AU2003218795A1 - Coil on a semiconductor substrate and method for production thereof - Google Patents

Coil on a semiconductor substrate and method for production thereof

Info

Publication number
AU2003218795A1
AU2003218795A1 AU2003218795A AU2003218795A AU2003218795A1 AU 2003218795 A1 AU2003218795 A1 AU 2003218795A1 AU 2003218795 A AU2003218795 A AU 2003218795A AU 2003218795 A AU2003218795 A AU 2003218795A AU 2003218795 A1 AU2003218795 A1 AU 2003218795A1
Authority
AU
Australia
Prior art keywords
coil
production
semiconductor substrate
semiconductor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003218795A
Inventor
Kevni Bueyuektas
Klaus Koller
Karlheinz Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of AU2003218795A1 publication Critical patent/AU2003218795A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/10—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5221—Crossover interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2003218795A 2002-03-21 2003-03-19 Coil on a semiconductor substrate and method for production thereof Abandoned AU2003218795A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10212630.5 2002-03-21
DE10212630A DE10212630A1 (en) 2002-03-21 2002-03-21 Coil on a semiconductor substrate and method for its production
PCT/EP2003/002880 WO2003081616A1 (en) 2002-03-21 2003-03-19 Coil on a semiconductor substrate and method for production thereof

Publications (1)

Publication Number Publication Date
AU2003218795A1 true AU2003218795A1 (en) 2003-10-08

Family

ID=28050740

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003218795A Abandoned AU2003218795A1 (en) 2002-03-21 2003-03-19 Coil on a semiconductor substrate and method for production thereof

Country Status (6)

Country Link
EP (1) EP1468433B1 (en)
CN (1) CN1327460C (en)
AU (1) AU2003218795A1 (en)
DE (2) DE10212630A1 (en)
TW (1) TWI294675B (en)
WO (1) WO2003081616A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7255801B2 (en) * 2004-04-08 2007-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Deep submicron CMOS compatible suspending inductor
US7264986B2 (en) * 2005-09-30 2007-09-04 Freescale Semiconductor, Inc. Microelectronic assembly and method for forming the same
US7425485B2 (en) 2005-09-30 2008-09-16 Freescale Semiconductor, Inc. Method for forming microelectronic assembly
TWI651919B (en) * 2017-07-10 2019-02-21 建準電機工業股份有限公司 Drive assembly for motor and semiconductor package structure for motor excitation
CN108900216B (en) * 2018-06-01 2021-01-29 华为技术有限公司 Wireless transmission module and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025261A (en) * 1998-04-29 2000-02-15 Micron Technology, Inc. Method for making high-Q inductive elements
TW396594B (en) * 1998-07-13 2000-07-01 Winbond Electronics Corp High quality inductor device and its manufacturing method
TW386279B (en) * 1998-08-07 2000-04-01 Winbond Electronics Corp Inductor structure with air gap and method of manufacturing thereof
US6287931B1 (en) * 1998-12-04 2001-09-11 Winbond Electronics Corp. Method of fabricating on-chip inductor
FR2791470B1 (en) * 1999-03-23 2001-06-01 Memscap MONOLITHIC INTEGRATED CIRCUIT INCORPORATING AN INDUCTIVE COMPONENT AND METHOD FOR MANUFACTURING SUCH AN INTEGRATED CIRCUIT
US6180995B1 (en) * 1999-05-06 2001-01-30 Spectrian Corporation Integrated passive devices with reduced parasitic substrate capacitance
US6140197A (en) * 1999-08-30 2000-10-31 Chartered Semiconductor Manufacturing Ltd. Method of making spiral-type RF inductors having a high quality factor (Q)

Also Published As

Publication number Publication date
DE50300810D1 (en) 2005-08-25
DE10212630A1 (en) 2003-10-16
TWI294675B (en) 2008-03-11
TW200308071A (en) 2003-12-16
CN1327460C (en) 2007-07-18
EP1468433B1 (en) 2005-07-20
CN1643626A (en) 2005-07-20
EP1468433A1 (en) 2004-10-20
WO2003081616A1 (en) 2003-10-02

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase