AU2002350152A1 - Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes - Google Patents

Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes

Info

Publication number
AU2002350152A1
AU2002350152A1 AU2002350152A AU2002350152A AU2002350152A1 AU 2002350152 A1 AU2002350152 A1 AU 2002350152A1 AU 2002350152 A AU2002350152 A AU 2002350152A AU 2002350152 A AU2002350152 A AU 2002350152A AU 2002350152 A1 AU2002350152 A1 AU 2002350152A1
Authority
AU
Australia
Prior art keywords
dry
wet
processing apparatus
semiconductor wafers
removing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002350152A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/219,967 external-priority patent/US20040062874A1/en
Application filed by Individual filed Critical Individual
Publication of AU2002350152A1 publication Critical patent/AU2002350152A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AU2002350152A 2001-11-07 2002-11-06 Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes Abandoned AU2002350152A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34600001P 2001-11-07 2001-11-07
US60/346,000 2001-11-07
US10/219,967 US20040062874A1 (en) 2002-08-14 2002-08-14 Nozzle assembly, system and method for wet processing a semiconductor wafer
US10/219,967 2002-08-14
PCT/US2002/035680 WO2003041149A1 (en) 2001-11-07 2002-11-06 Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes

Publications (1)

Publication Number Publication Date
AU2002350152A1 true AU2002350152A1 (en) 2003-05-19

Family

ID=26914443

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002350152A Abandoned AU2002350152A1 (en) 2001-11-07 2002-11-06 Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes

Country Status (3)

Country Link
KR (1) KR20040063920A (en)
AU (1) AU2002350152A1 (en)
WO (1) WO2003041149A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100849366B1 (en) * 2006-08-24 2008-07-31 세메스 주식회사 Apparatus and method for treating substrate
KR100809590B1 (en) * 2006-08-24 2008-03-04 세메스 주식회사 Apparatus and method for treating substrates
KR100780353B1 (en) * 2006-11-27 2007-11-30 삼성전자주식회사 Process for dry cleaning a substrate
US9064807B2 (en) 2013-02-27 2015-06-23 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated platform for improved wafer manufacturing quality
US10770314B2 (en) 2017-05-31 2020-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device, tool, and method of manufacturing

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5868854A (en) * 1989-02-27 1999-02-09 Hitachi, Ltd. Method and apparatus for processing samples
US5227001A (en) * 1990-10-19 1993-07-13 Integrated Process Equipment Corporation Integrated dry-wet semiconductor layer removal apparatus and method
US5171393A (en) * 1991-07-29 1992-12-15 Moffat William A Wafer processing apparatus
TW280083B (en) * 1993-03-04 1996-07-01 Tokyo Electron Co Ltd

Also Published As

Publication number Publication date
WO2003041149A1 (en) 2003-05-15
KR20040063920A (en) 2004-07-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase