AU2001231626A1 - Method for testing the bonding strength of an adhesive bond between two thin flat substrates - Google Patents
Method for testing the bonding strength of an adhesive bond between two thin flat substratesInfo
- Publication number
- AU2001231626A1 AU2001231626A1 AU2001231626A AU3162601A AU2001231626A1 AU 2001231626 A1 AU2001231626 A1 AU 2001231626A1 AU 2001231626 A AU2001231626 A AU 2001231626A AU 3162601 A AU3162601 A AU 3162601A AU 2001231626 A1 AU2001231626 A1 AU 2001231626A1
- Authority
- AU
- Australia
- Prior art keywords
- testing
- bonding strength
- adhesive bond
- thin flat
- flat substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/24—Investigating strength properties of solid materials by application of mechanical stress by applying steady shearing forces
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10007842 | 2000-02-21 | ||
DE2000107842 DE10007842A1 (en) | 2000-02-21 | 2000-02-21 | Method for testing the adhesive strength of an adhesive bond between two thin surface substrates |
PCT/EP2000/013076 WO2001063246A1 (en) | 2000-02-21 | 2000-12-21 | Method for testing the bonding strength of an adhesive bond between two thin flat substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001231626A1 true AU2001231626A1 (en) | 2001-09-03 |
Family
ID=7631703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001231626A Abandoned AU2001231626A1 (en) | 2000-02-21 | 2000-12-21 | Method for testing the bonding strength of an adhesive bond between two thin flat substrates |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2001231626A1 (en) |
DE (1) | DE10007842A1 (en) |
WO (1) | WO2001063246A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004039672B3 (en) * | 2004-08-16 | 2006-03-16 | Siemens Ag | Method for testing the adhesion between a piezoceramic layer and an inner electrode |
CN105043979B (en) * | 2015-06-09 | 2017-12-29 | 广东溢达纺织有限公司 | Industrial textile wash water color fastness method of testing |
CN109887855B (en) * | 2019-01-03 | 2022-06-21 | 长江存储科技有限责任公司 | Wafer bonding force measuring device, bonding release device and bonded wafer detection device |
CN112701058B (en) * | 2020-12-30 | 2022-09-02 | 长春长光圆辰微电子技术有限公司 | Method for testing wafer bonding force |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3850033A (en) * | 1973-07-23 | 1974-11-26 | Dow Chemical Co | Glueability tester |
FR2572216B1 (en) * | 1984-10-23 | 1987-01-23 | Trt Telecom Radio Electr | METHOD FOR CHECKING BY ADHESIVE OF THE ADHESION OF A LAYER DEPOSITED ON A SURFACE |
JPH0726908B2 (en) * | 1988-01-25 | 1995-03-29 | 三菱電機株式会社 | Coating film adhesion strength or shear strength measuring device |
-
2000
- 2000-02-21 DE DE2000107842 patent/DE10007842A1/en not_active Withdrawn
- 2000-12-21 WO PCT/EP2000/013076 patent/WO2001063246A1/en active Application Filing
- 2000-12-21 AU AU2001231626A patent/AU2001231626A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE10007842A1 (en) | 2001-08-23 |
WO2001063246A1 (en) | 2001-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2002239621A1 (en) | Hot-melt adhesive having improved bonding strength | |
WO2005123387A3 (en) | Electro-active adhesive systems | |
AU2001247940A1 (en) | Methods of improving bonding strength in primer/sealant adhesive systems | |
AU2002243327A1 (en) | Hot-melt adhesive for non-woven elastic composite bonding | |
AU2002340940A1 (en) | Adhesive components and process for manufacture | |
AU2001279785A1 (en) | Method for accelerating the curing of adhesives | |
AU2003238814A1 (en) | Adhesive compositions for bonding lignocellulosic materials, bonding methods and apparatus, and bonded articles | |
AU2002232787A1 (en) | Adhesive measuring tape | |
AU2002334780A1 (en) | Adhesive wafers for die attach application | |
AU2003229033A1 (en) | Acrylic structural adhesive having improved t-peel strength | |
AU8648598A (en) | Adhesive for bonding circuit members, circuit board, and method of producing thesame | |
AU1140401A (en) | Method for separating adhesive bonded composites | |
EP1381086A4 (en) | Production method for bonded substrates | |
AU5607300A (en) | Adhesive bonding laminates | |
EP1191079B8 (en) | Adhesive resin compositions and method for separating adherends bonded together by the compositions | |
AU4120500A (en) | Contact bonding adhesives | |
AU2002349353A1 (en) | Method for the production of pressure-sensitive adhesive stamped products | |
AU2003256907A1 (en) | High strength pressure sensitive adhesive | |
AU6274199A (en) | Method for the preparation of non-blocking adhesive coated articles and cold seal bonded laminates | |
AU2003301859A1 (en) | Adhesive composition and method of bonding | |
AU2001247378A1 (en) | Method and apparatus for bonding substrates | |
AU5501999A (en) | Hot-melt adhesive element for bonding components using an adhesive layer | |
AU2001231626A1 (en) | Method for testing the bonding strength of an adhesive bond between two thin flat substrates | |
EP1477502A3 (en) | Moisture-reactive hot-melt adhesive | |
AU1015201A (en) | Sprayable dispersion and method for elastic adhesive bonding of two substrate surfaces |