AU2003220925A1 - Adhesive tape for electronic member - Google Patents

Adhesive tape for electronic member

Info

Publication number
AU2003220925A1
AU2003220925A1 AU2003220925A AU2003220925A AU2003220925A1 AU 2003220925 A1 AU2003220925 A1 AU 2003220925A1 AU 2003220925 A AU2003220925 A AU 2003220925A AU 2003220925 A AU2003220925 A AU 2003220925A AU 2003220925 A1 AU2003220925 A1 AU 2003220925A1
Authority
AU
Australia
Prior art keywords
adhesive tape
electronic member
electronic
tape
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003220925A
Other languages
English (en)
Inventor
Norikazu Araki
Tetsuo Fujimura
Kazuhiro Kosugi
Masashi Kume
Masanobu Kutsumi
Mikio Shimizu
Hiroyuki Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Publication of AU2003220925A1 publication Critical patent/AU2003220925A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
AU2003220925A 2003-03-28 2003-03-28 Adhesive tape for electronic member Abandoned AU2003220925A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/003972 WO2004087828A1 (ja) 2003-03-28 2003-03-28 電子部材用粘着テープ

Publications (1)

Publication Number Publication Date
AU2003220925A1 true AU2003220925A1 (en) 2004-10-25

Family

ID=33105307

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003220925A Abandoned AU2003220925A1 (en) 2003-03-28 2003-03-28 Adhesive tape for electronic member

Country Status (3)

Country Link
JP (1) JPWO2004087828A1 (ja)
AU (1) AU2003220925A1 (ja)
WO (1) WO2004087828A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4667308B2 (ja) * 2006-06-23 2011-04-13 三井化学株式会社 半導体ウェハダイシング用保護シート及びそれを用いた半導体ウェハのダイシング方法
JP2008251934A (ja) * 2007-03-30 2008-10-16 Lintec Corp 半導体チップの製造方法
US20150136317A1 (en) * 2012-06-28 2015-05-21 Hayakawa Rubber Co., Ltd. Double-sided adhesive tape and adhesion method using double-sided adhesive tape
JP6169067B2 (ja) * 2014-12-24 2017-07-26 古河電気工業株式会社 電子部品加工用粘着テープ
JP6906402B2 (ja) * 2017-09-07 2021-07-21 日東電工株式会社 半導体ウエハ保護用粘着テープ
TWI830764B (zh) * 2018-08-08 2024-02-01 日商琳得科股份有限公司 端子保護用膠帶以及附電磁波屏蔽膜之半導體裝置的製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09328663A (ja) * 1996-06-10 1997-12-22 Toyo Chem Co Ltd 半導体ウエハ固定用シート
JPH10209087A (ja) * 1997-01-16 1998-08-07 Toyo Chem Co Ltd 半導体ウエハ固定用シート及びチツプピツクアツプ方法
JP2003064328A (ja) * 2001-08-30 2003-03-05 Sumitomo Bakelite Co Ltd 半導体基板加工用粘着シート
JP3883405B2 (ja) * 2001-09-28 2007-02-21 電気化学工業株式会社 電子部材用粘着テープ

Also Published As

Publication number Publication date
WO2004087828A1 (ja) 2004-10-14
JPWO2004087828A1 (ja) 2006-07-06

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase