AU2003218593A1 - Method for producing a wedge-free bonded joint - Google Patents

Method for producing a wedge-free bonded joint

Info

Publication number
AU2003218593A1
AU2003218593A1 AU2003218593A AU2003218593A AU2003218593A1 AU 2003218593 A1 AU2003218593 A1 AU 2003218593A1 AU 2003218593 A AU2003218593 A AU 2003218593A AU 2003218593 A AU2003218593 A AU 2003218593A AU 2003218593 A1 AU2003218593 A1 AU 2003218593A1
Authority
AU
Australia
Prior art keywords
phase
closer together
wedge
bonded
bringing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003218593A
Inventor
Jochen Kuntner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
Unaxis Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unaxis Balzers AG filed Critical Unaxis Balzers AG
Publication of AU2003218593A1 publication Critical patent/AU2003218593A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacture Of Motors, Generators (AREA)

Abstract

The inventive method for the wedge-free bonding of planar surfaces comprises, in essence, a concluding phase involving bringing the surfaces to be bonded closer together. During this phase, the surfaces are brought closer together essentially by means of capillary forces and, optionally, with the aid of gravity. It is advantageous, before the actual bonding process, to parallelly align the surfaces to be bonded by simply placing one component atop the other. This enables, once adhesive (11) has been applied to the center of the first surface, the second surface, in the initial phase, to be quickly advanced toward the first surface up to a distance of 0.5 mm therefrom. In the intermediate phase of bringing the surfaces closer together, a slow average speed is selected in order to prevent the formation of bubbles once the adhesive comes into contact with the second surface.
AU2003218593A 2002-04-25 2003-04-22 Method for producing a wedge-free bonded joint Abandoned AU2003218593A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH701/02 2002-04-25
CH7012002 2002-04-25
PCT/CH2003/000261 WO2003091784A1 (en) 2002-04-25 2003-04-22 Method for producing a wedge-free bonded joint

Publications (1)

Publication Number Publication Date
AU2003218593A1 true AU2003218593A1 (en) 2003-11-10

Family

ID=29256405

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003218593A Abandoned AU2003218593A1 (en) 2002-04-25 2003-04-22 Method for producing a wedge-free bonded joint

Country Status (6)

Country Link
EP (1) EP1502147B1 (en)
AT (1) ATE400002T1 (en)
AU (1) AU2003218593A1 (en)
DE (1) DE50310071D1 (en)
TW (1) TW200305623A (en)
WO (1) WO2003091784A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201610458WA (en) * 2014-06-26 2017-01-27 Ev Group E Thallner Gmbh Method for bonding substrates
DE102015100635A1 (en) * 2015-01-16 2016-07-21 Preh Gmbh Arrangement for the entire surface bonding of substantially congruent adhesive surfaces of a first and second joining partner

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5725626A (en) * 1986-06-18 1998-03-10 Canon Kabushiki Kaisha Method for manufacturing an optical element by bonding a plurality of elements
DE4414915C2 (en) * 1994-04-28 2001-01-18 Karlsruhe Forschzent Process for gluing microstructures
DE19622684A1 (en) * 1996-06-05 1997-12-11 Siemens Ag Process for producing mechanically strong adhesive bonds between surfaces
US6212014B1 (en) * 1997-09-29 2001-04-03 Lsa, Inc. MWIR polarizing beamsplitter cube and method of making the same
JP2000191985A (en) * 1998-12-25 2000-07-11 Seiko Epson Corp Method for bonding members, production of bonded body and device therefor

Also Published As

Publication number Publication date
DE50310071D1 (en) 2008-08-14
WO2003091784A1 (en) 2003-11-06
WO2003091784B1 (en) 2004-03-04
EP1502147B1 (en) 2008-07-02
TW200305623A (en) 2003-11-01
EP1502147A1 (en) 2005-02-02
ATE400002T1 (en) 2008-07-15

Similar Documents

Publication Publication Date Title
TW329024B (en) Bonded wafer
TR200400214T4 (en) Cross-woven base sheet for stationary batt according to double point and putty methods.
MY155191A (en) Method of forming single face corrugated board
EP1216784A3 (en) Method of diffusion bonding superalloy components
WO2006038030A3 (en) Equipment for wafer bonding
WO2002000419A3 (en) Method of applying a semi-rigid film to a substrate
MY144179A (en) Wafer-processing tape and method of producing the same
TW200507232A (en) Bonding method and bonding device
CN105074101A (en) Method of forming adhesive connections
TW349233B (en) Pre-bond cavity air bridge
EP1273385A3 (en) Method for diffusion bonding magnesium/aluminum components
AU2003218593A1 (en) Method for producing a wedge-free bonded joint
DE602005019279D1 (en) CONNECTING SILICON CARBIDE
WO2000045446A3 (en) Device and method for gluing together parts to be joined
NO940463L (en) Method and apparatus for stacking substrates to be bonded to each other by adhesion bonding
DE50302745D1 (en) METHOD FOR PRODUCING A COMPONENT WITH DEEPLY CONNECTING SURFACES
ATE371003T1 (en) METHOD FOR CONNECTING TWO SUBSTRATES, METHOD FOR DISSOLVING THE BOND AND PRIMER THEREFOR
DE10347652A1 (en) Adhesive connection used in the production of vehicles comprises an adhesive layer arranged between joining partners
MY137967A (en) Method of joining surfaces
EP1190823A3 (en) Method and apparatus for joining wood blocks together
AU2001231626A1 (en) Method for testing the bonding strength of an adhesive bond between two thin flat substrates
WO2005059522A8 (en) Vaccum sensor application and method for nondetachably joining a sensor workpiece to a body component
JP3678690B2 (en) Bonding method of artificial marble board
JPH0449365A (en) Tile lining construction
WO2005030666A3 (en) Improvements relating to glass

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase