2003-11-11

Family

ID=29413822

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003242534A Abandoned AU2003242534A1 (en) 2002-05-14 2003-05-12 High energy density capacitors

Country Status (9)

Country Link
US (2) US7023687B2 (xx)
EP (1) EP1506555A2 (xx)
JP (1) JP2005525700A (xx)
KR (1) KR20040106399A (xx)
CN (1) CN1653566A (xx)
AU (1) AU2003242534A1 (xx)
DE (1) DE10221498A1 (xx)
TW (1) TW200401314A (xx)
WO (1) WO2003096362A2 (xx)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE346825T1 (de) * 2002-05-14 2006-12-15 Basf Ag Verfahren zur herstellung von barium- oder strontiumtitanat mit mittleren durchmessern kleiner als 10 nanometer
DE102004052086A1 (de) * 2004-10-26 2006-04-27 Basf Ag Kondensatoren hoher Energiedichte
EP2013888A2 (de) * 2006-04-26 2009-01-14 Basf Se Verfahren zur herstellung einer beschichtung eines porösen, elektrisch leitfähigen trägermaterials mit einem dielektrikum und herstellung von kondensatoren hoher kapazitätsdichte unter einsatz dieses verfahrens
US20100195261A1 (en) * 2009-02-02 2010-08-05 Space Charge, LLC Capacitors using preformed dielectric
US20100200393A1 (en) * 2009-02-09 2010-08-12 Robert Chow Sputter deposition method and system for fabricating thin film capacitors with optically transparent smooth surface metal oxide standoff layer
WO2011050374A1 (de) 2009-10-30 2011-05-05 Franz Oberthaler Elektrischer kondensator mit einer hohen energiedichte
CN103283262B (zh) * 2010-10-19 2016-05-04 索诺瓦公司 包括可再充电电源的助听器
DE102010043748A1 (de) 2010-11-11 2012-05-16 Robert Bosch Gmbh Verfahren zur Herstellung eines kapazitiven Speicherelements, Speicherelement und dessen Verwendung
US9396880B2 (en) 2011-11-16 2016-07-19 Martin A. Stuart High energy density storage device
EP2780919B1 (en) * 2011-11-16 2017-07-19 Martin A. Stuart High energy density storage device
US9287701B2 (en) 2014-07-22 2016-03-15 Richard H. Sherratt and Susan B. Sherratt Revocable Trust Fund DC energy transfer apparatus, applications, components, and methods
CN105161304A (zh) * 2015-06-22 2015-12-16 广东明路电力电子有限公司 蜂窝电极电容器
KR101912286B1 (ko) * 2017-03-27 2018-10-29 삼성전기 주식회사 커패시터 부품

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4061584A (en) * 1974-12-13 1977-12-06 General Electric Company High dielectric constant ink for thick film capacitors
EP0146284B1 (en) * 1983-11-29 1988-06-29 Sony Corporation Methods of manufacturing dielectric metal titanates
JPH0653253B2 (ja) * 1986-11-08 1994-07-20 松下電工株式会社 セラミツク基板の粗化法
US4766522A (en) * 1987-07-15 1988-08-23 Hughes Aircraft Company Electrochemical capacitor
JP2787953B2 (ja) 1989-08-03 1998-08-20 イビデン株式会社 電子回路基板
JP2536458B2 (ja) * 1994-08-16 1996-09-18 日本電気株式会社 ジスルホン酸化合物、それをド―パントとする導電性高分子、導電材およびそれを用いた固体電解コンデンサ
DE69513128T2 (de) * 1994-11-25 2000-06-15 Nec Corp., Tokio/Tokyo Festelektrolytkondensator mit zwei Elektrolytschichten und Herstellungsverfahren
US5600535A (en) * 1994-12-09 1997-02-04 The United States Of America As Represented By The Secretary Of The Army Amorphous thin film electrode materials from hydrous metal oxides
US5790368A (en) * 1995-06-27 1998-08-04 Murata Manufacturing Co., Ltd. Capacitor and manufacturing method thereof
US5825611A (en) * 1997-01-29 1998-10-20 Vishay Sprague, Inc. Doped sintered tantalum pellets with nitrogen in a capacitor
JP3391269B2 (ja) * 1998-01-20 2003-03-31 株式会社村田製作所 誘電体セラミックおよびその製造方法、ならびに、積層セラミック電子部品およびその製造方法
DE19943103A1 (de) * 1999-09-09 2001-03-15 Wacker Chemie Gmbh Hochgefüllte SiO2-Dispersion, Verfahren zu ihrer Herstellung und Verwendung
US6519136B1 (en) * 2002-03-29 2003-02-11 Intel Corporation Hybrid dielectric material and hybrid dielectric capacitor

Also Published As

Publication number Publication date
US20030214776A1 (en) 2003-11-20
EP1506555A2 (de) 2005-02-16
DE10221498A1 (de) 2003-12-04
US7023687B2 (en) 2006-04-04
TW200401314A (en) 2004-01-16
WO2003096362A3 (de) 2004-08-26
JP2005525700A (ja) 2005-08-25
WO2003096362A2 (de) 2003-11-20
KR20040106399A (ko) 2004-12-17
AU2003242534A1 (en) 2003-11-11
US20050152090A1 (en) 2005-07-14
CN1653566A (zh) 2005-08-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
TH Corrigenda

Free format text: IN VOL 18, NO 2, PAGE(S) 483 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME BASF AKTIENGESELLSCHAFT, APPLICATION NO.2003242534, UNDER INID (43) CORRECT THE PUBLICATION DATE TO READ 24.11.2003