AU2002239742A1 - Controlled anneal conductors for integrated circuit interconnects - Google Patents

Controlled anneal conductors for integrated circuit interconnects

Info

Publication number
AU2002239742A1
AU2002239742A1 AU2002239742A AU3974202A AU2002239742A1 AU 2002239742 A1 AU2002239742 A1 AU 2002239742A1 AU 2002239742 A AU2002239742 A AU 2002239742A AU 3974202 A AU3974202 A AU 3974202A AU 2002239742 A1 AU2002239742 A1 AU 2002239742A1
Authority
AU
Australia
Prior art keywords
conductors
integrated circuit
circuit interconnects
controlled anneal
anneal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002239742A
Inventor
Steven C. Avanzino
Minh Van Ngo
Pin-Chin Connie Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2002239742A1 publication Critical patent/AU2002239742A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76883—Post-treatment or after-treatment of the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AU2002239742A 2000-12-20 2001-10-23 Controlled anneal conductors for integrated circuit interconnects Abandoned AU2002239742A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/745,917 2000-12-20
US09/745,917 US6403474B1 (en) 2000-12-20 2000-12-20 Controlled anneal conductors for integrated circuit interconnects
PCT/US2001/050969 WO2002050895A2 (en) 2000-12-20 2001-10-23 Controlled anneal conductors for integrated circuit interconnects

Publications (1)

Publication Number Publication Date
AU2002239742A1 true AU2002239742A1 (en) 2002-07-01

Family

ID=24998778

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002239742A Abandoned AU2002239742A1 (en) 2000-12-20 2001-10-23 Controlled anneal conductors for integrated circuit interconnects

Country Status (4)

Country Link
US (1) US6403474B1 (en)
AU (1) AU2002239742A1 (en)
TW (1) TW552644B (en)
WO (1) WO2002050895A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6656836B1 (en) * 2002-03-18 2003-12-02 Advanced Micro Devices, Inc. Method of performing a two stage anneal in the formation of an alloy interconnect
US6806542B1 (en) * 2003-06-30 2004-10-19 Motorola, Inc. Electronic device having a filled dielectric medium
US9806253B2 (en) 2015-11-16 2017-10-31 Samsung Electronics Co., Ltd. Method for providing a high perpendicular magnetic anisotropy layer in a magnetic junction usable in spin transfer torque magnetic devices using multiple anneals

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5932289A (en) * 1991-05-28 1999-08-03 Trikon Technologies Limited Method for filling substrate recesses using pressure and heat treatment
US5494860A (en) * 1995-03-14 1996-02-27 International Business Machines Corporation Two step annealing process for decreasing contact resistance
US6297154B1 (en) * 1998-08-28 2001-10-02 Agere System Guardian Corp. Process for semiconductor device fabrication having copper interconnects
JP3187011B2 (en) * 1998-08-31 2001-07-11 日本電気株式会社 Method for manufacturing semiconductor device
JP2000223491A (en) * 1999-01-29 2000-08-11 Ulvac Japan Ltd Cu film forming method
EP1069213A3 (en) * 1999-07-12 2004-01-28 Applied Materials, Inc. Optimal anneal technology for micro-voiding control and self-annealing management of electroplated copper

Also Published As

Publication number Publication date
WO2002050895A2 (en) 2002-06-27
TW552644B (en) 2003-09-11
US20020076923A1 (en) 2002-06-20
WO2002050895A3 (en) 2003-04-17
US6403474B1 (en) 2002-06-11

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