AU2003242221A1 - Acenaphthylene modified phenolic resin and epoxy resin composition - Google Patents
Acenaphthylene modified phenolic resin and epoxy resin compositionInfo
- Publication number
- AU2003242221A1 AU2003242221A1 AU2003242221A AU2003242221A AU2003242221A1 AU 2003242221 A1 AU2003242221 A1 AU 2003242221A1 AU 2003242221 A AU2003242221 A AU 2003242221A AU 2003242221 A AU2003242221 A AU 2003242221A AU 2003242221 A1 AU2003242221 A1 AU 2003242221A1
- Authority
- AU
- Australia
- Prior art keywords
- modified phenolic
- resin composition
- epoxy resin
- acenaphthylene
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-170421 | 2002-06-11 | ||
JP2002170421 | 2002-06-11 | ||
PCT/JP2003/007360 WO2003104295A1 (en) | 2002-06-11 | 2003-06-10 | Acenaphthylene modified phenolic resin and epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003242221A1 true AU2003242221A1 (en) | 2003-12-22 |
Family
ID=29727764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003242221A Abandoned AU2003242221A1 (en) | 2002-06-11 | 2003-06-10 | Acenaphthylene modified phenolic resin and epoxy resin composition |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4237137B2 (en) |
AU (1) | AU2003242221A1 (en) |
WO (1) | WO2003104295A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101423170B1 (en) * | 2006-10-04 | 2014-07-25 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product |
EP2133398B1 (en) | 2007-03-08 | 2014-01-15 | Nippon Steel & Sumikin Chemical Co., Ltd. | Fire-retardant adhesive resin composition, and adhesive film using the same |
US9376614B2 (en) * | 2012-08-22 | 2016-06-28 | Empire Technology Development Llc | Optically active epoxy |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6036209B2 (en) * | 1982-04-12 | 1985-08-19 | 新日鐵化学株式会社 | Manufacturing method of modified phenolic resin |
JPH11158100A (en) * | 1997-11-26 | 1999-06-15 | Mitsui Chem Inc | Phenolic compound and its production |
JP4408978B2 (en) * | 1999-01-12 | 2010-02-03 | 新日鐵化学株式会社 | Production method of polyvalent hydroxy resin and epoxy resin |
JP4651774B2 (en) * | 2000-04-11 | 2011-03-16 | 新日鐵化学株式会社 | Aromatic oligomer, phenol resin composition containing the same, epoxy resin composition and cured product thereof |
JP2003160715A (en) * | 2001-11-26 | 2003-06-06 | Nippon Steel Chem Co Ltd | Epoxy resin composition for sealing electronic part and electronic part |
-
2003
- 2003-06-10 JP JP2004511362A patent/JP4237137B2/en not_active Expired - Fee Related
- 2003-06-10 AU AU2003242221A patent/AU2003242221A1/en not_active Abandoned
- 2003-06-10 WO PCT/JP2003/007360 patent/WO2003104295A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JPWO2003104295A1 (en) | 2005-10-06 |
JP4237137B2 (en) | 2009-03-11 |
WO2003104295A1 (en) | 2003-12-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2003229684A1 (en) | Heat-curable epoxy resin composition | |
AU2003211340A1 (en) | Resin composition and multi-layer structures | |
AU2003296188A1 (en) | Radiation-sensitive resin composition | |
AU2003235170A1 (en) | Thermosetting resin composition and prepreg and laminated sheet using the same | |
AU2002367625A1 (en) | Radiation-sensitive resin composition | |
HK1086582A1 (en) | Curable resins and curable resin compositions containing the same | |
AU2003281688A1 (en) | Thermosetting resin composition and adhesive film | |
AU2003284462A1 (en) | Flame-retardant epoxy resin composition and cured object obtained therefrom | |
AU2003292811A1 (en) | Silicone resin composition | |
AU2003236134A1 (en) | Thermosetting resin composition and adhesive films | |
AU2003281404A1 (en) | Photosensitive resin composition and photosensitive element using the same | |
AU2002318602A1 (en) | Curable resin composition | |
AU2003272993A1 (en) | Agglomerate and resin composition containing the same | |
EP1422263B8 (en) | Resin composition | |
AU2003291083A1 (en) | Phenolic resins | |
AU2003295257A1 (en) | Radiation-curable resin composition | |
AU2001233775A1 (en) | Thermosetting resin composition | |
AU2003280571A1 (en) | Radiation-sensitive resin composition | |
EP1660602A4 (en) | Resins and adhesive formulations therewith | |
AU2003211246A1 (en) | Polymerizable composition and cured resin composition | |
AU2003235274A1 (en) | Visible-light-curable resin composition | |
AU2001285831A1 (en) | Fluorine type adhesive resin composition | |
AU2003242221A1 (en) | Acenaphthylene modified phenolic resin and epoxy resin composition | |
AU2003284604A1 (en) | Thermosetting resin composition | |
AU2003241990A1 (en) | Thermoplastic resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |